KR100219473B1 - 탭리드를 이용한 반도체 장치 및 그 실장방법 - Google Patents
탭리드를 이용한 반도체 장치 및 그 실장방법 Download PDFInfo
- Publication number
- KR100219473B1 KR100219473B1 KR1019930000485A KR930000485A KR100219473B1 KR 100219473 B1 KR100219473 B1 KR 100219473B1 KR 1019930000485 A KR1019930000485 A KR 1019930000485A KR 930000485 A KR930000485 A KR 930000485A KR 100219473 B1 KR100219473 B1 KR 100219473B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- chip
- lead
- chips
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (6)
- 상면의 주변부에 외부와 전기적 접속을 위한 복수의 패드들을 가진 반도체소자와, 상기 반도체소자의 각 패드들과 일단이 본딩되고 타단이 외부 회로기판과의 접속을 위해 일정 방향으로 돌출되는 복수의 리드들이 일면상에 설치된 절연 테이프를 교호로 적층하여서 싱글 인 라인 멀티레이어의 형태로 된 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 각 반도체소자의 하면과 절연 테이프 사이에 절연물질이 형성되어 있는 것을 특징으로 하는 반도체장치.
- 제2항에 있어서, 상기 절연물질은 에폭시인 것을 특징으로 하는 반도체 장치.
- 웨이퍼를 반도체장치가 내장되고 외부와의 전기적 접속을 위한 복수개의 패드가 형성된 칩단위로 절단하는 공정과, 절연테이프 위에 일단이 한방향으로 도출되도록 미리 형서된 복수개의 리드의 타단과 상기 절단된 칩의 각 패드를 테이프 자동본딩(TAB)방식으로 접속시키는 공정과, 상기 리드가 접속된 복수개의 칩을 상기 도출된 리드의 일단이 같은 방향이 되도록 하고 상기 절연테이프를 개재하여 서로 절연되게 적층시키는 공정과, 상기 적층구조의 칩 모듈을 회로기판에 실장하는 공정을 구비하는 것을 특징으로 하는 반도체장치의 실장방법.
- 제4항에 있어서, 상기 리드가 접속된 복수의 칩을 적층시킬 때 칩 사이를 절연물질로 절연시켜 주는 것을 특징으로 하는 반도체장치의 실장방법.
- 제4항에 있어서, 상기 적층구조의 칩 모듈을 회로기판상에 땜납에 의해 실장하는 것을 특징으로 하는 반도체장치의 실장방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930000485A KR100219473B1 (ko) | 1993-01-15 | 1993-01-15 | 탭리드를 이용한 반도체 장치 및 그 실장방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930000485A KR100219473B1 (ko) | 1993-01-15 | 1993-01-15 | 탭리드를 이용한 반도체 장치 및 그 실장방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100219473B1 true KR100219473B1 (ko) | 1999-09-01 |
Family
ID=19349680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930000485A Expired - Fee Related KR100219473B1 (ko) | 1993-01-15 | 1993-01-15 | 탭리드를 이용한 반도체 장치 및 그 실장방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100219473B1 (ko) |
-
1993
- 1993-01-15 KR KR1019930000485A patent/KR100219473B1/ko not_active Expired - Fee Related
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