KR100208704B1 - Robot arm for wafer loading of semiconductor dry etching equipment - Google Patents
Robot arm for wafer loading of semiconductor dry etching equipment Download PDFInfo
- Publication number
- KR100208704B1 KR100208704B1 KR1019960020675A KR19960020675A KR100208704B1 KR 100208704 B1 KR100208704 B1 KR 100208704B1 KR 1019960020675 A KR1019960020675 A KR 1019960020675A KR 19960020675 A KR19960020675 A KR 19960020675A KR 100208704 B1 KR100208704 B1 KR 100208704B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- robot arm
- dry etching
- plate
- support
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000001312 dry etching Methods 0.000 title claims abstract description 16
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 45
- 229920000642 polymer Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
로봇암 상부에 부착된 지지판의 구조를 개선하는 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 관한 것이다.And more particularly to a robotic arm for wafer loading of a semiconductor dry etching facility which improves the structure of a support plate attached to the upper portion of the robot arm.
본 발명은, 웨이퍼를 지지하는 받침부와 로봇몸체에 연결되는 완드 플레이트로 이루어진 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 있어서, 상기 완드 플레이트 상부 표면의 일측에는 웨이퍼의 플랫존영역에 대응하는 형상의 지지면을 가진 제1 지지판이 부착되고 상기 완드 플레이트 상부 표면의 다른 일측에는 상기 웨이퍼의 원주면에 대응하는 형상의 지지면을 가진 제2 지지판이 부착되며, 상기 제1 및 제2 지지판은 상기 지지면에 상기 웨이퍼가 완전밀착되어 지지될 수 있도록 배치됨을 특징으로 한다.A robot arm for wafer loading of a semiconductor dry etching facility, comprising: a support portion for supporting a wafer; and a wand plate connected to the robot body, wherein a shape corresponding to a flat zone region of the wafer is formed on one side of the upper surface of the wand plate, A second support plate having a support surface having a shape corresponding to the circumferential surface of the wafer is attached to the other side of the upper surface of the wand plate, And the wafer is disposed on the support surface so that the wafer can be completely held in close contact with the support surface.
따라서, 식각공정이 진행되는 식각챔버 내부의 스테이지에 웨이퍼가 올바르게 얼라인됨으로 인해서 식각불량이 방지되는 효과가 있다.Therefore, there is an effect that the etching failure can be prevented by properly aligning the wafer on the stage inside the etching chamber where the etching process proceeds.
Description
제1도는 종래의 반도체 건식식각설비의 웨이퍼 로딩용 로봇암이 웨이퍼를 얼라이너에서 얼라인하는 상태를 나타내는 개략적인 도면이다.FIG. 1 is a schematic view showing a state in which a robot arm for loading a wafer in a conventional semiconductor dry etching facility aligns a wafer with an aligner.
제2도는 본 발명에 따른 반도체 건식식각설비의 웨이퍼 로딩용 로봇암이 웨이퍼를 얼라이너에서 얼라인하는 상태를 나타내는 도면이다.FIG. 2 is a view showing a state in which a robot arm for loading a wafer in a semiconductor dry etching facility according to the present invention aligns a wafer with an aligner. FIG.
* 도면의 주요부분에 대한 부호의 설명DESCRIPTION OF THE REFERENCE NUMERALS
10, 32 : 받침부 12, 34 : 완드 플레이트10, 32: receiving portion 12, 34: wand plate
14 : 지지판 16, 30 : 웨이퍼14: support plate 16, 30: wafer
18, 40 : 얼라이너 20, 42 : 고정점18, 40: aligner 20, 42: fixed point
36 : 지지판 A 38 : 지지판 B36: Support plate A 38: Support plate B
40 : 지지면40: Support surface
본 발명은 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 관한 것으로서, 보다 상세하게는 로봇암 상부에 부착된 지지판의 구조를 개선한 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a robot arm for loading a wafer in a semiconductor dry etching facility, and more particularly, to a robot arm for loading a wafer in a semiconductor dry etching facility in which the structure of a support plate attached to a robot arm is improved.
최근에 반도체 소자가 미세화 및 고집적화되고, 반도체 생산이 대량화됨에 따라서 작업자에 의한 웨이퍼의 오염을 방지하고 생산성을 향상시키기 위하여 로봇을 이용하여 반도체 제조공정이 진행된다.2. Description of the Related Art [0002] In recent years, miniaturization and high integration of semiconductor devices have been made, and semiconductor production has been mass-produced, so that a semiconductor manufacturing process is performed using a robot to prevent contamination of wafers by workers and improve productivity.
반도체 건식식각설비에서도 로봇을 이용하여 웨이퍼를 로딩하여 공정이 진행되는데, 반도체 건식식각설비에서 식각공정이 수행되면, 웨이퍼 표면과 식각가스가 반응하여 폴리머가 발생하며, 이러한 폴리머는 공정챔버 내의 웨이퍼 스테이지(Stage) 상에 도포된다.In a semiconductor dry etching facility, a wafer is loaded by using a robot. When an etching process is performed in a semiconductor dry etching facility, the wafer surface and the etching gas react with each other to generate a polymer. The polymer is transferred to a wafer stage (Stage).
따라서, 식각공정이 계속하여 반복적으로 수행되면 스테이지 상의 웨이퍼가 놓이는 부분을 제외한 영역에는 폴리머가 계속 적층되어 스테이지 상에 단차가 형성되어 건식식각설비의 로봇에 의한 웨이퍼의 로딩시 그 위치가 변화하는 경우 식각공정불량을 유발할 수 있다.Therefore, when the etching process is repeatedly performed, the polymer is continuously stacked on the region except the portion where the wafer is placed on the stage, so that a step is formed on the stage, and the position of the wafer is changed when the wafer is loaded by the robot of the dry etching facility It may cause an etching process failure.
제1도는 종래의 반도체 건식식각설비의 웨이퍼 로딩용 로봇암이 웨이퍼를 얼라이너에서 얼라인하는 상태를 나타내는 개략적인 도면이다.FIG. 1 is a schematic view showing a state in which a robot arm for loading a wafer in a conventional semiconductor dry etching facility aligns a wafer with an aligner.
제1도를 참조하면, 로봇암은 웨이퍼(16)를 지지하는 받침부(10)와 로봇 본체와 연결되는 완드 플레이트(Wand plate : 12)로 구성되어 있다.Referring to FIG. 1, the robot arm is composed of a receiving part 10 for supporting the wafer 16 and a wand plate 12 connected to the robot body.
상기 완드 플레이트(12) 상부에는 원기둥형상의 지지판(14)이 4개 돌출되어 원주를 그리며 위치하여 카세트에서 로딩된 웨이퍼(16)를 측면지지하도록 구성되어 있다.Four cylindrical support plates 14 protrude from the upper surface of the wand plate 12 to support the wafer 16 loaded on the cassette.
로봇암의 받침부(10)와 지지판(14)에 의해 지지된 웨이퍼(16)는 얼라이너(18)로 이동되어, 얼라이너(18)의 특정영역에 원주를 그리며 원형돌출된 6개의 고정점(20)과 접촉하면서 얼라인된다.The wafer 16 supported by the support portion 10 of the robot arm and the support plate 14 is moved to the aligner 18 to form six circularly projected fixing points (20).
이때, 고정점(20)은 웨이퍼(16)에 가해지는 충격을 완화하도록 미세하게 움직일 수 있도록 되어 있다.At this time, the fixed point 20 can be moved finely to mitigate the impact applied to the wafer 16.
얼라이너(18)에서 얼라인된 웨이퍼(16)는 식각챔버 내부로 이송되어 식각공정이 이루어진다.The wafer 16 aligned in the aligner 18 is transferred into the etching chamber and etched.
그런데, 상기한 바와 같이, 얼라이너에서 얼라인이 이루어질 때 웨이퍼의 플랫존과 지지판은 밀착되지 않기 때문에 플랫존의 방향이 약간씩 바뀌게 된다.However, as described above, when the alignment is performed in the aligner, since the flat zone of the wafer and the support plate are not in close contact with each other, the direction of the flat zone is slightly changed.
미스얼라인된 웨이퍼는 식각챔버 내부의 스테이지 위에 로딩될 때 폴리머가 축적된 영역에 놓이게 되어 웨이퍼는 수평면에 대해 경사지게 된다.When the misaligned wafer is loaded on the stage inside the etching chamber, the polymer is placed in the accumulated area and the wafer is inclined with respect to the horizontal plane.
따라서, 이 상태에서 식각공정이 진행되면, 웨이퍼의 기울기에 의해서 식각의 균일도가 저하되는 문제점이 있었다.Therefore, when the etching process proceeds in this state, the uniformity of the etching is lowered due to the inclination of the wafer.
본 발명의 목적은, 웨이퍼를 얼라이너에서 얼라인할 때 얼라인불량을 방지하는 반도체 건식식각설비의 웨이퍼 로딩용 로봇암을 제공하는 데 있다.An object of the present invention is to provide a robot arm for wafer loading of a semiconductor dry etching facility which prevents defective alignment when aligning a wafer with an aligner.
상기 목적을 달성하기 위한 본 발명에 따른 반도체 건식식각설비의 웨이퍼 로딩용 로봇암은, 웨이퍼를 지지하는 받침부와 로봇몸체에 연결되는 완드 플레이트로 이루어진 반도체 건식식각설비의 웨이퍼 로딩용 로봇암에 있어서, 상기 완드 플레이트 상부 표면의 일측에는 웨이퍼의 플랫존영역에 대응하는 형상의 지지면을 가진 제1 지지판이 부착되고 상기 완드 플레이트 상부 표면의 다른 일측에는 상기 웨이퍼의 원주면에 대응하는 형상의 지지면을 가진 제2 지지판이 부착되며, 상기 제1 및 제2 지지판은 상기 지지면에 상기 웨이퍼가 완전밀착되어 지지될 수 있도록 배치됨을 특징으로 한다.In order to achieve the above object, there is provided a robot arm for loading wafers in a semiconductor dry etching facility, comprising: a support arm for supporting a wafer; and a wand plate connected to the robot body, A first support plate having a support surface having a shape corresponding to the flat zone area of the wafer is attached to one side of the upper surface of the wand plate and a support plate having a shape corresponding to the circumferential surface of the wafer is provided on the other side of the upper surface of the wand plate. And the first and second support plates are disposed on the support surface so that the wafer can be completely held in close contact with the support plate.
이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제2도는 본 발명에 따른 반도체 건식식각설비의 웨이퍼 로딩용 로봇암이 웨이퍼를 얼라이너에서 얼라인하는 상태를 나타내는 도면이다.FIG. 2 is a view showing a state in which a robot arm for loading a wafer in a semiconductor dry etching facility according to the present invention aligns a wafer with an aligner. FIG.
제2도를 참조하면, 로봇암은 웨이퍼(30)의 하부면을 지지하는 받침부(32)와 상기 받침부(32)로부터 연장되어 로봇 본체와 연결되는 완드 플레이트(34)로 구성되어 있다.Referring to FIG. 2, the robot arm includes a receiving portion 32 for supporting a lower surface of the wafer 30, and a wand plate 34 extending from the receiving portion 32 and connected to the robot body.
상기 완드 플레이트(34) 상부 표면의 일측에는 웨이퍼(30)의 플랫존영역에 대응하는 형상의 지지면(40)을 가진 테프론 재질의 지지판 A(36)가 부착되고 상기 완드 플레이트(34) 상부 표면의 다른 일측에는 상기 웨이퍼(30)의 원주면에 대응하는 형상의 지지면(40)을 가진 테프론 재질의 지지판 B(38)가 부착되어 있다.A teflon support plate A having a supporting surface 40 having a shape corresponding to the flat zone region of the wafer 30 is attached to one side of the upper surface of the wand plate 34, A supporting plate B (38) made of Teflon having a supporting surface (40) having a shape corresponding to the circumferential surface of the wafer (30) is attached to the other side of the wafer (30).
카세트로부터 로봇암의 받침부(32) 위에 로딩된 웨이퍼(30)는 얼라이너(40)로 이동하여 얼라이너(40) 상부 특정영역에 원호를 그리며 원기둥형상으로 돌출된 9개의 고정점(42)과 접촉하여 상기와 같이 얼라인이 진행되면 웨이퍼(30)가 상기 지지면(40)들에 의해 밀착지지되어 웨이퍼가 정확하게 얼라인된다.The wafer 30 loaded on the support portion 32 of the robot arm from the cassette is moved to the aligner 40 and the nine fixed points 42 protruding in the shape of a cylinder, The wafer 30 is supported by the supporting surfaces 40 in a close contact manner, and the wafer is precisely aligned.
얼라인된 웨이퍼(30)는 그 상태를 유지하며 식각챔버 내부의 스테이지로 이동되어 식각공정이 이루어진다.The aligned wafer 30 is maintained in that state and is moved to the stage inside the etching chamber to perform the etching process.
정확하게 얼라인된 웨이퍼는 스테이지 상의 일정위치에 반복적으로 놓이게 되어 폴리머가 적층되는 영역도 일정하게 되어 식각공정시 웨이퍼가 경사지는 일이 없게 된다.The precisely aligned wafer is repeatedly placed at a predetermined position on the stage, so that the region where the polymer is laminated is also constant, so that the wafer does not incline during the etching process.
본 발명에 따라서, 식각공정이 진행되는 식각챔버 내부의 스테이지에 웨이퍼가 올바르게 얼라인됨으로 인해서 식각불량이 방지되는 효과가 있다.According to the present invention, there is an effect that the etching failure can be prevented by properly aligning the wafer on the stage in the etching chamber in which the etching process is performed.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연하다.While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960020675A KR100208704B1 (en) | 1996-06-10 | 1996-06-10 | Robot arm for wafer loading of semiconductor dry etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960020675A KR100208704B1 (en) | 1996-06-10 | 1996-06-10 | Robot arm for wafer loading of semiconductor dry etching equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980005999A KR980005999A (en) | 1998-03-30 |
| KR100208704B1 true KR100208704B1 (en) | 1999-07-15 |
Family
ID=19461371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960020675A KR100208704B1 (en) | 1996-06-10 | 1996-06-10 | Robot arm for wafer loading of semiconductor dry etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100208704B1 (en) |
-
1996
- 1996-06-10 KR KR1019960020675A patent/KR100208704B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR980005999A (en) | 1998-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100207451B1 (en) | Semiconductor wafer fixing apparatus | |
| US5692873A (en) | Apparatus for holding a piece of semiconductor | |
| JP4869533B2 (en) | Apparatus for supporting process chamber and substrate | |
| JP3386986B2 (en) | Plasma processing equipment | |
| US6340639B1 (en) | Plasma process apparatus and plasma process method for substrate | |
| KR101728390B1 (en) | Etching device and plasma processing device | |
| US6767170B2 (en) | Wafer handling system and wafer handling method | |
| JP2821678B2 (en) | Substrate suction device | |
| JPH03270048A (en) | Vacuum chuck | |
| KR100208704B1 (en) | Robot arm for wafer loading of semiconductor dry etching equipment | |
| US6926802B2 (en) | Exhaust ring of dry etching device | |
| JP2001326267A (en) | Semiconductor processing apparatus | |
| CN100405569C (en) | Semiconductor manufacturing device and semiconductor manufacturing method | |
| US20020195058A1 (en) | Apparatus for holding a wafer for use in a process chamber for fabricating a semiconductor device | |
| JPH1015815A (en) | Substrate correction device and its method | |
| KR101395208B1 (en) | Substrate transfer apparatus and substrate aligning method using the same | |
| JP2002299422A (en) | Clamp and semiconductor manufacturing apparatus having the clamp | |
| KR0166215B1 (en) | Independent vacuum wafer holder for semiconductor exposure equipment | |
| KR100581998B1 (en) | Wafer Etching Equipment | |
| KR20010047103A (en) | Apparatus for etching a wafer | |
| KR100943494B1 (en) | Etching Device of Semiconductor Device | |
| KR20050023534A (en) | Lift hoop of ashing chamber in a semiconductor etching apparatus | |
| KR950012741B1 (en) | Method of making a capacitor electrode of dram cell | |
| KR200167581Y1 (en) | Focus ring for plasma etching device | |
| JPS61105854A (en) | Wafer chuck |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19960610 |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19960610 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19990127 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19990416 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 19990417 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20020318 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20030307 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20040308 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20050310 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20060307 Start annual number: 8 End annual number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20070328 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20070328 Start annual number: 9 End annual number: 9 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20090310 |