KR100198512B1 - Lcd 검사용 프로브 블록 - Google Patents
Lcd 검사용 프로브 블록 Download PDFInfo
- Publication number
- KR100198512B1 KR100198512B1 KR1019960002978A KR19960002978A KR100198512B1 KR 100198512 B1 KR100198512 B1 KR 100198512B1 KR 1019960002978 A KR1019960002978 A KR 1019960002978A KR 19960002978 A KR19960002978 A KR 19960002978A KR 100198512 B1 KR100198512 B1 KR 100198512B1
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- lcd
- plate
- probe block
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims abstract description 26
- 238000007689 inspection Methods 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract description 3
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 2
- 239000002356 single layer Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 244000145845 chattering Species 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000015097 nutrients Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
Description
Claims (6)
- 도전성 금속으로 된 접속판(4)의 양측에 경사지는 접촉핀(16)(18)과 완충부(20)(22)를 형성하고, 접촉판(4)과 접촉판(4) 사이에 절연판(6)을 삽입한 다음 체결수단으로 체결하여서 된 LCD 검사용 프로브 블록.
- 제1항에 있어서, 접촉판(4) 사이에 삽입되는 절연판(6)과 접촉판(4)의 몸체와 완충부(20)(22)의 외면을 절연 피복함을 특징으로 하는 LCD 검사용 프로브 블록.
- 제1항 또는 제2항에 있어서, 절연판(6)은 체결압력 정도에 따라 팽창·수축하는 재질로 형성하여 접촉판(4)의 피치간격을 균일하게 조정할 수 있게 함을 특징으로 하는 LCD 검사용 프로브 블록.
- 제1항 또는 제2항에 있어서, 접촉핀(16)(18)과 완충부(20)(22)의 두께는 접촉판(4) 몸체 두께보다 얇게 형성함을 특징으로 하는 LCD 검사용 프로브 블록.
- 제1항에 있어서, 접촉핀(16)(18)의 첨두부(28)(30)은 한 개 이상으로 형성함을 특징으로 하는 LCD 검사용 프로브 블록.
- 제1항에 있어서, 접촉판(4)과 완충부(20)(22)의 경사각도(θ)는 100도 전후로 형성함을 특징으로 하는 LCD 검사용 프로브 블록.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960002978A KR100198512B1 (ko) | 1996-02-06 | 1996-02-06 | Lcd 검사용 프로브 블록 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960002978A KR100198512B1 (ko) | 1996-02-06 | 1996-02-06 | Lcd 검사용 프로브 블록 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970062700A KR970062700A (ko) | 1997-09-12 |
KR100198512B1 true KR100198512B1 (ko) | 1999-06-15 |
Family
ID=19450898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960002978A Expired - Fee Related KR100198512B1 (ko) | 1996-02-06 | 1996-02-06 | Lcd 검사용 프로브 블록 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100198512B1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100545189B1 (ko) * | 2001-11-01 | 2006-01-24 | 주식회사 유림하이테크산업 | 엘시디 검사용 프로브 카드 |
KR100684045B1 (ko) | 2005-08-08 | 2007-02-16 | 주식회사 프로텍 | 액정디스플레이 검사기용 프로브 조립체 |
KR100684046B1 (ko) | 2005-08-08 | 2007-02-16 | 주식회사 프로텍 | 액정디스플레이 검사기용 프로브조립체 |
KR100715492B1 (ko) | 2006-06-05 | 2007-05-07 | (주)엠씨티코리아 | 극미세 피치를 갖는 프로브유니트 및 이를 이용한프로브장치 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100490054B1 (ko) * | 1997-08-25 | 2005-09-05 | 삼성전자주식회사 | 어레이테스터용프로브프레임 |
KR20030020486A (ko) * | 2001-08-29 | 2003-03-10 | 주식회사 유림하이테크산업 | 엘시디 검사용 프로브 카드 |
KR100602154B1 (ko) * | 2006-03-09 | 2006-07-19 | (주)엠씨티코리아 | 평판표시패널 검사용 프로브 장치 |
KR100793637B1 (ko) * | 2006-05-10 | 2008-01-10 | 주식회사 파이컴 | 프로브 유닛 및 이를 포함하는 프로브 장치 |
KR100854757B1 (ko) * | 2007-01-25 | 2008-08-27 | 주식회사 나노픽셀 | 프로브 및 이를 이용한 디스플레이 패널 검사용 프로브블록 |
-
1996
- 1996-02-06 KR KR1019960002978A patent/KR100198512B1/ko not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100545189B1 (ko) * | 2001-11-01 | 2006-01-24 | 주식회사 유림하이테크산업 | 엘시디 검사용 프로브 카드 |
KR100684045B1 (ko) | 2005-08-08 | 2007-02-16 | 주식회사 프로텍 | 액정디스플레이 검사기용 프로브 조립체 |
KR100684046B1 (ko) | 2005-08-08 | 2007-02-16 | 주식회사 프로텍 | 액정디스플레이 검사기용 프로브조립체 |
KR100715492B1 (ko) | 2006-06-05 | 2007-05-07 | (주)엠씨티코리아 | 극미세 피치를 갖는 프로브유니트 및 이를 이용한프로브장치 |
Also Published As
Publication number | Publication date |
---|---|
KR970062700A (ko) | 1997-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19960206 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19980911 Patent event code: PE09021S01D |
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E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19990122 |
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GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19990302 Patent event code: PR07011E01D |
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PR1002 | Payment of registration fee |
Payment date: 19990303 End annual number: 3 Start annual number: 1 |
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PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20020206 Start annual number: 4 End annual number: 4 |
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FPAY | Annual fee payment |
Payment date: 20030211 Year of fee payment: 5 |
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PR1001 | Payment of annual fee |
Payment date: 20030211 Start annual number: 5 End annual number: 5 |
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LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20050111 |