KR0150191B1 - Thermosetting Epoxy Resin Powder Coating - Google Patents
Thermosetting Epoxy Resin Powder CoatingInfo
- Publication number
- KR0150191B1 KR0150191B1 KR1019890020579A KR890020579A KR0150191B1 KR 0150191 B1 KR0150191 B1 KR 0150191B1 KR 1019890020579 A KR1019890020579 A KR 1019890020579A KR 890020579 A KR890020579 A KR 890020579A KR 0150191 B1 KR0150191 B1 KR 0150191B1
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- epoxy resin
- mesh
- powder coating
- weight
- resin powder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
내용없음No content
Description
[발명의 명칭][Name of invention]
열경화성 에폭시 수지 분체도료Thermosetting Epoxy Resin Powder Coating
[발명의 상세한 설명]Detailed description of the invention
본 발명은 열경화성 에폭시 수지 분체도료에 관한 것이다.The present invention relates to a thermosetting epoxy resin powder coating.
열경화성 에폭시 수지 분체 도료는 에폭시 수지, 경화제, 경화촉진제, 무기충진제 등을 혼합한 후 용융 훈련, 냉각, 분쇄등의 공정으로 제조되어 유동침적법, 스프레이법, 정전스프레이법 등의 방법으로 전기, 전자부품의 절연피막용등에 사용되어 오고 있다.Thermosetting epoxy resin powder paint is manufactured by mixing epoxy resin, curing agent, curing accelerator, inorganic filler, etc., and then melting, drilling, cooling, pulverizing, etc. It is used for insulation coating of parts.
그러나 열경화성 에폭시 수지 분체도료를 유동 침적법으로 전기, 전자부품의 절연피막용으로 사용시, 분체도료의 유동성 발량으로 인한 작업 성능의 저하로 각종 불만 제기의 요인이 되었다.However, when thermosetting epoxy resin powder coating is used for the insulation coating of electric and electronic parts by flow deposition method, it has caused various complaints due to the deterioration of the work performance due to the fluidity of powder coating.
본 발명은 열경화성 에폭시 수지 분체도료를 유동 침적법으로 적용시 유동조 내에서 우수한 유동성을 발휘하는 열경화성 에폭시 수지 분체도료의 제공을 목적으로 한다.An object of the present invention is to provide a thermosetting epoxy resin powder coating exhibiting excellent fluidity in a flow tank when the thermosetting epoxy resin powder coating is applied by a flow deposition method.
상기 목적을 달성하고자 본 발명은 에폭시 수지, 경화제, 경화촉진제, 무기충진제를 이용하여 열경화성 에폭시 수지 분체도료를 제조하는 데 있어서, (1)평균분자량 2,000∼5,000의 비스페놀 A형 에폭시 수지, (2) 평균분자량 8,000∼12,000의 비스페놀 A형 에폭시 수지, (3) 경화제, (4) 경화촉진제 및 (5) 무기충진제로 제조된 열경화성 에폭시 수지 분체도료에 관한 것이다.In order to achieve the above object, the present invention is to prepare a thermosetting epoxy resin powder coating using an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, (1) a bisphenol A epoxy resin having an average molecular weight of 2,000 to 5,000, (2) The present invention relates to a thermosetting epoxy resin powder coating made of a bisphenol A epoxy resin having an average molecular weight of 8,000 to 12,000, a curing agent, a curing accelerator, and an inorganic filler.
좀더 상세히 설명하면, 본 발명의 분체도료는 (1) 평균 분자량 2,000∼5,000의 비스페놀 A형 에폭시 수지 50∼90중량%, (2)평균분자량 8,000∼12,000의 비스페놀 A형 에폭시 수지 50∼10중량%를 주제성분으로 하고 이 주제성분에, (3) 경화제 (예를들면, 디시안디아마이드, 페놀수지류, 이미다졸류, 산무수물등)가 상기 주제성분의 100중량부에 대해 0.8∼30중량부, 좀더 적정하기로는 0.8∼20중량부, (4) 경화촉진제 (예를들면, 아민류, 이미다졸류, 유기금속염류, 유기과산화물등)가 상기 주제성분 100중량부에 대해 0.1∼5중량부, 좀더 적정하기로는 0.3∼4중량부, (5) 무기충진제 (예를들면, 실리카, 운모, 탄산칼슘, 알루미나, 수산화알루미늄, 탈크, 고령토등)가 상기 주제성분에 대해 0∼200중량부, 좀더 적정하기로는 25∼100중량부로 제조된 것을 혼합시킨 다음, 용융훈련, 냉각, 분쇄시켜 평균 분자량 4,000∼8,000중량부이며, 입도분포가 다음과 같은 열경화성 에폭시 수지 분체도료에 관한 것이다.In more detail, the powder coating of the present invention is (1) 50 to 90% by weight of bisphenol A type epoxy resin having an average molecular weight of 2,000 to 5,000, (2) 50 to 10% by weight of bisphenol A type epoxy resin having an average molecular weight of 8,000 to 12,000. (3) Curing agent (for example, dicyandiamide, phenol resins, imidazole, acid anhydride, etc.) is 0.8-30 weight part with respect to 100 weight part of said main components to this main component. More suitably, 0.8 to 20 parts by weight, (4) the curing accelerator (for example, amines, imidazoles, organometallic salts, organic peroxides, etc.) 0.1 to 5 parts by weight based on 100 parts by weight of the main component, To further titrate 0.3 to 4 parts by weight, (5) inorganic fillers (eg, silica, mica, calcium carbonate, alumina, aluminum hydroxide, talc, kaolin, etc.) from 0 to 200 parts by weight, To titrate, 25 to 100 parts by weight of the mixture was mixed, followed by melt training and cold Each was pulverized to have an average molecular weight of 4,000 to 8,000 parts by weight, and the particle size distribution relates to the following thermosetting epoxy resin powder coating.
100메시 불통과분 1%이하Less than 1% of 100 mesh pass
100메시 통과 및 140메시 불통과 5%이하100 mesh pass and 140 mesh pass and less than 5%
140메시 통과 및 200메시 불통과 30%이하Passed 140 mesh and failed 200 mesh and less than 30%
200메시 통과 및 230메시 불통과 5%이하Pass 200 mesh and fail 230 mesh 5% or less
230메시 통과 및 325메시 불통과 15%이하Passing 230 mesh and failing 325 mesh, less than 15%
325메시 통과분 44%이하Less than 44% for 325 mesh passage
즉 상기 입도 분포를 가진 분체도료만이 본 발명에서 원하는 유동특성을 발휘할 수가 있다.That is, only the powder coating having the particle size distribution can exhibit the desired flow characteristics in the present invention.
상기에서 본 발명의 분체도료에 있어서, 열경화성 에폭시 분체도료의 평균 분자량이 4,000이하이면 분쇄시파인 그라인딩화 되어 라인에서 작업시 유동성 불량 및 미분날림 현상을 초래 할 수가 있다.In the above-described powder coating of the present invention, when the average molecular weight of the thermosetting epoxy powder coating is 4,000 or less, grinding may be performed during grinding, resulting in poor fluidity and fine powder during work in the line.
또 평균분자량이 8,000이상이 되면 분쇄시 조분 함량과다로 유동성 및 도막형성시의 외관 저하를 초래 할 수가 있다.In addition, when the average molecular weight is 8,000 or more, excessive coarse content during grinding may result in deterioration of fluidity and appearance when forming a coating film.
이상과 같이 평균분자량이 4,000∼8,000이고 그 입도분포가 특정될 경우 본 발명의 열경화성 에폭시 수지 분체도료는 유동 침적법에 의한 전기, 전자 부품의 절연 피막용으로 사용시 우수한 유동성으로 인한 작업성능 및 효율의 극대화를 이룰수 있는 장점이 있다.As described above, when the average molecular weight is 4,000 to 8,000 and the particle size distribution is specified, the thermosetting epoxy resin powder coating of the present invention has excellent workability and efficiency due to excellent fluidity when used for insulating coating of electrical and electronic components by flow deposition method. There is an advantage that can be maximized.
이하 실시예를 통해 본 발명의 제조방법 및 그 작용효과를 구체적으로 설명하기로 한다.Hereinafter will be described in detail the manufacturing method of the present invention and its effects through the following examples.
그러나 다음의 실시예가 본 발명의 범주를 한정하는 것은 아니다.However, the following examples do not limit the scope of the present invention.
[기본실시예]Basic Example
평균분자량 3,000의 비스페놀A형 에폭시 수지(평균에폭시 당량 650, 연화점 80℃) 80중량부, 평균분자량 10,000의 비스페놀 A형 에폭시 수지(평균에폭시당량 1925, 연화점 122℃) 20중량부, 경화제로서 디시안디아마이드(FP-10, 일본 카아바이드사의 상품명) 5.0중량부, 경화촉진제로서 2-메틸이미다졸 0.3중량부 및 무기충진제로 탄산칼슘(하이드로캅90, 옴야사의 상품명, 평균입자크기 1.5㎛) 50중량부를 믹서에서 균일하게 혼합한 후 90∼120℃의 온도로 용융혼련기기에서 용융혼련한 후 냉각(상온)시키고 분쇄시켜 평균분자량 6169의 열경화성 에폭시 수지 분체도료를 제조하였다.80 weight part of bisphenol-A epoxy resin (average epoxy equivalent 650, softening point 80 degreeC) of average molecular weight 3,000, 20 weight part of bisphenol A type epoxy resin (average epoxy equivalent 1925, softening point 122 degreeC) of average molecular weight 10,000, and Dicyandie as a hardening | curing agent 5.0 parts by weight of amide (FP-10, Nippon Carbide Co., Ltd.), 0.3 parts by weight of 2-methylimidazole as a curing accelerator, and calcium carbonate (hydrocap 90, product name of Omya Co., Ltd., average particle size of 1.5 μm) as an inorganic filler After mixing 50 parts by weight uniformly in a mixer, melt kneading in a melt kneading apparatus at a temperature of 90 ~ 120 ℃, cooled (at room temperature) and pulverized to prepare a thermosetting epoxy resin powder coating having an average molecular weight of 6169.
그 다음 후술하는 용융실시예에서 보는 바와 같이 메쉬체를 이용하여 그 입도 크기에 따라 분류하였다.Then, as shown in the melting example described later, it was classified according to the particle size using a mesh body.
[응용실시예-1][Application Example-1]
[응용실시예-2][Application Example-2]
[응용실시예-3][Application Example-3]
[응용실시예-4][Application Example-4]
[유동성 측정][Liquidity measurement]
상기 응용실시예의 입도 분포에 따라 제조된 분말분체도료들에 대해서 유동성을 측정할 목적으로 실험을 하였는데 상기 제조된 분체도료 300g을 지름 100㎜, 높이 200㎜의 유동조에 넣고 2㎏/㎠의 공기압을 공급할 때 유동조내에서 유동하는 분말의 상태를 관찰하여 유동상태가 안정화되면 유동 펙터를 구하였는데 이 유동 펙터를 본 발명의 열경화성 에폭시 수지 분체도료의 유동성 판단 자료로 하였다.The powder powder coatings prepared according to the particle size distribution of the application example were tested for the purpose of measuring fluidity. The flow factor was obtained when the flow condition was stabilized by observing the state of the powder flowing in the flow tank at the time of supplying.
유동 펙터는 아래의 식으로 구했다.The flow factor was obtained by the following equation.
R : 열경화성 에폭시 수지 분체도료의 유동 펙터R: Flow factor of thermosetting epoxy resin powder coating
P : 유동시 30초간 토출된 열경화성 에폭시 수지 분체도료의 량P: amount of thermosetting epoxy resin powder coating discharged for 30 seconds during flow
ho : 유동조 내에서의 최초 열경화성 에폭시 수지 분체도료 높이ho: Initial thermosetting epoxy resin powder coating height in a fluid tank
h11 : 유동조 내에서의 유동식 열경화성 에폭시 수지 분체도료 높이h 1 1: Flowable thermosetting epoxy resin powder coating height in the flow tank
하기 표1에 각각의 응용실시예에서 사용된 분체도료의 유동펙터, 라인작업시의 유동상태, 작업성능 시험결과를 기재하였다.Table 1 below describes the flow factor of the powder coating used in each application example, the flow state during the line work, and the work performance test results.
O : 공기압 공급시 5초 이내 유동 상태 안정화 및 라인에서의 작업 개시O: Stabilize flow state within 5 seconds when supplying air pressure and start work on line
: 공기압 공급시 3초 이내 유동 상태 안정화 및 라인에서의 작업개시: Stabilize flow state within 3 seconds when supplying air pressure and start work on line
X : 공기압 공급시 6초 이후 유동 상태 안정화 및 라인에서의 작업개시X: Stabilize flow after 6 seconds when supplying air pressure and start work on line
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019890020579A KR0150191B1 (en) | 1989-12-30 | 1989-12-30 | Thermosetting Epoxy Resin Powder Coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019890020579A KR0150191B1 (en) | 1989-12-30 | 1989-12-30 | Thermosetting Epoxy Resin Powder Coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910012110A KR910012110A (en) | 1991-08-07 |
| KR0150191B1 true KR0150191B1 (en) | 1998-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019890020579A KR0150191B1 (en) | 1989-12-30 | 1989-12-30 | Thermosetting Epoxy Resin Powder Coating |
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| Country | Link |
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| KR (1) | KR0150191B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010103196A (en) * | 2000-05-04 | 2001-11-23 | 임무현 | Eopoxy resin curing agent having hydroxy group and epoxy resin powder coating composition containing same |
| KR20030097388A (en) * | 2002-06-20 | 2003-12-31 | 건설화학공업(주) | Composite of epoxy, epoxy-polyester type powder coatings Contain thermochromic materials and method of manufacture |
-
1989
- 1989-12-30 KR KR1019890020579A patent/KR0150191B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010103196A (en) * | 2000-05-04 | 2001-11-23 | 임무현 | Eopoxy resin curing agent having hydroxy group and epoxy resin powder coating composition containing same |
| KR20030097388A (en) * | 2002-06-20 | 2003-12-31 | 건설화학공업(주) | Composite of epoxy, epoxy-polyester type powder coatings Contain thermochromic materials and method of manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| KR910012110A (en) | 1991-08-07 |
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