KR0139348B1 - Liquid Crystal Display Panel Manufacturing Method - Google Patents

Abstract

The present invention relates to a method for forming an electrode pad and a thin film transistor of a liquid crystal display panel. The present invention relates to a method for manufacturing a liquid crystal display panel having a switching element arranged in a matrix array, a pixel electrode, a gate and a data electrode pad connected thereto. Forming a gate electrode and a gate line pattern by using a first mask after deposition, and anodizing after anodizing by using a second mask; Depositing an insulating layer and a silicon layer and patterning the third layer using a third mask to form a silicon layer for the switching unit; Depositing an ITO film on the entire surface of the substrate on which the pattern is formed and forming a pixel electrode and a redundant data line using a fourth mask; Forming a contact opening of the gate electrode pad portion by patterning the gate line to expose an end portion of the gate line; Depositing a chromium / aluminum metal for source / drain and patterning the same using a sixth mask to simultaneously form a gate electrode pad, a data electrode pad, and a source / drain electrode line made of chromium / aluminum metal; After the deposition of the protective film on the pattern using a seventh mask and patterning and removing the aluminum on the pad to complete the liquid crystal display panel manufacturing, it is possible to simplify the process by reducing the number of masks to reduce the cost In addition to increasing fish properties, pads are formed of chromium, thereby increasing reliability and realizing a highly reliable liquid crystal display panel.

Description

Liquid Crystal Display Panel Manufacturing Method

1 is a cross-sectional view showing the structure of a liquid crystal display panel according to the prior art;

2 (a) and 2 (b) show the electrode pad portion of the liquid crystal display panel according to the prior art.

2 (a) is a cross-sectional view of the electrode pad portion,

2 (b) is a plan view of FIG. 2 (a),

3 (a) and 3 (b) to 8 (a) and 8 (b) is a process diagram showing the manufacturing process of the electrode pad portion of the liquid crystal display panel according to the present invention,

3 (a) to 8 (a) show a plan view of the liquid crystal display panel,

3 (b) to 8 (b) show cross-sectional views of the liquid crystal display panel.

The present invention relates to a liquid crystal display panel, and more particularly, to an electrode pad and a thin film transistor forming method of a thin film transistor-liquid crystal display (TFT-LCD).

In the image information age, much expectation is gathered in the display device which is the largest person in charge of information transmission. As a result, various flat display devices replacing the cathode ray tube have been developed and are rapidly spreading.

Among them, liquid crystal displays are extremely lightweight, thin, low-cost, low power consumption, and have good matching with integrated circuits. Therefore, the liquid crystal display is expanding its use as a vehicle for a laptop or pocket computer and for color TV images.

Such a liquid crystal display device displays an image using a property of being oriented when a material having dielectric anisotropy is placed on an electric field. It has a structure in which steric or nematic liquid crystal is injected.

In this case, the upper substrate includes a color filter layer, and the lower substrate includes liquid crystal display devices including switching elements and pixel electrodes connected thereto on a transparent glass substrate.

The switch element is usually composed of a thin film transistor and they are arranged in a matrix array, and the drain electrode of the transistor is connected to the pixel electrode to form one liquid crystal panel. In addition, a plurality of gate lines and source lines signal lines of the switching elements are arranged side by side in the vertical and horizontal directions.

Since the gate line and the source line must be connected to a driving circuit for controlling the switching elements on and off, a connecting means for connecting both is required, which is formed at the same time as the line as a pad. Such an integrated liquid crystal panel uses a mask of eight sheets to form a switching element, a pixel electrode, and a pad portion as follows.

FIG. 1 illustrates a cross-sectional structure of the switching element 1 and the ITO pixel electrode 2 connected thereto, and FIG. 2 illustrates that a gate line is extended to connect a pad at an end thereof. FIG. a) shows the cross section of the electrode pad part 3, and FIG. 2 (b) shows the top view of FIG. 2 (a).

Looking at the manufacturing process with reference to the drawings, first by depositing aluminum on the glass substrate 4 using the first mask to form a gate electrode 5 and a gate line pattern 12.

An anodization layer 12 is formed after the anodization pattern so that the connection portion (part a in FIG. 2) of the electrode pad is opened using the second mask.

The electrode pad 13 is formed by applying a metal having a dense material such as chromium or tantalum as shown in FIGS. 2 (a) and 2 (b) using a third mask.

The insulating layer 6 is deposited on the entire surface of the substrate including the pad portion, and the silicon layer 7 and the ohmic layer 8 are formed using a fourth mask, and then the silicon layer 7 and the ohmic layer 8 are patterned. At this time, the insulating layer covers the pad part.

Thereafter, the insulating layer on the pad portion is removed using a fifth mask to form a contact region for connecting with the driving circuit.

The ITO layer is then patterned to form the pixel portion 2 using a sixth mask, and the source / drain electrodes 9 and 10 are patterned using the seventh mask.

Subsequently, after the protective film is deposited on the entire surface of the substrate, the protective film is opened on the contact area of the pad part to open the contact area connected to the driving circuit using the eighth mask.

In manufacturing a liquid crystal panel including a liquid crystal display device, at least eight masks are thus required.

The LCD as such a display device has many advantages in itself, but as described above (using eight masks), the process has a disadvantage in that the cost is high, and thus the research is being conducted in the direction of improving productivity while reducing the cost. The focus is on.

Accordingly, the present invention is to solve the above problems, it is possible to simplify the process by forming a pad portion by using a source / drain metal to provide a liquid crystal display panel manufacturing method that can reduce the cost and increase productivity There is a purpose.

In the liquid crystal display panel manufacturing method according to the present invention for achieving the above object is a method for manufacturing a liquid crystal display panel having a switching element disposed in a matrix array, a pixel front and gate, and a data electrode pad connected thereto;

Depositing aluminum on the substrate to form a gate electrode and a gate line pattern using a first mask,

Anodizing after anodizing patterning using a second mask,

Depositing an insulating layer and a silicon layer and patterning the third layer using a third mask to form a silicon layer for the switching unit;

Depositing an ITO film on the entire surface of the substrate on which the pattern is formed and forming a pixel electrode and a redundant data line using a fourth mask;

Forming a contact opening of the gate electrode pad part by patterning the gate line to expose an end portion of the gate line;

Depositing the first and second metals for the source / drain and patterning the same using a sixth mask to simultaneously form a gate electrode pad, a data electrode pad, and a source / drain electrode line formed of the first and second metals; And

After the deposition of the protective film on the pattern is patterned using a seventh mask and the second metal on the pad portion is removed.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 to 8 illustrate a process of manufacturing a thin film transistor and an electrode pad unit of a liquid crystal display panel according to the present invention.

As mentioned above, the liquid crystal panel has a structure in which unit cells of pixel electrodes connected to the switching elements are arranged in a matrix array, and electrode pad portions for connecting the gate lines and the data source lines drawn from the arrangement are connected to an external driving circuit. .

Referring to the manufacturing method of the liquid crystal display panel having the above structure, first, as shown in FIG. 3, aluminum is deposited on the substrate and then patterned to form the gate electrode and the gate line 100 using a first mask. In this case, FIG. 3 (a) shows the plane of the panel in which the patterned gate line 100 extends to the electrode pad forming portion on the same glass substrate, and FIG. 3 (b) shows its cross section. Anodization patterning is then performed on the patterned aluminum layer to anodize a portion to form an anodization insulating layer 102. 3 (a) and 3 (b) show that the anodization layer 102 is formed on the aluminum gate line 100 as a result. At this time, anodization patterning is formed as a photoresist and prevents Al from anodizing partially during anodization.

Next, as shown in FIGS. 4 (a) and 4 (b), an insulating layer 104 and a semiconductor layer made of amorphous silicon are first formed in the plasma CVD apparatus to form a thin film transistor, which is a switching element arranged in a matrix array. 103), a high concentration impurity semiconductor layer for ohmic contact is sequentially formed; Since the insulating film 104 is applied to the entire surface and formed in the pad part, the insulating film 104 is coated in FIG. 4 (b). However, the ohmic layer is omitted according to FIG. 1 and follows the device formation of FIG. 1. Here, the semiconductor layer and the high concentration impurity semiconductor layer deposited using the third mask are removed, leaving only the switching element formation portion. 4 (a) and 4 (b) show that the semiconductor layer is entirely deposited on the insulating layer 104, but is patterned by the above process.

Thereafter, an ITO film is deposited on the entire surface of the panel on which the pattern is formed, and then patterned using a fourth mask to form a redundant type of pixel electrode 105 and ITO, as shown in FIGS. 5 (a) and 5 (b). Data line 105 'is formed.

Subsequently, as shown in FIGS. 6 (a) and 6 (b), the process of forming contact openings for forming pads is performed. The contact opening 106 is formed by coating a photoresist layer on the entire surface of the substrate, and then removing the film quality exposed by using a fifth mask. At this time, the opening is etched to expose a portion of the end portion of the glass substrate and the aluminum gate line 100. Here, when the photoresist layer is exposed and developed according to a mask pattern to expose the insulating layer 104 in the opening forming portion, when the insulating layer is silicon nitride, it is removed by plasma etching with ammonium fluoride.

The step is a step in which a part of the switching element is formed together with the contact openings of the front and rear pads.

After depositing the chromium / aluminum metal layers 107-2 and 107-1 for the source / drain, the chromium / aluminum layer is formed using the sixth mask as shown in FIGS. 7 (a) and 7 (b). A gate electrode pad, a data electrode pad 107, and a source / drain electrode line made of aluminum are simultaneously formed. That is, the electrode pad is not only in the gate line part but also in the data pad connected to the source line.

Then, a protective film is deposited on the entire surface of the substrate on which the pattern is formed and patterned using a seventh mask. At this time, the protective film is patterned so that the protective film region 108 formed on the pad portion is also removed as shown in FIG. 8 (a). Thereafter, the aluminum 107-1 formed on the pad part is further etched to complete the present process. As a result, it is possible to form a pad portion consisting of only chromium, thereby improving reliability. In addition, the pad portion is also formed at the time of source / drain formation, thereby simplifying the pad factory.

As described above, according to the present invention, since the pad mask is not required separately when forming the pad part, the number of masks can be reduced, thereby simplifying the process, thereby shortening the manufacturing period, reducing materials, and improving productivity. You can get it.

Claims (2)

In the method of manufacturing a liquid crystal display panel having a switching element disposed in a matrix array, a pixel electrode, a gate, and a data electrode pad connected thereto, after depositing aluminum on the substrate, a gate electrode and a gate line pattern are formed using a first mask. Anodizing after anodizing patterning using a second mask; Depositing an insulating layer and a silicon layer and patterning the third layer using a third mask to form a silicon layer for the switching unit; Depositing an ITO film on the entire surface of the substrate on which the pattern is formed and forming a pixel electrode and a redundant data line using a fourth mask; Forming a contact opening of the gate electrode pad part by patterning the gate line to expose an end portion of the gate line; Depositing the first and second metals for the source / drain and patterning the same using a sixth mask to simultaneously form a gate electrode pad, a data electrode pad, and a source / drain electrode line formed of the first and second metals; And removing the second metal on the pad part after patterning using a seventh mask after depositing a protective film on the pattern. The method of claim 1, wherein the first metal and the second metal are formed of chromium and aluminum.