KR0119089Y1 - Ball grid array semiconductor device - Google Patents
Ball grid array semiconductor deviceInfo
- Publication number
- KR0119089Y1 KR0119089Y1 KR2019940039545U KR19940039545U KR0119089Y1 KR 0119089 Y1 KR0119089 Y1 KR 0119089Y1 KR 2019940039545 U KR2019940039545 U KR 2019940039545U KR 19940039545 U KR19940039545 U KR 19940039545U KR 0119089 Y1 KR0119089 Y1 KR 0119089Y1
- Authority
- KR
- South Korea
- Prior art keywords
- grid array
- ball grid
- semiconductor device
- lead frame
- array semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000002787 reinforcement Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49586—Insulating layers on lead frames
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 고안은 볼 그리드 어레이 반도체 장치에 관한 것으로, 볼 그리드 어레이용 리드 프레임 제작시 보강판을 형성시켜 휨을 방지하고, 열 방출이 용이하도록 하는 것인데, 특히 리드 프레임내에 인서트된 대각선타입의 보강판은 리드 프레임의 형태를 유지시킬 수있어 인쇄회로 기판에 마운트시 장착 높이가 유지됨에 따라 열 방출이 잘되고, 또한 수분으로부터 칩을 보호할 수 있고 리드 프레임밖으로 확장되어 돌출된 보강판도 열 방출이 용이하도록 하는 역활을 하는 것이다.The present invention relates to a ball grid array semiconductor device, to form a reinforcement plate when manufacturing a lead frame for a ball grid array to prevent warpage and to facilitate heat dissipation. Particularly, a diagonal reinforcement plate inserted into a lead frame is a lead. The shape of the frame can be maintained so that the mounting height is maintained when mounted on the printed circuit board, and heat dissipation is good, and also the chip can be protected from moisture, and the reinforcement plate protruding out of the lead frame also facilitates heat dissipation. To do.
Description
제1도는 종래의 볼 그리드 어레이 반도체 장치의 단면도,1 is a cross-sectional view of a conventional ball grid array semiconductor device,
제2도는 본 고안의 볼 그리드 어레이 반도체 장치의 단면도,2 is a cross-sectional view of the ball grid array semiconductor device of the present invention,
제3도는 본 고안의 볼 그리드 어레이 반도체 장치의 몰드수지를 생략한 상태의 평면도이다.3 is a plan view of a state in which the mold resin of the ball grid array semiconductor device of the present invention is omitted.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 인캡슬레이션2 : 리드 프레임1: Encapsulation 2: Lead frame
3 : 볼4 : 보강판3: ball 4: reinforcement plate
4' : 열 방출 겸용 보강판4 ': heat dissipation reinforcement plate
본 고안은 볼 그리드 어레이(BALL GRID ARRAY : 이하 BGA라 칭함) 반도체 장치에 관한 것으로, 볼 그리드 어레이용 리드 프레임 제작시 보강판을 형성시켜 휨을 방지하고 열 방출이 용이하도록 한 것이다.The present invention relates to a ball grid array (hereinafter referred to as BGA) semiconductor device, to form a reinforcement plate when manufacturing a lead frame for a ball grid array to prevent warpage and to facilitate heat dissipation.
일반적으로 볼 그리드 어레이용 패키지가 완성되기 까지의 공정을 살펴보면, 볼 그리드 어레이용 리드프레임을 제작하고 다이 어태치(DIE ATTACH)를 한후에 와이어 본딩(WIRE BONDING)을 하고 몰딩(MOLDING)을 하고 솔더 볼 랜딩(SOLDER BALL LANDING)을 한후에 솔더 볼을 마운트를 하여 하나의 패키지를 완성한다.In general, the process from the completion of the ball grid array package is completed. After manufacturing the lead frame for the ball grid array, the die attach, the wire bonding, the molding, and the solder ball are performed. After SOLDER BALL LANDING, solder balls are mounted to complete one package.
상기의 볼 그리드 어레이용 리드 프레임은 칩을 부착하기 위한 패드부와 와이어 본딩을 위한 본딩 패드부와 솔더 볼 랜딩부로 포함하여 구성된 기판형태를 이룬다.The lead frame for the ball grid array has a substrate form including pads for attaching chips, bonding pads for wire bonding, and solder ball landings.
그러나 이러한 기판을 사용한 볼 그리드 어레이 패키지는 인쇄 회로 기판에 마운트시 장착 높이 유지가 어려워 열방출이 잘되지 않고, 솔더 볼 마운트 시에 고열(약 260℃)에 의한 패키지 손상이 발생하는 문제점이 있다.However, the ball grid array package using the substrate has a problem in that it is difficult to maintain the mounting height when mounted on the printed circuit board, and heat dissipation is difficult, and package damage due to high heat (about 260 ° C.) occurs during solder ball mounting.
또한 몰딩 공정을 거쳐 인캡슐레이션(1)된 상태가 제1도와 같이 휨 현상이 발생하기도 하여 인쇄회로 기판에 솔더 볼(3)을 마운트시 장착 높이가 일정치않아 열 방출이 용이하지 않으며 수분이 쉽게 침투하여 불량이 발생할 확률이 대단히 높다.In addition, when the encapsulation (1) is subjected to the molding process as shown in FIG. 1, warpage may occur, and when mounting the solder ball 3 on the printed circuit board, the mounting height is not constant, and heat dissipation is not easy. It is very easy to penetrate and cause defects.
본 고안은 이를 해결하고자 하는 것으로 형태의 보존과 열 방출이 용이하도록 보강판을 리드 프레임내에 인서트(INSERT)뿐만아니라 리드 프레임밖으로까지 확장하여 돌출하도록 제작한다.The present invention aims to solve this problem, and the reinforcement plate is manufactured to protrude out of the lead frame as well as the insert in the lead frame to facilitate the preservation of shape and heat dissipation.
이하 도면을 참조하여 상세히 설명하면 다음과 같다.When described in detail with reference to the drawings as follows.
제2도는 본 고안의 단면도로서, 종래의 볼 그리드 어레이 반도체 장치와 비교시 리드 프레임(2)내에 보강판(4)이 인서트되어 있고, 그럼으로써 볼 그리드 어레이 반도체 장치의 휨 현상이 제거되고, 리드 프레임(2) 밖으로 돌출된 보강판(4')이 열 방출을 용이하도록 함으로써 제품의 질을 향상시킬 수 있는 것이다.2 is a cross-sectional view of the present invention, in which the reinforcing plate 4 is inserted into the lead frame 2 as compared with the conventional ball grid array semiconductor device, thereby eliminating the warpage phenomenon of the ball grid array semiconductor device, and The reinforcing plate 4 'protruding out of the frame 2 can improve the quality of the product by facilitating heat dissipation.
제3도는 본 고안의 평면도로써, 볼 그리드 어레이용 리드 프레임(2)에 보강판(4)이 어떤 패턴으로 형성되어 있는 가를 보여주는 것이다.3 is a plan view showing the reinforcing plate 4 formed in the lead frame 2 for the ball grid array in a pattern.
이 도면을 통해서 볼때 보강판(4)을 리드 프레임보다 크게 제작하여 리드 프레임밖으로 까지 돌출부가 형성되게끔 하는 것이다.Through this view, the reinforcing plate 4 is made larger than the lead frame so that the protrusion is formed out of the lead frame.
이때 리드 프레임내에 인서트되어 있는 보강판(4)은 칩 어태치 부위를 제외한 대각선 타입(X자형)을 가지는데, 이는 리드 프레임(2)의 형태를 최대한 유지시키기 위함이다.At this time, the reinforcing plate 4 inserted in the lead frame has a diagonal type (X-shape) except for the chip attach region, in order to maintain the shape of the lead frame 2 as much as possible.
이때 본 고안의 보강판(4)은 대각선 타입(X자형)을 설명하였는 바, 보강판(4)이 삽입되는 볼 그리드 어레이용 리드 프레임(2)의 패턴 부위를 제외한 위치에 설치함이 바람직하고, 필요에 따라 칩 어태치 공 및 패턴용 쓰루홀을 형성한 판상으로 설치할 수도 있다. 이는 패턴이 형성되어도 보강판(4)이 부도체이므로 패턴이 유지되는 것으로, 보강판(4)의 재질로는 합성수지 등을 예시할 수 있다.At this time, the reinforcing plate 4 of the present invention has been described as a diagonal type (X-shaped), it is preferable to install at a position except for the pattern portion of the lead frame 2 for the ball grid array into which the reinforcing plate 4 is inserted, If necessary, it may be provided in a plate shape in which a chip attach ball and a pattern through hole are formed. This is because the reinforcement plate 4 is a non-conductor even if the pattern is formed, the pattern is maintained, and the material of the reinforcement plate 4 may include synthetic resin.
이상과 같이 본 고안은 볼 그리드 어레이용 리드 프레임(2)내에 보강판(4)을 인서트하므로써 휨 현상을 방지하고 그로인해 인쇄회로 기판에 마운트시 장착높이가 유지되어 수분으로부터 보호할 수있고, 열방출이 잘되어 신뢰성이 양호해지고 리드 프레임(2) 밖으로까지 확장하여 돌출부를 형성함으로써, 열 방출이 용이하도록 하는 것이다.As described above, the present invention prevents warpage by inserting the reinforcing plate 4 in the lead frame 2 for the ball grid array, thereby preventing the moisture from being maintained when the mounting height is maintained when mounted on the printed circuit board. It is well discharged so that the reliability is good, and it extends out of the lead frame 2 to form protrusions, thereby facilitating heat release.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940039545U KR0119089Y1 (en) | 1994-12-31 | 1994-12-31 | Ball grid array semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940039545U KR0119089Y1 (en) | 1994-12-31 | 1994-12-31 | Ball grid array semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960025528U KR960025528U (en) | 1996-07-22 |
| KR0119089Y1 true KR0119089Y1 (en) | 1998-07-01 |
Family
ID=19405617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940039545U KR0119089Y1 (en) | 1994-12-31 | 1994-12-31 | Ball grid array semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0119089Y1 (en) |
-
1994
- 1994-12-31 KR KR2019940039545U patent/KR0119089Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960025528U (en) | 1996-07-22 |
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