JPWO2023281778A1 - - Google Patents

Info

Publication number: JPWO2023281778A1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2023533047A

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-07-09

Filing date

2022-01-14

Publication date

2023-01-12

2022-01-14 Application filed filed Critical

2023-01-12 Publication of JPWO2023281778A1 publication Critical patent/JPWO2023281778A1/ja

Status Pending legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
General Chemical & Material Sciences (AREA)
Electroplating Methods And Accessories (AREA)
Manufacturing Of Printed Wiring (AREA)
Laminated Bodies (AREA)

JP2023533047A 2021-07-09 2022-01-14 Pending JPWO2023281778A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2021114585		2021-07-09
PCT/JP2022/001221 WO2023281778A1 (en)	2021-07-09	2022-01-14	Surface-treated copper foil, copper-clad laminate board, and printed wiring board

Publications (1)

Publication Number	Publication Date
JPWO2023281778A1 true JPWO2023281778A1 (en)	2023-01-12

Family

ID=84800489

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2023533047A Pending JPWO2023281778A1 (en)	2021-07-09	2022-01-14

Country Status (5)

Country	Link
JP (1)	JPWO2023281778A1 (en)
KR (1)	KR20230121117A (en)
CN (1)	CN116710601A (en)
TW (1)	TW202302917A (en)
WO (1)	WO2023281778A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2010061736A1 (en) *	2008-11-25	2010-06-03	日鉱金属株式会社	Copper foil for printed circuit
WO2011138876A1 (en) *	2010-05-07	2011-11-10	Jx日鉱日石金属株式会社	Copper foil for printed circuit
JP2014152352A (en) *	2013-02-06	2014-08-25	Sh Copper Products Corp	Composite copper foil and production method thereof
WO2017006739A1 (en) *	2015-07-03	2017-01-12	三井金属鉱業株式会社	Roughened copper foil, copper-clad laminate and printed wiring board
JP2017036495A (en) *	2015-08-06	2017-02-16	Ｊｘ金属株式会社	Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP2020128589A (en) *	2019-02-01	2020-08-27	長春石油化學股▲分▼有限公司	Surface treated copper foil
WO2020196265A1 (en) *	2019-03-26	2020-10-01	古河電気工業株式会社	Surface-treated copper foil, and copper-cladded laminate sheet and printed wiring board each using same
WO2021117339A1 (en) *	2019-12-13	2021-06-17	Ｊｘ金属株式会社	Surface-treated copper foil, copper-clad laminate plate, and printed wiring board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2012112009A (en)	2010-11-26	2012-06-14	Hitachi Cable Ltd	Copper foil, and method for producing copper foil

2022
- 2022-01-14 KR KR1020237023854A patent/KR20230121117A/en active Pending
- 2022-01-14 JP JP2023533047A patent/JPWO2023281778A1/ja active Pending
- 2022-01-14 TW TW111101717A patent/TW202302917A/en unknown
- 2022-01-14 CN CN202280009868.0A patent/CN116710601A/en active Pending
- 2022-01-14 WO PCT/JP2022/001221 patent/WO2023281778A1/en active Application Filing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2010061736A1 (en) *	2008-11-25	2010-06-03	日鉱金属株式会社	Copper foil for printed circuit
WO2011138876A1 (en) *	2010-05-07	2011-11-10	Jx日鉱日石金属株式会社	Copper foil for printed circuit
JP2014152352A (en) *	2013-02-06	2014-08-25	Sh Copper Products Corp	Composite copper foil and production method thereof
WO2017006739A1 (en) *	2015-07-03	2017-01-12	三井金属鉱業株式会社	Roughened copper foil, copper-clad laminate and printed wiring board
JP2017036495A (en) *	2015-08-06	2017-02-16	Ｊｘ金属株式会社	Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP2020128589A (en) *	2019-02-01	2020-08-27	長春石油化學股▲分▼有限公司	Surface treated copper foil
WO2020196265A1 (en) *	2019-03-26	2020-10-01	古河電気工業株式会社	Surface-treated copper foil, and copper-cladded laminate sheet and printed wiring board each using same
WO2021117339A1 (en) *	2019-12-13	2021-06-17	Ｊｘ金属株式会社	Surface-treated copper foil, copper-clad laminate plate, and printed wiring board

Also Published As

Publication number	Publication date
WO2023281778A1 (en)	2023-01-12
KR20230121117A (en)	2023-08-17
TW202302917A (en)	2023-01-16
CN116710601A (en)	2023-09-05

Publication	Publication Date	Title
BR112023005462A2 (en)	2023-05-30
BR112023012656A2 (en)	2023-10-03
BR112021014123A2 (en)	2021-12-07
BR112022009896A2 (en)	2023-06-27
BR112023009656A2 (en)	2023-07-11
BR112023008622A2 (en)	2023-10-03
BR112022024743A2 (en)	2023-06-27
BR112022026905A2 (en)	2023-06-27
BR112023011738A2 (en)	2023-07-04
BR112023004146A2 (en)	2023-06-27
BR112023006729A2 (en)	2023-05-16
BR102021018859A2 (en)	2021-11-30
BR102021015500A2 (en)	2021-11-09
BR112021017747A2 (en)	2023-06-06
BR102021007058A2 (en)	2021-11-23
BR102020022030A2 (en)	2021-10-05
BR112023016292A2 (en)	2023-09-05
BR112023011539A2 (en)	2023-07-04
BR112023011610A2 (en)	2023-07-04
BR112023008976A2 (en)	2023-06-27
BR102021020147A2 (en)	2021-12-28
BR102021018926A2 (en)	2021-11-30
BR102021018167A2 (en)	2021-09-13
BR102021017576A2 (en)	2021-11-30
BR102021016837A2 (en)	2021-11-09

Legal Events

Date	Code	Title	Description
2024-01-30	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240130
2025-04-01	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250401
2025-05-15	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250515

Date

Code

Title

Description

2024-01-30

A621

Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240130

2025-04-01

A131

Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250401

2025-05-15

A521

Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250515