JPWO2023054318A1 - - Google Patents
Info
- Publication number
- JPWO2023054318A1 JPWO2023054318A1 JP2023551504A JP2023551504A JPWO2023054318A1 JP WO2023054318 A1 JPWO2023054318 A1 JP WO2023054318A1 JP 2023551504 A JP2023551504 A JP 2023551504A JP 2023551504 A JP2023551504 A JP 2023551504A JP WO2023054318 A1 JPWO2023054318 A1 JP WO2023054318A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159601 | 2021-09-29 | ||
| PCT/JP2022/035847 WO2023054318A1 (en) | 2021-09-29 | 2022-09-27 | Method for producing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054318A1 true JPWO2023054318A1 (en) | 2023-04-06 |
Family
ID=85782709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551504A Pending JPWO2023054318A1 (en) | 2021-09-29 | 2022-09-27 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023054318A1 (en) |
| TW (1) | TW202333211A (en) |
| WO (1) | WO2023054318A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240218214A1 (en) * | 2022-12-30 | 2024-07-04 | Pancolour Ink Co., Ltd. | Sacrificial glue composition |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250735A (en) * | 2006-03-15 | 2007-09-27 | Sekisui Chem Co Ltd | Method of stripping adhesive tape |
| JP5386232B2 (en) * | 2009-05-26 | 2014-01-15 | 日東電工株式会社 | UV irradiation equipment |
| JP5689336B2 (en) * | 2011-03-03 | 2015-03-25 | 日東電工株式会社 | Heat release type adhesive sheet |
| JP7681516B2 (en) * | 2019-12-11 | 2025-05-22 | リンテック株式会社 | Adhesive sheet and method for manufacturing semiconductor device |
-
2022
- 2022-09-27 WO PCT/JP2022/035847 patent/WO2023054318A1/en active Application Filing
- 2022-09-27 JP JP2023551504A patent/JPWO2023054318A1/ja active Pending
- 2022-09-28 TW TW111136761A patent/TW202333211A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202333211A (en) | 2023-08-16 |
| WO2023054318A1 (en) | 2023-04-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250630 |