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JPWO2022163027A1 - - Google Patents

Info

Publication number
JPWO2022163027A1
JPWO2022163027A1 JP2022578044A JP2022578044A JPWO2022163027A1 JP WO2022163027 A1 JPWO2022163027 A1 JP WO2022163027A1 JP 2022578044 A JP2022578044 A JP 2022578044A JP 2022578044 A JP2022578044 A JP 2022578044A JP WO2022163027 A1 JPWO2022163027 A1 JP WO2022163027A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022578044A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022163027A1 publication Critical patent/JPWO2022163027A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022578044A 2021-01-26 2021-10-14 Pending JPWO2022163027A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021010355 2021-01-26
PCT/JP2021/038059 WO2022163027A1 (en) 2021-01-26 2021-10-14 Thermally conductive adhesive agent composition, adhesive sheet, and production method therefor

Publications (1)

Publication Number Publication Date
JPWO2022163027A1 true JPWO2022163027A1 (en) 2022-08-04

Family

ID=82654309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022578044A Pending JPWO2022163027A1 (en) 2021-01-26 2021-10-14

Country Status (5)

Country Link
JP (1) JPWO2022163027A1 (en)
KR (1) KR20230133269A (en)
CN (1) CN115989293A (en)
TW (1) TW202229497A (en)
WO (1) WO2022163027A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023139588A1 (en) * 2022-01-23 2023-07-27 B.G. Negev Technologies And Applications Ltd., At Ben-Gurion University Laser-induced graphene composite adhesive tape
JP2024121568A (en) 2023-02-27 2024-09-06 リンテック株式会社 Adhesive sheet and method for producing same
KR20240133547A (en) 2023-02-27 2024-09-04 린텍 가부시키가이샤 Thermally conductive adhesive composition, adhesive sheet and manufacturing method thereof
CN117070166B (en) * 2023-08-08 2024-04-02 德州科顺建筑材料有限公司 Adhesive layer composition, polyolefin waterproof coiled material, and preparation method and application thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012060468A1 (en) * 2010-11-04 2012-05-10 日本電気株式会社 Manufacturing method for graphene substrate, and graphene substrate
US8980217B2 (en) * 2010-12-21 2015-03-17 Nec Corporation Method of manufacturing graphene substrate, and graphene substrate
JP2015067713A (en) 2013-09-28 2015-04-13 株式会社日本触媒 Heat release sheet
JP6679839B2 (en) * 2014-05-09 2020-04-15 Dic株式会社 Adhesive tape, manufacturing method thereof, and heat dissipation film
WO2015181982A1 (en) * 2014-05-30 2015-12-03 グラフェンプラットフォーム株式会社 Graphene composition and graphene molded article
JP2016162929A (en) 2015-03-03 2016-09-05 株式会社デンソー Heat dissipation grease, and semiconductor cooling structure using the same
JP6723603B2 (en) * 2016-08-29 2020-07-15 国立大学法人 筑波大学 Method for producing multilayer graphene and multilayer graphene laminate
CN110951409A (en) * 2019-12-18 2020-04-03 常州瑞联新材料有限公司 Graphene-based heat-conducting flame-retardant adhesive tape and preparation method thereof

Also Published As

Publication number Publication date
TW202229497A (en) 2022-08-01
KR20230133269A (en) 2023-09-19
WO2022163027A1 (en) 2022-08-04
CN115989293A (en) 2023-04-18

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240716