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JPWO2022009409A1 - - Google Patents

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Publication number
JPWO2022009409A1
JPWO2022009409A1 JP2022534612A JP2022534612A JPWO2022009409A1 JP WO2022009409 A1 JPWO2022009409 A1 JP WO2022009409A1 JP 2022534612 A JP2022534612 A JP 2022534612A JP 2022534612 A JP2022534612 A JP 2022534612A JP WO2022009409 A1 JPWO2022009409 A1 JP WO2022009409A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022534612A
Other languages
Japanese (ja)
Other versions
JP7510505B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022009409A1 publication Critical patent/JPWO2022009409A1/ja
Application granted granted Critical
Publication of JP7510505B2 publication Critical patent/JP7510505B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022534612A 2020-07-10 2020-07-10 Component Mounting Equipment Active JP7510505B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/026977 WO2022009409A1 (en) 2020-07-10 2020-07-10 Component mounting device

Publications (2)

Publication Number Publication Date
JPWO2022009409A1 true JPWO2022009409A1 (en) 2022-01-13
JP7510505B2 JP7510505B2 (en) 2024-07-03

Family

ID=79552373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534612A Active JP7510505B2 (en) 2020-07-10 2020-07-10 Component Mounting Equipment

Country Status (2)

Country Link
JP (1) JP7510505B2 (en)
WO (1) WO2022009409A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025088736A1 (en) * 2023-10-25 2025-05-01 ヤマハ発動機株式会社 Component mounting apparatus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313838A (en) * 2005-05-09 2006-11-16 Juki Corp Component mounting equipment
JP2007189041A (en) * 2006-01-13 2007-07-26 Juki Corp Method for simultaneously sucking electronic components in mounting apparatus and method for determining whether simultaneous suction is possible
JP2007220836A (en) * 2006-02-16 2007-08-30 Juki Corp Electronic component mounting equipment
JP2011029253A (en) * 2009-07-22 2011-02-10 Panasonic Corp Component mounting machine and method of inspecting suction unit
WO2014080472A1 (en) * 2012-11-21 2014-05-30 富士機械製造株式会社 Electronic-circuit-component-mounting head
JP2016082087A (en) * 2014-10-17 2016-05-16 パナソニックIpマネジメント株式会社 Electronic component mounting method
WO2017029704A1 (en) * 2015-08-18 2017-02-23 富士機械製造株式会社 Component mounting device
JP2019216129A (en) * 2018-06-11 2019-12-19 パナソニックIpマネジメント株式会社 Component mounting device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313838A (en) * 2005-05-09 2006-11-16 Juki Corp Component mounting equipment
JP2007189041A (en) * 2006-01-13 2007-07-26 Juki Corp Method for simultaneously sucking electronic components in mounting apparatus and method for determining whether simultaneous suction is possible
JP2007220836A (en) * 2006-02-16 2007-08-30 Juki Corp Electronic component mounting equipment
JP2011029253A (en) * 2009-07-22 2011-02-10 Panasonic Corp Component mounting machine and method of inspecting suction unit
WO2014080472A1 (en) * 2012-11-21 2014-05-30 富士機械製造株式会社 Electronic-circuit-component-mounting head
JP2016082087A (en) * 2014-10-17 2016-05-16 パナソニックIpマネジメント株式会社 Electronic component mounting method
WO2017029704A1 (en) * 2015-08-18 2017-02-23 富士機械製造株式会社 Component mounting device
JP2019216129A (en) * 2018-06-11 2019-12-19 パナソニックIpマネジメント株式会社 Component mounting device

Also Published As

Publication number Publication date
JP7510505B2 (en) 2024-07-03
WO2022009409A1 (en) 2022-01-13

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