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JPS649696A - Resin molding with circuit - Google Patents

Resin molding with circuit

Info

Publication number
JPS649696A
JPS649696A JP16399587A JP16399587A JPS649696A JP S649696 A JPS649696 A JP S649696A JP 16399587 A JP16399587 A JP 16399587A JP 16399587 A JP16399587 A JP 16399587A JP S649696 A JPS649696 A JP S649696A
Authority
JP
Japan
Prior art keywords
resin molded
substrate
circuit
window
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16399587A
Other languages
Japanese (ja)
Other versions
JPH0744347B2 (en
Inventor
Masayuki Isawa
Akira Hasegawa
Takahiro Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP16399587A priority Critical patent/JPH0744347B2/en
Publication of JPS649696A publication Critical patent/JPS649696A/en
Publication of JPH0744347B2 publication Critical patent/JPH0744347B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PURPOSE:To obtain a resin molded form with a circuit which is stable in quality, by integrally providing a flat resin molded substrate on one surface of a printed circuit film, and mounting electronic components on the other surface thereof. CONSTITUTION:A circuit substrate 12 is attached to an FPC 15 having a predetermined circuit pattern in the metal mold 14, injection molding of a resin is performed, and electronic components 17 are mounted on the opposite surface by a surface mounting method. And a resin molded frame 13, in the shape of a case, has a window 18 formed in the bottom thereof, and the size of the window 18 is such that a resin molded substrate 16 is exactly fitted into. After the resin molded substrate 16 of the circuit substrate 12 is fitted into the window 18 of the resin molded frame 13 and the engaging parts of both are fixed by a bonding agent or the like, the FPC 15 is fixed to the inner surface of the case consisting of the resin molded frame 13 and the resin molded substrate 16, whereby a resin molded form 11 can be formed in which the electronic components 17 are mounted.
JP16399587A 1987-07-02 1987-07-02 Resin molded product with circuit Expired - Fee Related JPH0744347B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16399587A JPH0744347B2 (en) 1987-07-02 1987-07-02 Resin molded product with circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16399587A JPH0744347B2 (en) 1987-07-02 1987-07-02 Resin molded product with circuit

Publications (2)

Publication Number Publication Date
JPS649696A true JPS649696A (en) 1989-01-12
JPH0744347B2 JPH0744347B2 (en) 1995-05-15

Family

ID=15784757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16399587A Expired - Fee Related JPH0744347B2 (en) 1987-07-02 1987-07-02 Resin molded product with circuit

Country Status (1)

Country Link
JP (1) JPH0744347B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053390A (en) * 1991-06-24 1993-01-08 Mitsubishi Electric Corp Electronic equipment and its manufacture
JP2003230254A (en) * 2002-01-30 2003-08-15 Matsushita Electric Ind Co Ltd Current detector for air conditioner
JP2008524538A (en) * 2004-12-22 2008-07-10 ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング Control module
JP2015103624A (en) * 2013-11-22 2015-06-04 帝国通信工業株式会社 Structure for fixing base of flexible circuit board
CN111446585A (en) * 2019-01-16 2020-07-24 北京小米移动软件有限公司 USB waterproof construction and terminal equipment with same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053390A (en) * 1991-06-24 1993-01-08 Mitsubishi Electric Corp Electronic equipment and its manufacture
JP2003230254A (en) * 2002-01-30 2003-08-15 Matsushita Electric Ind Co Ltd Current detector for air conditioner
JP2008524538A (en) * 2004-12-22 2008-07-10 ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング Control module
JP2015103624A (en) * 2013-11-22 2015-06-04 帝国通信工業株式会社 Structure for fixing base of flexible circuit board
CN111446585A (en) * 2019-01-16 2020-07-24 北京小米移动软件有限公司 USB waterproof construction and terminal equipment with same

Also Published As

Publication number Publication date
JPH0744347B2 (en) 1995-05-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees