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JPS6489526A - Manufacture of tape carrier - Google Patents

Manufacture of tape carrier

Info

Publication number
JPS6489526A
JPS6489526A JP62246745A JP24674587A JPS6489526A JP S6489526 A JPS6489526 A JP S6489526A JP 62246745 A JP62246745 A JP 62246745A JP 24674587 A JP24674587 A JP 24674587A JP S6489526 A JPS6489526 A JP S6489526A
Authority
JP
Japan
Prior art keywords
film
hole
conductive paste
etching
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62246745A
Other languages
Japanese (ja)
Inventor
Yoshihiro Namikawa
Kazuhiro Furukawa
Katsuo Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62246745A priority Critical patent/JPS6489526A/en
Publication of JPS6489526A publication Critical patent/JPS6489526A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To allow an inexpensive, easy, and reliable formation of a bump consisting of a conductive paste on the back side of an inner lead by boring a hole in a substrate film, and injecting an inexpensive conductive paste into the hole capped with a copper film, and hardening such paste. CONSTITUTION:An etching mask 13 is formed on the film face of a flexible film 11, one face of which is coated with copper. By etching the flexible film 11 by chemical etching, a hole 14 which is capped with the copper film is formed. Then a conductive paste is filled in the hole 14 and hardened by a screen printing method. Then a circuit is formed on a copper film 12 by a subtractive method. By forming a device hole 19 of the flexible film by etching, a bump 16 which has been formed on the tip of a lead 17 appears. After this, the bump 16 is roughened, if necessary, and the surface of the conductive paste 16 or the lead 17 is Sn plated, or Au plated over the Ni plating.
JP62246745A 1987-09-30 1987-09-30 Manufacture of tape carrier Pending JPS6489526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62246745A JPS6489526A (en) 1987-09-30 1987-09-30 Manufacture of tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62246745A JPS6489526A (en) 1987-09-30 1987-09-30 Manufacture of tape carrier

Publications (1)

Publication Number Publication Date
JPS6489526A true JPS6489526A (en) 1989-04-04

Family

ID=17153023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62246745A Pending JPS6489526A (en) 1987-09-30 1987-09-30 Manufacture of tape carrier

Country Status (1)

Country Link
JP (1) JPS6489526A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196371A (en) * 1989-12-18 1993-03-23 Epoxy Technology, Inc. Flip chip bonding method using electrically conductive polymer bumps
US5879761A (en) * 1989-12-18 1999-03-09 Polymer Flip Chip Corporation Method for forming electrically conductive polymer interconnects on electrical substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196371A (en) * 1989-12-18 1993-03-23 Epoxy Technology, Inc. Flip chip bonding method using electrically conductive polymer bumps
US5879761A (en) * 1989-12-18 1999-03-09 Polymer Flip Chip Corporation Method for forming electrically conductive polymer interconnects on electrical substrates

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