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JPS6483390A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPS6483390A
JPS6483390A JP62239563A JP23956387A JPS6483390A JP S6483390 A JPS6483390 A JP S6483390A JP 62239563 A JP62239563 A JP 62239563A JP 23956387 A JP23956387 A JP 23956387A JP S6483390 A JPS6483390 A JP S6483390A
Authority
JP
Japan
Prior art keywords
working
laser light
fuse
worked
recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62239563A
Other languages
Japanese (ja)
Inventor
Naoto Sakagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62239563A priority Critical patent/JPS6483390A/en
Publication of JPS6483390A publication Critical patent/JPS6483390A/en
Pending legal-status Critical Current

Links

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  • Laser Beam Processing (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To increase a reliability by operating the laser light for working and that for recognizing, detecting the reflection light emitted from the fuse to be worked of the laser light for recognition and deciding the good and no good of the fuse working based on the variation in the intensity of the reflection light before and after working. CONSTITUTION:The laser light 13 for working outputted from the laser oscillator 2 for working is reflected by a half mirror 4 via an attenuator 3 and projected on the wafer 1 to be worked by an objective lens 5. A fuse is cut with its exothermic sablimation by the laser light 13 image-formed on the fuse to be cut of the wafer 1 positioned by a stage driver 7. The laser light 14 for recognition of low power outputted from the laser oscillator 9 for recognition passes the same optical axis as that of the laser light for working and is made incident on a detector 12 after reflecting on the surface of the fuse to be worked. The intensity of the reflection light is measured by the detector 12 and in case of the cutting being found incomplete the position adjustment and reworking are commanded again to a controller 8. The semiconductor device having a high reliability can thus be manufactured.
JP62239563A 1987-09-24 1987-09-24 Laser beam machine Pending JPS6483390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62239563A JPS6483390A (en) 1987-09-24 1987-09-24 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62239563A JPS6483390A (en) 1987-09-24 1987-09-24 Laser beam machine

Publications (1)

Publication Number Publication Date
JPS6483390A true JPS6483390A (en) 1989-03-29

Family

ID=17046661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62239563A Pending JPS6483390A (en) 1987-09-24 1987-09-24 Laser beam machine

Country Status (1)

Country Link
JP (1) JPS6483390A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193284A (en) * 1989-12-22 1991-08-23 Advantest Corp Laser cutting judgment method
JPH0563222A (en) * 1991-09-03 1993-03-12 Sanyo Electric Co Ltd Manufacturing equipment of photovoltaic apparatus
US5763853A (en) * 1994-04-20 1998-06-09 Hitachi Construction Machinery Co., Ltd. Laser processing apparatus, laser processing method and dam bar processing method
JP2007309710A (en) * 2006-05-17 2007-11-29 Enshu Ltd Method and apparatus for observing fine periodic grooves, processing method and apparatus for processing and processing fine periodic grooves

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57137089A (en) * 1981-02-17 1982-08-24 Toshiba Corp Control method for welding state
JPS61286081A (en) * 1985-06-13 1986-12-16 Toshiba Corp Laser welding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57137089A (en) * 1981-02-17 1982-08-24 Toshiba Corp Control method for welding state
JPS61286081A (en) * 1985-06-13 1986-12-16 Toshiba Corp Laser welding method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193284A (en) * 1989-12-22 1991-08-23 Advantest Corp Laser cutting judgment method
JPH0563222A (en) * 1991-09-03 1993-03-12 Sanyo Electric Co Ltd Manufacturing equipment of photovoltaic apparatus
US5763853A (en) * 1994-04-20 1998-06-09 Hitachi Construction Machinery Co., Ltd. Laser processing apparatus, laser processing method and dam bar processing method
JP2007309710A (en) * 2006-05-17 2007-11-29 Enshu Ltd Method and apparatus for observing fine periodic grooves, processing method and apparatus for processing and processing fine periodic grooves

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