[go: up one dir, main page]

JPS6482681A - Compound lens type photodetector/light emitting element - Google Patents

Compound lens type photodetector/light emitting element

Info

Publication number
JPS6482681A
JPS6482681A JP62241349A JP24134987A JPS6482681A JP S6482681 A JPS6482681 A JP S6482681A JP 62241349 A JP62241349 A JP 62241349A JP 24134987 A JP24134987 A JP 24134987A JP S6482681 A JPS6482681 A JP S6482681A
Authority
JP
Japan
Prior art keywords
space
lenslike
compound lens
light
radiated light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62241349A
Other languages
Japanese (ja)
Inventor
Masahiko Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP62241349A priority Critical patent/JPS6482681A/en
Publication of JPS6482681A publication Critical patent/JPS6482681A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To obtain a desired light distribution irrespective of the profile of an element by forming a space in a resin mold in a convex lenslike, concave lenslike or flat lenslike state. CONSTITUTION:In case of resin molding, a convex lenslike space 7a is formed in the resin mold as a compound lens. This space is provided in the optical path of a light irradiated from a chip 3, and the radiated light is controlled as predetermined by the space 7a as designated by symbol a. The shape of the space is formed in a concave lenslike space 7b, the radiated light is controlled by the space, or meniscus lenslike space 7c is further formed, and the molded end may be formed flatly. In any case, the lenslike space of predetermined shape is formed in the optical path of the radiated light from the chip 3 in the molded resin 6 as a compound lens without change, and the radiated light from the element can be arbitrarily controlled by utilizing the refraction of the light of the space.
JP62241349A 1987-09-25 1987-09-25 Compound lens type photodetector/light emitting element Pending JPS6482681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62241349A JPS6482681A (en) 1987-09-25 1987-09-25 Compound lens type photodetector/light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62241349A JPS6482681A (en) 1987-09-25 1987-09-25 Compound lens type photodetector/light emitting element

Publications (1)

Publication Number Publication Date
JPS6482681A true JPS6482681A (en) 1989-03-28

Family

ID=17072976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62241349A Pending JPS6482681A (en) 1987-09-25 1987-09-25 Compound lens type photodetector/light emitting element

Country Status (1)

Country Link
JP (1) JPS6482681A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0385669U (en) * 1989-12-21 1991-08-29
JPH0438068U (en) * 1990-07-27 1992-03-31
JPH09116194A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (en) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp semiconductor light emitting device
JPS6222491A (en) * 1985-07-23 1987-01-30 Toshiba Corp semiconductor light emitting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (en) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp semiconductor light emitting device
JPS6222491A (en) * 1985-07-23 1987-01-30 Toshiba Corp semiconductor light emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0385669U (en) * 1989-12-21 1991-08-29
JPH0438068U (en) * 1990-07-27 1992-03-31
JPH09116194A (en) * 1995-10-17 1997-05-02 Alps Electric Co Ltd Light emitting diode device

Similar Documents

Publication Publication Date Title
BR9001396A (en) MOLDED PLASTIC COSMETIC CONTACT LENS AND PROCESS FOR REPRODUCABLE MANUFACTURING OF A MOLDED CONTACT LENS
DK363789D0 (en) METHOD OF MAKING COLORED CONTACT LENSES
ATE207809T1 (en) INJECTION MOLDING PARTS AND INJECTION MOLDING SYSTEM FOR PRODUCING CONTACT LENSES
BR9601202A (en) Process for preparing contact lenses with injection molding with reaction
DE69414201D1 (en) Intraocular lens with unbreakable brackets
DE68918356D1 (en) Lens containing a high refractive index resin and process for making the lens.
DE3583017D1 (en) OPTICALLY INTEGRATED COMPONENT MADE OF GLASS.
DE68910369D1 (en) Phase-locked semiconductor laser array using closely spaced negative refractive index waveguides.
NZ223192A (en) Molding 'smart' card
CA2431253A1 (en) Beam shaper
JPS6482681A (en) Compound lens type photodetector/light emitting element
JPS55120004A (en) Production of high molecular optical waveguide
ATE115593T1 (en) TRANSPARENT THERMOPLASTIC MOLD OF 2,3-DIFLUORACRYLIC ESTERS.
DE58907221D1 (en) Graft polymers suitable for the production of transparent thermoplastic molding compositions.
DE50208885D1 (en) Button with molded cap
EP0456131A3 (en) Photoelectric switch
JPS5728392A (en) Optical semiconductor device
JPS5773985A (en) Semiconductor light emitting device and manufacture thereof
JPS6488409A (en) Optical function element
JPS57187224A (en) Manufacture of lens unit at assembled optical system
GB8701879D0 (en) Lens
JPS5745270A (en) Semiconductor device
JPS52126240A (en) Optical fibre connection
JPS6474415A (en) Optical displacement detector
JPS5696876A (en) Semiconductor light receiving element