JPS648267A - Thin film forming device - Google Patents
Thin film forming deviceInfo
- Publication number
- JPS648267A JPS648267A JP16448187A JP16448187A JPS648267A JP S648267 A JPS648267 A JP S648267A JP 16448187 A JP16448187 A JP 16448187A JP 16448187 A JP16448187 A JP 16448187A JP S648267 A JPS648267 A JP S648267A
- Authority
- JP
- Japan
- Prior art keywords
- crucible
- film forming
- electron
- thin film
- forming device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
PURPOSE:To prevent ionization of an evaporated substance and to form a good- quality film by projecting an accelerated electron on a crucible to heat the crucible and to evaporate a film forming substance in the crucible, and providing a shielding means to prevent the collision of the electron with the flow of the evaporated substance. CONSTITUTION:The crucible 1b contg. the film forming substance vaporization source 2b is arranged in the heat shield 13 of the thin film forming device. The electron flow 11b emitted from a crucible heating filament 10b provided on the outside of the crucible 1b is accelerated, and projected on the crucible 1b. The crucible 1b is heated by the bombardment of the electron, and the vaporization source 2b is heated and evaporated. The vapor flow 12b of the film forming substance is injected from the nozzle 15 of the crucible 1b, and deposited on a substrate (not shown in the figure) to form a thin film. In this film forming device, the electron shielding cylindrical protrusion 14 is provided on the crucible 1b. The collision of the electron with the vapor flow 12b is prevented by the protrusion 14, and a uniform and good-quality thin film can be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16448187A JPS648267A (en) | 1987-06-30 | 1987-06-30 | Thin film forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16448187A JPS648267A (en) | 1987-06-30 | 1987-06-30 | Thin film forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648267A true JPS648267A (en) | 1989-01-12 |
Family
ID=15793991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16448187A Pending JPS648267A (en) | 1987-06-30 | 1987-06-30 | Thin film forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648267A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04283386A (en) * | 1991-03-11 | 1992-10-08 | Sanyo Electric Co Ltd | Refrigerator |
| KR100623701B1 (en) * | 2004-10-01 | 2006-09-19 | 삼성에스디아이 주식회사 | Organic material deposition apparatus |
| JP2018521216A (en) * | 2016-05-10 | 2018-08-02 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Evaporation source for depositing evaporated material and method for depositing evaporated material |
| JP2020063511A (en) * | 2019-11-29 | 2020-04-23 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Evaporation source for depositing evaporated material, and method for depositing evaporated material |
-
1987
- 1987-06-30 JP JP16448187A patent/JPS648267A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04283386A (en) * | 1991-03-11 | 1992-10-08 | Sanyo Electric Co Ltd | Refrigerator |
| KR100623701B1 (en) * | 2004-10-01 | 2006-09-19 | 삼성에스디아이 주식회사 | Organic material deposition apparatus |
| JP2018521216A (en) * | 2016-05-10 | 2018-08-02 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Evaporation source for depositing evaporated material and method for depositing evaporated material |
| JP2020063511A (en) * | 2019-11-29 | 2020-04-23 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Evaporation source for depositing evaporated material, and method for depositing evaporated material |
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