JPS6482614A - Chemical vapor growth equipment - Google Patents
Chemical vapor growth equipmentInfo
- Publication number
- JPS6482614A JPS6482614A JP24140587A JP24140587A JPS6482614A JP S6482614 A JPS6482614 A JP S6482614A JP 24140587 A JP24140587 A JP 24140587A JP 24140587 A JP24140587 A JP 24140587A JP S6482614 A JPS6482614 A JP S6482614A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- uniformly
- gas flow
- control mechanism
- flow control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
PURPOSE:To prevent the occurrence of an eddy in the gas introducing section of a reaction furnace by providing a gas flow control mechanism on the gas introducing side of the, reaction furnace so that the gas flow introduced into the reaction furnace uniformly diffuses centering the vertex of a circular cone, thereby uniformly supplying the gas onto a crystal substrate. CONSTITUTION:A gas flow control mechanism 20 is provided in the connecting section of a throttle section 12 of a reaction tube 11 and a gas introducing pipe 13. This gas flow control mechanism 20 is provided with a plurality of ports 21 for drawing out the gas on a circular arc centering the intersection point on the extension of the taper of the throttle section 12, or the vertex P of a circular cone making the throttle section 12, and having any radius from this center P. The gas introduced from the gas introducing pipe 13 diffuses along the taper of the throttle section 12 of the reaction tube 11 and flows uniformly by passing through the ports 21 for drawing the gas of the gas flow control mechanism 20. Further, if the holes outside the circular arc are made larger, the effect of the resistance of the flow due to the tube wall of the reaction tube 11 becomes small, whereby the gas can uniformly be supplied to a crystal substrate 15. Also, since the gas flow diffuses uniformly, the occurrence of an eddy in the shoulder of the reaction tube 11 can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24140587A JPS6482614A (en) | 1987-09-25 | 1987-09-25 | Chemical vapor growth equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24140587A JPS6482614A (en) | 1987-09-25 | 1987-09-25 | Chemical vapor growth equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482614A true JPS6482614A (en) | 1989-03-28 |
Family
ID=17073794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24140587A Pending JPS6482614A (en) | 1987-09-25 | 1987-09-25 | Chemical vapor growth equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482614A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5106453A (en) * | 1990-01-29 | 1992-04-21 | At&T Bell Laboratories | MOCVD method and apparatus |
US5284519A (en) * | 1990-05-16 | 1994-02-08 | Simon Fraser University | Inverted diffuser stagnation point flow reactor for vapor deposition of thin films |
CN102388162A (en) * | 2009-03-03 | 2012-03-21 | S.O.I.Tec绝缘体上硅技术公司 | Gas injectors for cvd systems with the same |
-
1987
- 1987-09-25 JP JP24140587A patent/JPS6482614A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5106453A (en) * | 1990-01-29 | 1992-04-21 | At&T Bell Laboratories | MOCVD method and apparatus |
US5284519A (en) * | 1990-05-16 | 1994-02-08 | Simon Fraser University | Inverted diffuser stagnation point flow reactor for vapor deposition of thin films |
CN102388162A (en) * | 2009-03-03 | 2012-03-21 | S.O.I.Tec绝缘体上硅技术公司 | Gas injectors for cvd systems with the same |
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