JPS6474797A - Cooling system for electronic apparatus - Google Patents
Cooling system for electronic apparatusInfo
- Publication number
- JPS6474797A JPS6474797A JP23117287A JP23117287A JPS6474797A JP S6474797 A JPS6474797 A JP S6474797A JP 23117287 A JP23117287 A JP 23117287A JP 23117287 A JP23117287 A JP 23117287A JP S6474797 A JPS6474797 A JP S6474797A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sliding plate
- section
- contacting
- dissipating section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 230000020169 heat generation Effects 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To facilitate mounting, and to improve the effect of heat dissipation of the whole electronic apparatus by contacting or detaching a contacting section for a radiator with or from an electronic part in response to the movement of a sliding plate superposed to a support plate in a slidable manner. CONSTITUTION:When a cooling system is installed to a mother board, a leaf spring 113 is hooked to a fitting hole 124 for a sliding plate 12 in a latch manner. A drive place 122 for the sliding plate 12 is abutted against an inclined face 131b in a first heat-dissipating section 131, and a contacting section 133 for a second heat-dissipating section 132 is drawn near to the support plate 11 side against the energizing force of a spring 134. When the sliding plate 12 is pushed up in the direction of the arrow, the sliding plate 12 is shifted, using a guide pin P in a guide groove 123 as a guide, and the state of abutting of the drive piece 122 and an inclined face 131c is released. The second heat-dissipating section 132 is pushed out to the electronic component 4 side by the energizing force of the spring 134, thus bringing the contacting section 133 into contact with an electronic component 4. Accordingly, heat generation from the electronic component 4 is dissipated through the second heat-dissipating section 132 and the first heat-dissipating section 131 composed of a good thermal conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23117287A JPS6474797A (en) | 1987-09-17 | 1987-09-17 | Cooling system for electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23117287A JPS6474797A (en) | 1987-09-17 | 1987-09-17 | Cooling system for electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6474797A true JPS6474797A (en) | 1989-03-20 |
Family
ID=16919445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23117287A Pending JPS6474797A (en) | 1987-09-17 | 1987-09-17 | Cooling system for electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6474797A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| JP2010287728A (en) * | 2009-06-11 | 2010-12-24 | Nec Computertechno Ltd | Cooling device and computer device using the same |
-
1987
- 1987-09-17 JP JP23117287A patent/JPS6474797A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6845014B2 (en) | 1992-05-20 | 2005-01-18 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7035108B2 (en) | 1992-05-20 | 2006-04-25 | Seiko Epson Corporation | Information processing device |
| US7345883B2 (en) | 1992-05-20 | 2008-03-18 | Seiko Epson Corporation | Processing device |
| US7359202B2 (en) | 1992-05-20 | 2008-04-15 | Seiko Epson Corporation | Printer apparatus |
| US7583505B2 (en) | 1992-05-20 | 2009-09-01 | Seiko Epson Corporation | Processor apparatus |
| JP2010287728A (en) * | 2009-06-11 | 2010-12-24 | Nec Computertechno Ltd | Cooling device and computer device using the same |
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