JPS6473619A - Method and apparatus for low-pressure process - Google Patents
Method and apparatus for low-pressure processInfo
- Publication number
- JPS6473619A JPS6473619A JP23031487A JP23031487A JPS6473619A JP S6473619 A JPS6473619 A JP S6473619A JP 23031487 A JP23031487 A JP 23031487A JP 23031487 A JP23031487 A JP 23031487A JP S6473619 A JPS6473619 A JP S6473619A
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- passages
- sequentially
- controlled
- closing means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To uniformly discharge gas from a plasma processor by providing a rotary plate having openings so disposed as to sequentially open at least one of discharge holes and to sequentially close the remaining holes. CONSTITUTION:In order to set a plurality of discharge passages for connecting a processing tank to a main discharge pipe 8, i.e., for example 8 discharge holes 6 formed at a bottom plate 5 and discharge pipes 7 corresponding thereto to open and closed states, closing means 9 provided on the way of the pipes 7 are, for example, formed on the passages. The opening/closing means 9 are so controlled as to sequentially open at least one of the passages and to sequentially close the remaining passages. Opening/closing means 91 provided on the way of the pipes 7 connected to discharge holes 62 are so controlled as to open the discharge passage, and the other opening/closing means 9 are so controlled as to close the corresponding discharge passages. Thus, all the passages are controlled to be sequentially opened and closed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62230314A JPH0770526B2 (en) | 1987-09-14 | 1987-09-14 | Decompression processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62230314A JPH0770526B2 (en) | 1987-09-14 | 1987-09-14 | Decompression processing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6473619A true JPS6473619A (en) | 1989-03-17 |
JPH0770526B2 JPH0770526B2 (en) | 1995-07-31 |
Family
ID=16905889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62230314A Expired - Lifetime JPH0770526B2 (en) | 1987-09-14 | 1987-09-14 | Decompression processing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0770526B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582475A (en) * | 1991-09-24 | 1993-04-02 | Nec Kyushu Ltd | Plasma etching device |
JP2000508842A (en) * | 1997-01-30 | 2000-07-11 | フユージョン システムズ コーポレイション | Dual exhaust window arrangement for wafer plasma processing equipment |
JP2003502501A (en) * | 1999-06-19 | 2003-01-21 | ゼニテックインコーポレイテッド | Chemical vapor deposition reactor and thin film forming method using the same |
KR100389449B1 (en) * | 2001-06-26 | 2003-06-27 | 주성엔지니어링(주) | vacuum plate have symmetrical air-load block |
JP2006032344A (en) * | 2004-07-13 | 2006-02-02 | Nordson Corp | Ultra high speed uniform plasma processing system |
JP2015062225A (en) * | 2013-09-03 | 2015-04-02 | ラム リサーチ コーポレーションLam Research Corporation | System, method and apparatus for coordinating pressure pulses and rf modulation in small volume confined process reactor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717134A (en) * | 1980-07-04 | 1982-01-28 | Kokusai Electric Co Ltd | Device for decompression and reaction |
JPS61147529A (en) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | Dry etching device of semiconductor wafer |
-
1987
- 1987-09-14 JP JP62230314A patent/JPH0770526B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5717134A (en) * | 1980-07-04 | 1982-01-28 | Kokusai Electric Co Ltd | Device for decompression and reaction |
JPS61147529A (en) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | Dry etching device of semiconductor wafer |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582475A (en) * | 1991-09-24 | 1993-04-02 | Nec Kyushu Ltd | Plasma etching device |
JP2000508842A (en) * | 1997-01-30 | 2000-07-11 | フユージョン システムズ コーポレイション | Dual exhaust window arrangement for wafer plasma processing equipment |
JP2003502501A (en) * | 1999-06-19 | 2003-01-21 | ゼニテックインコーポレイテッド | Chemical vapor deposition reactor and thin film forming method using the same |
KR100389449B1 (en) * | 2001-06-26 | 2003-06-27 | 주성엔지니어링(주) | vacuum plate have symmetrical air-load block |
JP2006032344A (en) * | 2004-07-13 | 2006-02-02 | Nordson Corp | Ultra high speed uniform plasma processing system |
JP2015062225A (en) * | 2013-09-03 | 2015-04-02 | ラム リサーチ コーポレーションLam Research Corporation | System, method and apparatus for coordinating pressure pulses and rf modulation in small volume confined process reactor |
US10636625B2 (en) | 2013-09-03 | 2020-04-28 | Lam Research Corporation | System for coordinating pressure pulses and RF modulation in a small volume confined process reactor |
Also Published As
Publication number | Publication date |
---|---|
JPH0770526B2 (en) | 1995-07-31 |
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