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JPS6472536A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS6472536A
JPS6472536A JP62229030A JP22903087A JPS6472536A JP S6472536 A JPS6472536 A JP S6472536A JP 62229030 A JP62229030 A JP 62229030A JP 22903087 A JP22903087 A JP 22903087A JP S6472536 A JPS6472536 A JP S6472536A
Authority
JP
Japan
Prior art keywords
wedge tool
wire
tip
bonding
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62229030A
Other languages
Japanese (ja)
Inventor
Yutaka Makino
Akihiro Yamamoto
Yoshifumi Kitayama
Masato Hirano
Shinya Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62229030A priority Critical patent/JPS6472536A/en
Publication of JPS6472536A publication Critical patent/JPS6472536A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78282—Resistance welding electrodes, i.e. for ohmic heating in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To apply a wire bonder to the combinations of many kinds of metals and to obtain the wire bonder, which is hard to be affected by the surface state of a surface to be bonded and can perform stable bonding, by providing a bonding head, in which a specified main wedge tool and a specified tip wedge tool are juxtaposed through an insulator and connected to a welding power source. CONSTITUTION:A guide hole 8 is formed in a main wedge tool 2 so that wire 10 is guided toward a wire bonding surface 5. A tip wedge tool 3 is juxtaposed with the main wedge tool 2 with a gap being provided. A wire bonding surface 5 is formed in the tip wedge tool 3 on the same plane as the wire bonding surface 5 of the main wedge tool 3. An insulator 4 is provided in the gap between the main wedge tool 2 and the tip wedge tool 3. Thus a bonding head 1 comprising those parts is provided. The main wedge tool 2 and the tip wedge tool 3 are connected to a welding power source 9. Since the wire can be heated, fused and bonded by the current conduction from the welding power source, the wire bonder can be applied to the combinations of many kinds of metals. Since the wire is guided through the guide hole, the stable bonding can be performed.
JP62229030A 1987-09-11 1987-09-11 Wire bonder Pending JPS6472536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62229030A JPS6472536A (en) 1987-09-11 1987-09-11 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62229030A JPS6472536A (en) 1987-09-11 1987-09-11 Wire bonder

Publications (1)

Publication Number Publication Date
JPS6472536A true JPS6472536A (en) 1989-03-17

Family

ID=16885644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62229030A Pending JPS6472536A (en) 1987-09-11 1987-09-11 Wire bonder

Country Status (1)

Country Link
JP (1) JPS6472536A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558270A (en) * 1995-01-06 1996-09-24 Kulicke And Soffa Investments, Inc Fine pitch capillary/wedge bonding tool
JP2013171964A (en) * 2012-02-21 2013-09-02 Ultrasonic Engineering Co Ltd Ultrasonic wire bonding device and ultrasonic wire bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558270A (en) * 1995-01-06 1996-09-24 Kulicke And Soffa Investments, Inc Fine pitch capillary/wedge bonding tool
JP2013171964A (en) * 2012-02-21 2013-09-02 Ultrasonic Engineering Co Ltd Ultrasonic wire bonding device and ultrasonic wire bonding method

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