JPS6471584A - Device for eliminating covering part of covered wire - Google Patents
Device for eliminating covering part of covered wireInfo
- Publication number
- JPS6471584A JPS6471584A JP62227291A JP22729187A JPS6471584A JP S6471584 A JPS6471584 A JP S6471584A JP 62227291 A JP62227291 A JP 62227291A JP 22729187 A JP22729187 A JP 22729187A JP S6471584 A JPS6471584 A JP S6471584A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- mirror
- wire
- covered wire
- covering part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
Abstract
PURPOSE:To improve the soldering quality of a wire by arranging a laser beam polariscope and plane reflection mirrors in opposition to a covered wire and scanning a laser beam with the same spot diameter on the entire periphery of the wire in the same plane. CONSTITUTION:A converging optical system 34 is arranged to the laser beam 46 from a laser beam source 33 and a polygonal mirror 30 is provided as the polariscope on which the converging laser beam 38 is made incident. Further, the plane reflection mirrors 31 and 32 are arranged respectively at the opposite side of the covered wire 13 in opposition to the mirror 30. A part whose cover is to be eliminated of the covered wire 13 send out from a wire feeder is set on the machining center and the laser beam 38 is projected toward the mirror 30. The beam 38 is polarized by the mirror 30 and the polarized beam and the reflected beam are projected repeatedly on the entire periphery of a covering part 16 by rotation of the mirror 30. Since the prescribed width of the covering part 16 is eliminated accurately, the soldering quality of core wires 14 and 15 is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62227291A JPS6471584A (en) | 1987-09-10 | 1987-09-10 | Device for eliminating covering part of covered wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62227291A JPS6471584A (en) | 1987-09-10 | 1987-09-10 | Device for eliminating covering part of covered wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6471584A true JPS6471584A (en) | 1989-03-16 |
Family
ID=16858510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62227291A Pending JPS6471584A (en) | 1987-09-10 | 1987-09-10 | Device for eliminating covering part of covered wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6471584A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01295609A (en) * | 1988-05-24 | 1989-11-29 | Matsushita Electric Ind Co Ltd | Insulating covering film removing method and device |
| EP0580155A3 (en) * | 1992-07-23 | 1994-04-06 | Topcon Corp | |
| US5837961A (en) * | 1995-11-24 | 1998-11-17 | Miller; Richard T. | Laser wire stripping apparatus having multiple synchronous mirrors and a method therefor |
| US5935465A (en) * | 1996-11-05 | 1999-08-10 | Intermedics Inc. | Method of making implantable lead including laser wire stripping |
| JP2005224861A (en) * | 2004-01-14 | 2005-08-25 | Usui Kokusai Sangyo Kaisha Ltd | Method for removing resin layer from resin-coated metal tube |
| JP2009208118A (en) * | 2008-03-04 | 2009-09-17 | Sumitomo Electric Ind Ltd | Laser beam machining method and apparatus |
| JP2009274081A (en) * | 2008-05-12 | 2009-11-26 | Sumitomo Electric Ind Ltd | Laser processing apparatus |
| JP2021072719A (en) * | 2019-10-31 | 2021-05-06 | 株式会社ダイヘン | Coating peeling device and winding device |
-
1987
- 1987-09-10 JP JP62227291A patent/JPS6471584A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01295609A (en) * | 1988-05-24 | 1989-11-29 | Matsushita Electric Ind Co Ltd | Insulating covering film removing method and device |
| EP0580155A3 (en) * | 1992-07-23 | 1994-04-06 | Topcon Corp | |
| US5837961A (en) * | 1995-11-24 | 1998-11-17 | Miller; Richard T. | Laser wire stripping apparatus having multiple synchronous mirrors and a method therefor |
| US5935465A (en) * | 1996-11-05 | 1999-08-10 | Intermedics Inc. | Method of making implantable lead including laser wire stripping |
| US6265691B1 (en) | 1996-11-05 | 2001-07-24 | Intermedics Inc. | Method of making implantable lead including laser wire stripping |
| US6326587B1 (en) | 1996-11-05 | 2001-12-04 | Intermedics Inc. | Apparatus for removing an insulating layer from a portion of a conductor |
| JP2005224861A (en) * | 2004-01-14 | 2005-08-25 | Usui Kokusai Sangyo Kaisha Ltd | Method for removing resin layer from resin-coated metal tube |
| JP2009208118A (en) * | 2008-03-04 | 2009-09-17 | Sumitomo Electric Ind Ltd | Laser beam machining method and apparatus |
| US8455791B2 (en) | 2008-03-04 | 2013-06-04 | Sumitomo Electric Industries, Ltd. | Laser processing method, laser processing device and cable harness production method |
| JP2009274081A (en) * | 2008-05-12 | 2009-11-26 | Sumitomo Electric Ind Ltd | Laser processing apparatus |
| JP2021072719A (en) * | 2019-10-31 | 2021-05-06 | 株式会社ダイヘン | Coating peeling device and winding device |
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