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JPS6468908A - Manufacture of oxide superconducting coil - Google Patents

Manufacture of oxide superconducting coil

Info

Publication number
JPS6468908A
JPS6468908A JP22560287A JP22560287A JPS6468908A JP S6468908 A JPS6468908 A JP S6468908A JP 22560287 A JP22560287 A JP 22560287A JP 22560287 A JP22560287 A JP 22560287A JP S6468908 A JPS6468908 A JP S6468908A
Authority
JP
Japan
Prior art keywords
copper
groove
base
oxygen
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22560287A
Other languages
Japanese (ja)
Inventor
Masaru Sugimoto
Tsukasa Kono
Yoshimitsu Ikeno
Nobuyuki Sadakata
Mikio Nakagawa
Kyoji Tachikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP22560287A priority Critical patent/JPS6468908A/en
Publication of JPS6468908A publication Critical patent/JPS6468908A/en
Pending legal-status Critical Current

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  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

PURPOSE:To obtain a superconductive coil with a high mechanical strength by forming a coil pattern-shaped groove on a metal base, and thermally treating the base in the oxygen atmosphere by filling a predetermined compound powder in the groove after oxidizing the surface of the groove. CONSTITUTION:A spiral-shaped groove 2 is formed on a metal base 1. Copper which forms the base 1 should be a pure copper such as tough pitch copper, oxygen-free copper, or copper containing silver. A copper oxide layer 3 is formed on the surface of the side where the groove 2 of the base 1 is formed by treatments such as anodic oxidation and chemical oxidation. Cupric oxide is preferred for the copper oxide layer. Then a mixture 4 consisting of compound powders of both group IIA and group IIIA elements in the periodic table is filled. After this, by thermally treating in the oxygen atmosphere, the mixture 4 within the groove 2 is fired, while further causing the mixture 4 to react with the copper oxide layer 3 and oxygen in the atmosphere to form a superconductive layer 5 of A-B-Cu-O (where A is a group IIA element and B is a group IIIA element in the periodic table) in the interior of the groove 2, whereby a superconducting coil 6 having a spiral pattern is obtained.
JP22560287A 1987-09-09 1987-09-09 Manufacture of oxide superconducting coil Pending JPS6468908A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22560287A JPS6468908A (en) 1987-09-09 1987-09-09 Manufacture of oxide superconducting coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22560287A JPS6468908A (en) 1987-09-09 1987-09-09 Manufacture of oxide superconducting coil

Publications (1)

Publication Number Publication Date
JPS6468908A true JPS6468908A (en) 1989-03-15

Family

ID=16831897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22560287A Pending JPS6468908A (en) 1987-09-09 1987-09-09 Manufacture of oxide superconducting coil

Country Status (1)

Country Link
JP (1) JPS6468908A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231078A (en) * 1991-09-05 1993-07-27 Ael Defense Corp. Thin film superconducting LC network
US6380002B2 (en) * 1999-12-07 2002-04-30 Advanced Semiconductor Engineering, Inc. Method for fabricating a flexible substrate based ball grid array (BGA) package
US6682824B1 (en) * 2000-04-11 2004-01-27 Mitsubishi Materials Corporation Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231078A (en) * 1991-09-05 1993-07-27 Ael Defense Corp. Thin film superconducting LC network
US6380002B2 (en) * 1999-12-07 2002-04-30 Advanced Semiconductor Engineering, Inc. Method for fabricating a flexible substrate based ball grid array (BGA) package
US6682824B1 (en) * 2000-04-11 2004-01-27 Mitsubishi Materials Corporation Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same

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