JPS6465863A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6465863A JPS6465863A JP62222518A JP22251887A JPS6465863A JP S6465863 A JPS6465863 A JP S6465863A JP 62222518 A JP62222518 A JP 62222518A JP 22251887 A JP22251887 A JP 22251887A JP S6465863 A JPS6465863 A JP S6465863A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- connecting sections
- fet
- wirings
- power source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/903—Masterslice integrated circuits comprising field effect technology
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To improve a device in a noise property and decrease its wiring area by a method wherein a bypass capacitor between a power source and the ground is provided to an unused transistor gate or a vacant region. CONSTITUTION:A gate 3c is made to make a diffusion layer 5 short-circuit through connecting sections 7e-7f and a wiring 9c, and a gate 4c is made to make a diffusion layer 6 short-circuit through connecting sections 7g-7h and a wiring 10b as well. The gate 3c and the connecting sections 7g-7h are connected with a power source through the intermediary of wirings 9d and 10c and a through-hole 19, and the gate 7c and the connecting sections 7e-7f are grounded through the intermediary of wirings 9b and 9e. By this structure, a FET 11 and a FET 12 are constructed, which are composed of the gate 3c and the connecting points 7e-7f and the gate 4c and the connecting sections 7g-7h respectively, and the FET 11 and the FET 12 are grounded through the wirings 9c and 10b respectively, so that only gate capacitors Cg1 and Cg2 are made to be effective and serve as a bypass capacitor between the power source and a ground 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222518A JPS6465863A (en) | 1987-09-04 | 1987-09-04 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222518A JPS6465863A (en) | 1987-09-04 | 1987-09-04 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6465863A true JPS6465863A (en) | 1989-03-13 |
Family
ID=16783683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62222518A Pending JPS6465863A (en) | 1987-09-04 | 1987-09-04 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6465863A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04370965A (en) * | 1991-06-20 | 1992-12-24 | Fujitsu Ltd | Semiconductor device |
JPH05152511A (en) * | 1991-11-26 | 1993-06-18 | Sharp Corp | Capacitor circuit |
EP1326344A3 (en) * | 2001-12-21 | 2007-03-21 | NEC Electronics Corporation | Universal logic module and ASIC using the same |
US7728362B2 (en) | 2006-01-20 | 2010-06-01 | International Business Machines Corporation | Creating integrated circuit capacitance from gate array structures |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6161437A (en) * | 1984-09-03 | 1986-03-29 | Toshiba Corp | Semiconductor integrated circuit device |
JPS62123739A (en) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | Semiconductor integrated circuit device |
-
1987
- 1987-09-04 JP JP62222518A patent/JPS6465863A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6161437A (en) * | 1984-09-03 | 1986-03-29 | Toshiba Corp | Semiconductor integrated circuit device |
JPS62123739A (en) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | Semiconductor integrated circuit device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04370965A (en) * | 1991-06-20 | 1992-12-24 | Fujitsu Ltd | Semiconductor device |
JPH05152511A (en) * | 1991-11-26 | 1993-06-18 | Sharp Corp | Capacitor circuit |
EP1326344A3 (en) * | 2001-12-21 | 2007-03-21 | NEC Electronics Corporation | Universal logic module and ASIC using the same |
US7728362B2 (en) | 2006-01-20 | 2010-06-01 | International Business Machines Corporation | Creating integrated circuit capacitance from gate array structures |
US8188516B2 (en) | 2006-01-20 | 2012-05-29 | International Business Machines Corporation | Creating integrated circuit capacitance from gate array structures |
US8298888B2 (en) | 2006-01-20 | 2012-10-30 | International Business Machines Corporation | Creating integrated circuit capacitance from gate array structures |
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