JPS6457624A - Cleaning equipment - Google Patents

Abstract

PURPOSE:To obtain a cleaning equipment with excellent cleaning effect wherein convection does not occur with comparatively small amount of supplied water to a cleaning tank, even if the flow rate between wafers in a carrier is increased, by making the opening ratio of a region of a rectifying plate just under part where an object to be cleaned is dipped, larger than the other parts, said rectifying plate being rackwise provided above the wafer supplying position in a cleaning tank. CONSTITUTION:The title cleaning equipment comprizes a cleaning tank 1 wherein water to be supplied to the bottom part is made to overflow from the upper part, and an object 8 to be cleaned which is dipped in the inside is washed with water, and a rectifying plate 7 provided rackwise above the water supplying position in the cleaning tank 1. The opening ratio of a region 7a of the rectifying plate 7 just under the part where the object 8 to be cleaned is dipped, is made larger than the other parts 7b. For example, the rectifying plate 7 is provided rackwise a little higher than the set position of a spraying pipe 3. In the region 7a just under the part where a semiconductor wafer 8 is dipped, the rectifying plate 7 has 25mm diameter holes 8a having the respective centers at the four corners of 27mm side squares which are mutually adjacent in length and breadth. In the other parts 7b, the above plate 7 has 2.5mm diameter holes 8b at the four corners and the centers of 10mm side squares which mutually adjacent in length and breadth.