JPS6455832A - Mounting method for semiconductor element - Google Patents
Mounting method for semiconductor elementInfo
- Publication number
- JPS6455832A JPS6455832A JP21358987A JP21358987A JPS6455832A JP S6455832 A JPS6455832 A JP S6455832A JP 21358987 A JP21358987 A JP 21358987A JP 21358987 A JP21358987 A JP 21358987A JP S6455832 A JPS6455832 A JP S6455832A
- Authority
- JP
- Japan
- Prior art keywords
- sealer
- sealers
- face
- reflow
- dispenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 2
- 239000004973 liquid crystal related substance Substances 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 229920002545 silicone oil Polymers 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To largely improve moisture resistance by coating with first sealer, then covering with second sealer, and simultaneously curing the first and second sealers. CONSTITUTION:An IC3 is mounted in a face-down manner on a glass substrate 6 of a liquid crystal panel in which liquid crystal is poured and sealed, heated to allow a solder 4 to reflow, thereby bonding it to a laminated conductor 5. After the reflow of the solder 4, it is cleaned, sealer 1 is poured by a dispenser from laterally of the IC3, and the face of the IC3, the substrate 6 and the IC3 are laterally coated with the sealer 1. Then, the rear face of the IC3, the front surface of the sealer 1, and the laminated conductor 5, are coated by a dispenser with the sealer 2, the sealers 1, 2 are then heated at 80-100 deg.C to be simultaneously cured. In this case, since a silicone oil film is formed on a boundary between the sealers 1 and 2, the moisture absorption of the sealer 1 due to moisture penetrating through the sealer 2 is suppressed under high temperature and high humidity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21358987A JPS6455832A (en) | 1987-08-27 | 1987-08-27 | Mounting method for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21358987A JPS6455832A (en) | 1987-08-27 | 1987-08-27 | Mounting method for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6455832A true JPS6455832A (en) | 1989-03-02 |
Family
ID=16641701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21358987A Pending JPS6455832A (en) | 1987-08-27 | 1987-08-27 | Mounting method for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6455832A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
| WO2000052739A3 (en) * | 1999-03-03 | 2001-01-11 | Intel Corp | A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
-
1987
- 1987-08-27 JP JP21358987A patent/JPS6455832A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
| WO2000052739A3 (en) * | 1999-03-03 | 2001-01-11 | Intel Corp | A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
| US6238948B1 (en) | 1999-03-03 | 2001-05-29 | Intel Corporation | Controlled collapse chip connection (C4) integrated circuit package that has a fillet which seals an underfill material |
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