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JPS6454442A - Photocurable resist resin composition for chemical plating - Google Patents

Photocurable resist resin composition for chemical plating

Info

Publication number
JPS6454442A
JPS6454442A JP62210693A JP21069387A JPS6454442A JP S6454442 A JPS6454442 A JP S6454442A JP 62210693 A JP62210693 A JP 62210693A JP 21069387 A JP21069387 A JP 21069387A JP S6454442 A JPS6454442 A JP S6454442A
Authority
JP
Japan
Prior art keywords
compd
copper
chemical plating
titled composition
durability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62210693A
Other languages
Japanese (ja)
Inventor
Takao Morikawa
Hiroyuki Haruta
Hideo Tsuda
Mineo Kawamoto
Kanji Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Nippon Soda Co Ltd
Original Assignee
Hitachi Ltd
Nippon Soda Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Nippon Soda Co Ltd filed Critical Hitachi Ltd
Priority to JP62210693A priority Critical patent/JPS6454442A/en
Publication of JPS6454442A publication Critical patent/JPS6454442A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0381—Macromolecular compounds which are rendered insoluble or differentially wettable using a combination of a phenolic resin and a polyoxyethylene resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

PURPOSE:To reduce the unusual deposit of copper among circuits, and to obtain the excellent definition and durability for a plating solution of the titled composition by incorporating a polyfunctional epoxy resin, an oxirane ring contg. compd., and a photosensitive aromatic onium salt in the fundamental composition of the titled composition. CONSTITUTION:The titled composition contains the epoxide resin which has the viscosity of >=150 poise at 25 deg.C and contains at least two glycidyl ether groups directly bound with an aromatic ring in a molecule, the oxirane ring contg. compd. which has >=140 deg.C b.p. and mol.wt. of <=500, the photosensitive aromatic onium salt, a compd. having 2-4 alkoholic hydroxy groups in one molecule, and a talc powder. Thus, the excellent printing characteristics, durability and anti-staining property for the plating solution are obtd., and the linearity of a copper pattern edging part is improved, even after depositing a chemical plating copper.
JP62210693A 1987-08-25 1987-08-25 Photocurable resist resin composition for chemical plating Pending JPS6454442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210693A JPS6454442A (en) 1987-08-25 1987-08-25 Photocurable resist resin composition for chemical plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210693A JPS6454442A (en) 1987-08-25 1987-08-25 Photocurable resist resin composition for chemical plating

Publications (1)

Publication Number Publication Date
JPS6454442A true JPS6454442A (en) 1989-03-01

Family

ID=16593538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210693A Pending JPS6454442A (en) 1987-08-25 1987-08-25 Photocurable resist resin composition for chemical plating

Country Status (1)

Country Link
JP (1) JPS6454442A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0430416A2 (en) * 1989-11-18 1991-06-05 Somar Corporation Electroless plating-resisting ink composition
JP2003041158A (en) * 2001-07-25 2003-02-13 Toppan Forms Co Ltd Epoxy-based insulating ink for ic media
JP2003041159A (en) * 2001-07-25 2003-02-13 Toppan Forms Co Ltd Epoxy-based insulating ink for ic media
WO2019078666A1 (en) * 2017-10-20 2019-04-25 주식회사 엘지화학 Ink composition

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55164204A (en) * 1977-08-05 1980-12-20 Gen Electric Photoinitiator
JPS56100817A (en) * 1980-01-16 1981-08-13 Hitachi Chem Co Ltd Photosetting resin composition
JPS62520A (en) * 1985-06-26 1987-01-06 Canon Inc Actinic energy ray-curable resin composition
JPS62102242A (en) * 1985-10-28 1987-05-12 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Photosetting composition
JPS62273226A (en) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd Photo-setting resist resin composition for electroless plating
JPS62273221A (en) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd Photocurable resist resin composition for electroless plating
JPS63261259A (en) * 1987-04-06 1988-10-27 チバ−ガイギー　アクチエンゲゼルシヤフト Manufacture of optical-structured painted film

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55164204A (en) * 1977-08-05 1980-12-20 Gen Electric Photoinitiator
JPS56100817A (en) * 1980-01-16 1981-08-13 Hitachi Chem Co Ltd Photosetting resin composition
JPS62520A (en) * 1985-06-26 1987-01-06 Canon Inc Actinic energy ray-curable resin composition
JPS62102242A (en) * 1985-10-28 1987-05-12 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Photosetting composition
JPS62273226A (en) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd Photo-setting resist resin composition for electroless plating
JPS62273221A (en) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd Photocurable resist resin composition for electroless plating
JPS63261259A (en) * 1987-04-06 1988-10-27 チバ−ガイギー　アクチエンゲゼルシヤフト Manufacture of optical-structured painted film

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0430416A2 (en) * 1989-11-18 1991-06-05 Somar Corporation Electroless plating-resisting ink composition
JP2003041158A (en) * 2001-07-25 2003-02-13 Toppan Forms Co Ltd Epoxy-based insulating ink for ic media
JP2003041159A (en) * 2001-07-25 2003-02-13 Toppan Forms Co Ltd Epoxy-based insulating ink for ic media
WO2019078666A1 (en) * 2017-10-20 2019-04-25 주식회사 엘지화학 Ink composition
KR20190044541A (en) * 2017-10-20 2019-04-30 주식회사 엘지화학 Ink Composition
JP2020537706A (en) * 2017-10-20 2020-12-24 エルジー・ケム・リミテッド Ink composition
US11214699B2 (en) 2017-10-20 2022-01-04 Lg Chem, Ltd. Ink composition

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