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JPS6454024A - Modified epoxy resin composition - Google Patents

Modified epoxy resin composition

Info

Publication number
JPS6454024A
JPS6454024A JP20920287A JP20920287A JPS6454024A JP S6454024 A JPS6454024 A JP S6454024A JP 20920287 A JP20920287 A JP 20920287A JP 20920287 A JP20920287 A JP 20920287A JP S6454024 A JPS6454024 A JP S6454024A
Authority
JP
Japan
Prior art keywords
compound
epoxy
oxazoline
epoxy resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20920287A
Other languages
Japanese (ja)
Inventor
Yukihiro Mikogami
Kazuhiko Kurematsu
Tsugio Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP20920287A priority Critical patent/JPS6454024A/en
Publication of JPS6454024A publication Critical patent/JPS6454024A/en
Pending legal-status Critical Current

Links

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  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain a casting resin composition excellent in high strength and heat resistance and good in workability, by mixing a bisoxazoline compound with an epoxy compound. CONSTITUTION:A resin composition comprises a bisoxazoline compound and an epoxy compound. Any oxazoline compound can be used so far as it contains at least one oxazoline ring in the molecule and, especially, a bis(2-oxazoline) compound is desirable. The amount of the oxazoline compound used is 3-100pts. wt. per 100pts.wt. epoxy compound. When this amount is smaller below this range, the heat resistance is lowered, and when this amount is above it, the electrical properties of a cured product are lowered. A bisphenol A epoxy resin among said epoxy compounds used is highly reactive with a bisoxazoline compound. Bisphenol AD epoxy resin and bisphenol F epoxy resin are epoxy resins easily reactive at a reaction temperature of 100-150 deg.C.
JP20920287A 1987-08-25 1987-08-25 Modified epoxy resin composition Pending JPS6454024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20920287A JPS6454024A (en) 1987-08-25 1987-08-25 Modified epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20920287A JPS6454024A (en) 1987-08-25 1987-08-25 Modified epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS6454024A true JPS6454024A (en) 1989-03-01

Family

ID=16569041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20920287A Pending JPS6454024A (en) 1987-08-25 1987-08-25 Modified epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS6454024A (en)

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