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JPS6453498A - Multilayer interconnection board - Google Patents

Multilayer interconnection board

Info

Publication number
JPS6453498A
JPS6453498A JP11417288A JP11417288A JPS6453498A JP S6453498 A JPS6453498 A JP S6453498A JP 11417288 A JP11417288 A JP 11417288A JP 11417288 A JP11417288 A JP 11417288A JP S6453498 A JPS6453498 A JP S6453498A
Authority
JP
Japan
Prior art keywords
layer
patterns
layer patterns
external
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11417288A
Other languages
Japanese (ja)
Inventor
Masayuki Sakurai
Haruo Suzuki
Yoshio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanki Engineering Co Ltd
Seikosha KK
Sanki Industrial Co Ltd
Original Assignee
Sanki Engineering Co Ltd
Seikosha KK
Sanki Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanki Engineering Co Ltd, Seikosha KK, Sanki Industrial Co Ltd filed Critical Sanki Engineering Co Ltd
Priority to JP11417288A priority Critical patent/JPS6453498A/en
Publication of JPS6453498A publication Critical patent/JPS6453498A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To reduce influence of foreign noise, by allowing conduction patterns formed on both sides of an insulating substrate to be conducted mutually through a through hole to enhance packaging density and by making an inner- layer pattern a signal line and an external-layer pattern a shield layer. CONSTITUTION:Inner-layer patterns 2, 2 which are each used as a signal line are formed on both sides of an insulating substrate 1. And a through hole 3 and a viahole 4 penetrating in a thickness direction are formed in the insulating substrate 1 and the inner-layer patterns 2, 2 are connected each other through the through hole 3 and viahole 4. The inner-layer patterns 2, 2 are coated with an insulating coating layer 6 while leaving specified positions as exposed parts 2a, 2b, 2c, and 2d. External-layer patterns 8, 8 consisting of copper coating formed by electroless plating are lamination-formed on a conductive paste layer 7 applied to an insulating coating layer 6 and the exposed part 2a. The external-layer patterns 8, 8 are shield layers which shielded the inner-layer patterns 2, 2 as signal lines.
JP11417288A 1987-05-15 1988-05-11 Multilayer interconnection board Pending JPS6453498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11417288A JPS6453498A (en) 1987-05-15 1988-05-11 Multilayer interconnection board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11704587 1987-05-15
JP11417288A JPS6453498A (en) 1987-05-15 1988-05-11 Multilayer interconnection board

Publications (1)

Publication Number Publication Date
JPS6453498A true JPS6453498A (en) 1989-03-01

Family

ID=26452996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11417288A Pending JPS6453498A (en) 1987-05-15 1988-05-11 Multilayer interconnection board

Country Status (1)

Country Link
JP (1) JPS6453498A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633715A3 (en) * 1989-02-21 1995-07-26 Tatsuta Densen Kk Printed circuit board.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144969A (en) * 1978-05-01 1979-11-12 Tektronix Inc Multilayer circuit board and method of producing same
JPS5529276U (en) * 1978-08-16 1980-02-26
JPS6127697A (en) * 1984-07-18 1986-02-07 日本シイエムケイ株式会社 One-side printed circuit board and method of producing same
JPS6240860B2 (en) * 1982-05-19 1987-08-31 Mitsubishi Metal Corp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144969A (en) * 1978-05-01 1979-11-12 Tektronix Inc Multilayer circuit board and method of producing same
JPS5529276U (en) * 1978-08-16 1980-02-26
JPS6240860B2 (en) * 1982-05-19 1987-08-31 Mitsubishi Metal Corp
JPS6127697A (en) * 1984-07-18 1986-02-07 日本シイエムケイ株式会社 One-side printed circuit board and method of producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633715A3 (en) * 1989-02-21 1995-07-26 Tatsuta Densen Kk Printed circuit board.

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