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JPS645041A - Manufacture of ceramic body having superconducting circuit pattern - Google Patents

Manufacture of ceramic body having superconducting circuit pattern

Info

Publication number
JPS645041A
JPS645041A JP62161658A JP16165887A JPS645041A JP S645041 A JPS645041 A JP S645041A JP 62161658 A JP62161658 A JP 62161658A JP 16165887 A JP16165887 A JP 16165887A JP S645041 A JPS645041 A JP S645041A
Authority
JP
Japan
Prior art keywords
paste layer
circuit pattern
superconducting
providing
ceramic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62161658A
Other languages
Japanese (ja)
Inventor
Fumio Miyagawa
Sugio Uchida
Toshiichi Takenouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP62161658A priority Critical patent/JPS645041A/en
Publication of JPS645041A publication Critical patent/JPS645041A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

PURPOSE:To provide a superconducting circuit pattern on the surface of or within a ceramic body, by integrally baking a green sheet having a paste layer for providing an upper circuit pattern and a superconducting paste layer for providing an uppermost circuit pattern. CONSTITUTION:A green sheet having a paste layer for providing an intermediate layer 20, a paste layer A for providing an upper circuit pattern 30, a paste layer B for providing an uppermost circuit pattern 40 and a superconducting paste layer 5 is integrally baked at a low temperature. The paste layer A is produced by mixing powder of an oxide of a component of a superconducting material such as yttrium, barium or the like with a binder and a solvent. The paste layer B is produced by temporarily baking a superconducting composition at a low temperature, crushing it into powder and mixing the powder, with a binder and a solvent. Thereby, superconducting circuit patterns can be formed on the surface of and within a ceramic body.
JP62161658A 1987-06-29 1987-06-29 Manufacture of ceramic body having superconducting circuit pattern Pending JPS645041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62161658A JPS645041A (en) 1987-06-29 1987-06-29 Manufacture of ceramic body having superconducting circuit pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62161658A JPS645041A (en) 1987-06-29 1987-06-29 Manufacture of ceramic body having superconducting circuit pattern

Publications (1)

Publication Number Publication Date
JPS645041A true JPS645041A (en) 1989-01-10

Family

ID=15739369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62161658A Pending JPS645041A (en) 1987-06-29 1987-06-29 Manufacture of ceramic body having superconducting circuit pattern

Country Status (1)

Country Link
JP (1) JPS645041A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489493A (en) * 1987-09-30 1989-04-03 Fujitsu Ltd Formation of superconductive film pattern
JPH0196989A (en) * 1987-10-09 1989-04-14 Sumitomo Electric Ind Ltd Superconducting circuit substrate and manufacture thereof
JPH03167861A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03167848A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03167863A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03167862A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03167849A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03167857A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03167865A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03173157A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for storing semiconductor elements
JPH03173160A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for storing semiconductor elements
JP2002353353A (en) * 2001-05-22 2002-12-06 Kyocera Corp Package for storing semiconductor elements

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489493A (en) * 1987-09-30 1989-04-03 Fujitsu Ltd Formation of superconductive film pattern
JPH0196989A (en) * 1987-10-09 1989-04-14 Sumitomo Electric Ind Ltd Superconducting circuit substrate and manufacture thereof
JPH03167861A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03167848A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03167863A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03167862A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for semiconductor-element
JPH03167849A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03167857A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03167865A (en) * 1989-11-27 1991-07-19 Kyocera Corp Package for storing semiconductor elements
JPH03173157A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for storing semiconductor elements
JPH03173160A (en) * 1989-11-30 1991-07-26 Kyocera Corp Package for storing semiconductor elements
JP2002353353A (en) * 2001-05-22 2002-12-06 Kyocera Corp Package for storing semiconductor elements

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