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JPS6448496A - Soldering device for flat package ic - Google Patents

Soldering device for flat package ic

Info

Publication number
JPS6448496A
JPS6448496A JP20545387A JP20545387A JPS6448496A JP S6448496 A JPS6448496 A JP S6448496A JP 20545387 A JP20545387 A JP 20545387A JP 20545387 A JP20545387 A JP 20545387A JP S6448496 A JPS6448496 A JP S6448496A
Authority
JP
Japan
Prior art keywords
heater chip
soldering
solder
pattern
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20545387A
Other languages
Japanese (ja)
Inventor
Tadashi Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20545387A priority Critical patent/JPS6448496A/en
Publication of JPS6448496A publication Critical patent/JPS6448496A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To ensure a soldering at a lower heater chip temperature and improve reliability, by soldering while forming a step at the bottom end of a heater chip so that a solder can directly be heated and pressurized. CONSTITUTION:By forming a step at the bottom end of a heater chip 28, both a lead 12a and a solder 37 placed on a pattern are directly heated and pressurized by a heater chip 28. This improves heat transfer efficiency to the solder, contributing 10 shortening the heating time by the heater chip 28 and lowering the heater chip temperature. According to the constitution, which precludes fears of: shorter life of the heater chip; generation of interlayer and pattern peelings caused by moisture evaporation between printed wiring board layers as well as between the printed wiring board and the pattern; or incomplete soldering by improper heat transfer caused by adhesion of carbonized fluxes, the reliability of the printed wiring board is improved.
JP20545387A 1987-08-19 1987-08-19 Soldering device for flat package ic Pending JPS6448496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20545387A JPS6448496A (en) 1987-08-19 1987-08-19 Soldering device for flat package ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20545387A JPS6448496A (en) 1987-08-19 1987-08-19 Soldering device for flat package ic

Publications (1)

Publication Number Publication Date
JPS6448496A true JPS6448496A (en) 1989-02-22

Family

ID=16507130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20545387A Pending JPS6448496A (en) 1987-08-19 1987-08-19 Soldering device for flat package ic

Country Status (1)

Country Link
JP (1) JPS6448496A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0391990A (en) * 1989-09-05 1991-04-17 Seiko Epson Corp Bonding method and bonding device for semiconductor devices
JPH06196854A (en) * 1992-12-22 1994-07-15 Yamaha Corp Loading and unloading jig

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0391990A (en) * 1989-09-05 1991-04-17 Seiko Epson Corp Bonding method and bonding device for semiconductor devices
JPH06196854A (en) * 1992-12-22 1994-07-15 Yamaha Corp Loading and unloading jig

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