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JPS644614A - Thermosetting epoxy resin composition - Google Patents

Thermosetting epoxy resin composition

Info

Publication number
JPS644614A
JPS644614A JP15898887A JP15898887A JPS644614A JP S644614 A JPS644614 A JP S644614A JP 15898887 A JP15898887 A JP 15898887A JP 15898887 A JP15898887 A JP 15898887A JP S644614 A JPS644614 A JP S644614A
Authority
JP
Japan
Prior art keywords
epoxy resin
particles
powder
resin composition
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15898887A
Other languages
Japanese (ja)
Other versions
JPH0655805B2 (en
Inventor
Toshio Oba
Yoshinori Iguchi
Koji Futatsumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP62158988A priority Critical patent/JPH0655805B2/en
Publication of JPS644614A publication Critical patent/JPS644614A/en
Publication of JPH0655805B2 publication Critical patent/JPH0655805B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the title compsn. which gives packages of electronic and electrical components wherein cracks hardly occur during cooling-heating cycles and which has excellent moisture resistance, comprising an epoxy resin, a curing agent and powder of specific silicon elastomer particles. CONSTITUTION:The title compsn. is obtd. by compounding 100pts.wt. epoxy resin (A), 1-100pts.wt. curing agent (e.g., phenol novolac resin) (B) and 1-50pts. wt. powder (C) of silicone elastomer particles contg. 0.001-10wt.% surface active agent (e.g., polyoxyethylene alkyl ether) per wt. of the particles on the surface and/or inside the particles of a size of 50mum or less.
JP62158988A 1987-06-26 1987-06-26 Thermosetting epoxy resin composition Expired - Lifetime JPH0655805B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62158988A JPH0655805B2 (en) 1987-06-26 1987-06-26 Thermosetting epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62158988A JPH0655805B2 (en) 1987-06-26 1987-06-26 Thermosetting epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS644614A true JPS644614A (en) 1989-01-09
JPH0655805B2 JPH0655805B2 (en) 1994-07-27

Family

ID=15683761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62158988A Expired - Lifetime JPH0655805B2 (en) 1987-06-26 1987-06-26 Thermosetting epoxy resin composition

Country Status (1)

Country Link
JP (1) JPH0655805B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189357A (en) * 1989-01-19 1990-07-25 Matsushita Electric Works Ltd Epoxy resin molding material for semiconductor sealing
EP0488374A2 (en) * 1990-11-30 1992-06-03 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions and cured products thereof
US5157061A (en) * 1988-04-05 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Epoxy resin containing an epoxy resin-modified silicone oil flexibilizer
EP0685508A1 (en) 1994-05-27 1995-12-06 Dow Corning Toray Silicone Company, Limited Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition
US6239245B1 (en) 1999-03-02 2001-05-29 Dow Corning Toray Silicone Company, Ltd. Resin additive, curable resin composition, and cured resin
KR101321302B1 (en) * 2011-11-15 2013-10-28 삼성전기주식회사 Epoxy resin composition for formaing printed circuit board, printed circuit board produced by the same, and production method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426283B2 (en) 2020-04-28 2024-02-01 信越化学工業株式会社 Polyether/polysiloxane crosslinked rubber spherical particles and method for producing the same, polyether/polysiloxane crosslinked composite particles and method for producing the same
JP2023007034A (en) 2021-07-01 2023-01-18 信越化学工業株式会社 Liquid composition for silicone rubber spherical particles, silicone rubber spherical particles and production method therefor, and silicone composite particles, and production method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065023A (en) * 1983-09-20 1985-04-13 Toshiba Corp Epoxy resin composition
JPS63309515A (en) * 1987-06-12 1988-12-16 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065023A (en) * 1983-09-20 1985-04-13 Toshiba Corp Epoxy resin composition
JPS63309515A (en) * 1987-06-12 1988-12-16 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157061A (en) * 1988-04-05 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Epoxy resin containing an epoxy resin-modified silicone oil flexibilizer
US5306747A (en) * 1988-04-05 1994-04-26 Mitsubishi Denki Kabushiki Kaisha Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and epoxy silicone oil-phenol resin product
JPH02189357A (en) * 1989-01-19 1990-07-25 Matsushita Electric Works Ltd Epoxy resin molding material for semiconductor sealing
EP0488374A2 (en) * 1990-11-30 1992-06-03 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions and cured products thereof
US5225484A (en) * 1990-11-30 1993-07-06 Shin-Etsu Chemical Co., Ltd Epoxy resin compositions and cured products thereof
EP0685508A1 (en) 1994-05-27 1995-12-06 Dow Corning Toray Silicone Company, Limited Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition
US5691401A (en) * 1994-05-27 1997-11-25 Dow Corning Toray Silicone Co., Ltd. Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition
US6239245B1 (en) 1999-03-02 2001-05-29 Dow Corning Toray Silicone Company, Ltd. Resin additive, curable resin composition, and cured resin
KR101321302B1 (en) * 2011-11-15 2013-10-28 삼성전기주식회사 Epoxy resin composition for formaing printed circuit board, printed circuit board produced by the same, and production method thereof

Also Published As

Publication number Publication date
JPH0655805B2 (en) 1994-07-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term