JPS644499A - Method and device for rotary plating - Google Patents
Method and device for rotary platingInfo
- Publication number
- JPS644499A JPS644499A JP15669287A JP15669287A JPS644499A JP S644499 A JPS644499 A JP S644499A JP 15669287 A JP15669287 A JP 15669287A JP 15669287 A JP15669287 A JP 15669287A JP S644499 A JPS644499 A JP S644499A
- Authority
- JP
- Japan
- Prior art keywords
- materials
- rotated
- plated
- jig
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE:To easily, efficiently, and uniformly electroplating each material to be plated separately or altogether by connecting plural materials to be plated in the axial direction of rotation, holding the materials in a plating soln., and revolving and rotating the materials with respect to an anode. CONSTITUTION:An anode plate 21 is arranged along the inner periphery of a plating bath 2 set on a rack 1 and contg. a plating soln., and connected to the positive pole of a DC power source. The upper and lower supporting plates 8 and 13 of the rotating shaft 4 provided along the center axis of the plating bath 2 are set, and a rotatable rod-shaped jig 16 connecting and holding plural materials 22 to be plated is set between the plates 8 and 13 around and in parallel with the center axis. The shaft 4 is rotated by a motor 7 through a bevel gear mechanism 5, and the jig 16 is revolved and rotated through a gear 9 and a pinion 19. The material 22 is simultaneously connected to the negative pole of the DC power source through the jig 16, a rotary connector 20, the upper rotary supporting plate 8, the rotating shaft 4, and a rotary conductive box 6. As a result, the material 22 is rotated and electroplated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15669287A JPS644499A (en) | 1987-06-25 | 1987-06-25 | Method and device for rotary plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15669287A JPS644499A (en) | 1987-06-25 | 1987-06-25 | Method and device for rotary plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS644499A true JPS644499A (en) | 1989-01-09 |
Family
ID=15633249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15669287A Pending JPS644499A (en) | 1987-06-25 | 1987-06-25 | Method and device for rotary plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS644499A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5472592A (en) * | 1994-07-19 | 1995-12-05 | American Plating Systems | Electrolytic plating apparatus and method |
| DE4419984A1 (en) * | 1994-06-08 | 1995-12-14 | Mtu Muenchen Gmbh | Electroplating magazine for coating components |
| JP2002146582A (en) * | 2000-11-14 | 2002-05-22 | Electro Forging Research:Kk | Core wire holder used for manufacture of metallic ferrule and apparatus for manufacturing ferrule including the same |
| JP2008267865A (en) * | 2007-04-17 | 2008-11-06 | Toshiba Corp | Manufacturing method and manufacturing equipment of magnetostriction-type torque sensor shaft |
| JP2009515367A (en) * | 2005-11-09 | 2009-04-09 | 謝 清雄 | Manufacturing method of surface mount type precision resistor |
| US7850830B2 (en) | 2007-05-11 | 2010-12-14 | Lacks Enterprises, Inc. | Method and apparatus for racking articles for surface treatment |
-
1987
- 1987-06-25 JP JP15669287A patent/JPS644499A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4419984A1 (en) * | 1994-06-08 | 1995-12-14 | Mtu Muenchen Gmbh | Electroplating magazine for coating components |
| US5472592A (en) * | 1994-07-19 | 1995-12-05 | American Plating Systems | Electrolytic plating apparatus and method |
| JP2002146582A (en) * | 2000-11-14 | 2002-05-22 | Electro Forging Research:Kk | Core wire holder used for manufacture of metallic ferrule and apparatus for manufacturing ferrule including the same |
| JP2009515367A (en) * | 2005-11-09 | 2009-04-09 | 謝 清雄 | Manufacturing method of surface mount type precision resistor |
| JP2008267865A (en) * | 2007-04-17 | 2008-11-06 | Toshiba Corp | Manufacturing method and manufacturing equipment of magnetostriction-type torque sensor shaft |
| US7850830B2 (en) | 2007-05-11 | 2010-12-14 | Lacks Enterprises, Inc. | Method and apparatus for racking articles for surface treatment |
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