JPS6442153A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6442153A JPS6442153A JP62198106A JP19810687A JPS6442153A JP S6442153 A JPS6442153 A JP S6442153A JP 62198106 A JP62198106 A JP 62198106A JP 19810687 A JP19810687 A JP 19810687A JP S6442153 A JPS6442153 A JP S6442153A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- barrier metal
- bump
- passivation film
- etchant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 230000004888 barrier function Effects 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 7
- 238000002161 passivation Methods 0.000 abstract 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract 2
- 239000011574 phosphorus Substances 0.000 abstract 2
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000001039 wet etching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Weting (AREA)
Abstract
PURPOSE:To increase an adhesion intensity of a bump with a substrate without eroding a phosphorus glass film at the time of wet etching of a barrier metal layer, by extending the barrier metal layer outside an outer edge of a contact surface between the bump and the barrier metal layer. CONSTITUTION:A barrier metal layer 12 is constructed such that it extends outside an outer edge of a contact surface between a bump 13 and the a barrier metal layer 12. Therefore, when the barrier metal layer 12 is formed by etching, etchant is not soaked into a vertical interface between the barrier metal layer 12 positioned right beneath a lateral face of the bump and a passivation film 11. As a result, since a phosphorus glass film 11a serving as a lower layer of the passivation film 11 does not react with the etchant, it is possible to prevent the decrease in adhesion intensity of the bump and the decrease in characteristics due to the exposure of an Al pad 10 beneath the passivation film 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62198106A JPS6442153A (en) | 1987-08-10 | 1987-08-10 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62198106A JPS6442153A (en) | 1987-08-10 | 1987-08-10 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6442153A true JPS6442153A (en) | 1989-02-14 |
Family
ID=16385587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62198106A Pending JPS6442153A (en) | 1987-08-10 | 1987-08-10 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6442153A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5661081A (en) * | 1994-09-30 | 1997-08-26 | United Microelectronics Corporation | Method of bonding an aluminum wire to an intergrated circuit bond pad |
-
1987
- 1987-08-10 JP JP62198106A patent/JPS6442153A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5661081A (en) * | 1994-09-30 | 1997-08-26 | United Microelectronics Corporation | Method of bonding an aluminum wire to an intergrated circuit bond pad |
| US5734200A (en) * | 1994-09-30 | 1998-03-31 | United Microelectronics Corporation | Polycide bonding pad structure |
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