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JPS6441254A - Resin-sealed type semiconductor device - Google Patents

Resin-sealed type semiconductor device

Info

Publication number
JPS6441254A
JPS6441254A JP62197608A JP19760887A JPS6441254A JP S6441254 A JPS6441254 A JP S6441254A JP 62197608 A JP62197608 A JP 62197608A JP 19760887 A JP19760887 A JP 19760887A JP S6441254 A JPS6441254 A JP S6441254A
Authority
JP
Japan
Prior art keywords
resin
substrate
main surface
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62197608A
Other languages
Japanese (ja)
Other versions
JPH0779149B2 (en
Inventor
Harumi Mizunashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62197608A priority Critical patent/JPH0779149B2/en
Publication of JPS6441254A publication Critical patent/JPS6441254A/en
Publication of JPH0779149B2 publication Critical patent/JPH0779149B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/884—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the adhesion between thermosetting resin and an electrically insulative substrate, by forming the thermosetting resin from the substrate side-surface or the substrate through hole to the part exceeding the other main surface. CONSTITUTION:On one main surface of an electrically insulative substrate 7, a semiconductor pellet 2 is fixed and transfer molded in the manner in which the main surface is covered by thermosetting resin 1. Thus a resin-seal type semiconductor device is formed. The resin 1 is formed from 1 side surface of the substrate 7 or a through hole of the substrate 7 to a part exceeding the other main surface. Thus, the exfoliation does not occur at the bonded part, even if 500 cycles of temperature cycle (from -65 deg.CX20 min to 150 deg.CX20 min) are applied. Thereby, the adhesion between the resin 1 and the substrate 7 can be improved.
JP62197608A 1987-08-07 1987-08-07 Resin-sealed semiconductor device Expired - Lifetime JPH0779149B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62197608A JPH0779149B2 (en) 1987-08-07 1987-08-07 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62197608A JPH0779149B2 (en) 1987-08-07 1987-08-07 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS6441254A true JPS6441254A (en) 1989-02-13
JPH0779149B2 JPH0779149B2 (en) 1995-08-23

Family

ID=16377301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62197608A Expired - Lifetime JPH0779149B2 (en) 1987-08-07 1987-08-07 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH0779149B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0657921A1 (en) * 1993-12-06 1995-06-14 Fujitsu Limited Semiconductor device and method of producing the same
WO1996001495A1 (en) * 1994-07-01 1996-01-18 Fico B.V. Method, carrier and mould parts for encapsulating a chip
US6379997B1 (en) 1993-12-06 2002-04-30 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0657921A1 (en) * 1993-12-06 1995-06-14 Fujitsu Limited Semiconductor device and method of producing the same
US5679978A (en) * 1993-12-06 1997-10-21 Fujitsu Limited Semiconductor device having resin gate hole through substrate for resin encapsulation
US5804467A (en) * 1993-12-06 1998-09-08 Fujistsu Limited Semiconductor device and method of producing the same
US6379997B1 (en) 1993-12-06 2002-04-30 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
WO1996001495A1 (en) * 1994-07-01 1996-01-18 Fico B.V. Method, carrier and mould parts for encapsulating a chip
NL9401104A (en) * 1994-07-01 1996-02-01 Fico Bv Method, carrier and mold parts for encapsulating a chip.

Also Published As

Publication number Publication date
JPH0779149B2 (en) 1995-08-23

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