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JPS6440170A - Automatic soldering device - Google Patents

Automatic soldering device

Info

Publication number
JPS6440170A
JPS6440170A JP19493787A JP19493787A JPS6440170A JP S6440170 A JPS6440170 A JP S6440170A JP 19493787 A JP19493787 A JP 19493787A JP 19493787 A JP19493787 A JP 19493787A JP S6440170 A JPS6440170 A JP S6440170A
Authority
JP
Japan
Prior art keywords
passing
liquid
tank
inert gas
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19493787A
Other languages
Japanese (ja)
Inventor
Yunosuke Sugiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUGIYAMAMOTO IRIKI KK
Original Assignee
SUGIYAMAMOTO IRIKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUGIYAMAMOTO IRIKI KK filed Critical SUGIYAMAMOTO IRIKI KK
Priority to JP19493787A priority Critical patent/JPS6440170A/en
Publication of JPS6440170A publication Critical patent/JPS6440170A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To minimize the necessary consumption of an inert gas and to enable soldering under an oxygen free atm. by sealing the inlet port and outlet port of a conveyor by a liquid and filling up the inert gas in a gaseous phase chamber. CONSTITUTION:When a conveyor device 6 is driven, the body 7 to be soldered comes into a liquid tank 5a, is transferred along the bottom of the liquid tank 5a inside with passing through a liquid 17, coming into the gaseous phase chamber 13 where an inert gas is filled up by passing an inlet port 15. It is then soldered by coming into contact with the surface of a solder bath 4 while passing through the upper part of a holder tank 1 and sent out to the outside of the tank by passing the outlet port 16 of a liquid tank 5b. The soldering is thus executed continuously and automatically under the oxygen free atm.
JP19493787A 1987-08-04 1987-08-04 Automatic soldering device Pending JPS6440170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19493787A JPS6440170A (en) 1987-08-04 1987-08-04 Automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19493787A JPS6440170A (en) 1987-08-04 1987-08-04 Automatic soldering device

Publications (1)

Publication Number Publication Date
JPS6440170A true JPS6440170A (en) 1989-02-10

Family

ID=16332818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19493787A Pending JPS6440170A (en) 1987-08-04 1987-08-04 Automatic soldering device

Country Status (1)

Country Link
JP (1) JPS6440170A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350789A (en) * 1989-07-18 1991-03-05 Murata Mfg Co Ltd Soldering of electronic component device
JPH0494154U (en) * 1991-01-09 1992-08-14
JPH0524155U (en) * 1991-05-14 1993-03-30 日本電熱計器株式会社 Soldering equipment
JPH0592259A (en) * 1991-09-30 1993-04-16 Osaka Asahi Kagaku Kk Soldering device in atmosphere of inert gas
JP2014533438A (en) * 2011-11-11 2014-12-11 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Method and apparatus for wafer level solder hermetic encapsulation of MEMS devices

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350789A (en) * 1989-07-18 1991-03-05 Murata Mfg Co Ltd Soldering of electronic component device
JPH0494154U (en) * 1991-01-09 1992-08-14
JPH0524155U (en) * 1991-05-14 1993-03-30 日本電熱計器株式会社 Soldering equipment
JPH0592259A (en) * 1991-09-30 1993-04-16 Osaka Asahi Kagaku Kk Soldering device in atmosphere of inert gas
JP2014533438A (en) * 2011-11-11 2014-12-11 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Method and apparatus for wafer level solder hermetic encapsulation of MEMS devices

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