JPS6437898A - Cooling module - Google Patents
Cooling moduleInfo
- Publication number
- JPS6437898A JPS6437898A JP19491587A JP19491587A JPS6437898A JP S6437898 A JPS6437898 A JP S6437898A JP 19491587 A JP19491587 A JP 19491587A JP 19491587 A JP19491587 A JP 19491587A JP S6437898 A JPS6437898 A JP S6437898A
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- air duct
- lsis
- condenser
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title abstract 5
- 239000003507 refrigerant Substances 0.000 abstract 7
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To conduct cooling without dipping into a refrigerant while obtaining high cooling performance by dropping the refrigerant to a pan, cooling a high- density integrated element by the heat of vaporization of the regrigerant and liquefying and circulating the vaporized refrigerant. CONSTITUTION:Pans 14 are fixed onto the top faces of LSIs 1-2 mounted to a printed board 1 and a vessel 12 to the top-face opening section 15a of an air duct 15 so than the LSIs 1-2 and dripping holes 120-1 are faced oppositely in the underside opening section 15b of the air duct 15. A condenser 16 is disposed to an outlet for the air duct 15, and coupled by a circulating pipe 17 in which a pump is arranged between the lower section of the condenser 16 and the vessel 12. A refrigerant 3 is dropped onto the pans 14 from the dripping holes 12-1, the refrigerant 3 is vaporized by the heat of the LSIs 1-2 and air flowing in the air duct 15 and the LSIs 1-2 are cooled, the vaporized refrigerant 3 is guided to the condenser 16 by the air duct 15 and liquefied again, and the liquefied refrigerant is forwarded to the vessel 16. Accordingly, high cooling performance can be acquired.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19491587A JPS6437898A (en) | 1987-08-03 | 1987-08-03 | Cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19491587A JPS6437898A (en) | 1987-08-03 | 1987-08-03 | Cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437898A true JPS6437898A (en) | 1989-02-08 |
Family
ID=16332458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19491587A Pending JPS6437898A (en) | 1987-08-03 | 1987-08-03 | Cooling module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437898A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0354111A (en) * | 1989-07-19 | 1991-03-08 | Kansai Coke & Chem Co Ltd | Production of sic fine powder |
| WO2006075493A1 (en) * | 2004-12-22 | 2006-07-20 | Tokyo University Of Science Educational Foundation Administrative Organization | Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
| US8953320B2 (en) | 2012-09-13 | 2015-02-10 | Levi A. Campbell | Coolant drip facilitating partial immersion-cooling of electronic components |
-
1987
- 1987-08-03 JP JP19491587A patent/JPS6437898A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0354111A (en) * | 1989-07-19 | 1991-03-08 | Kansai Coke & Chem Co Ltd | Production of sic fine powder |
| WO2006075493A1 (en) * | 2004-12-22 | 2006-07-20 | Tokyo University Of Science Educational Foundation Administrative Organization | Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
| US8061414B2 (en) | 2004-12-22 | 2011-11-22 | Tokyo University Of Science Educational Foundation Administrative Organization | Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof |
| US8953320B2 (en) | 2012-09-13 | 2015-02-10 | Levi A. Campbell | Coolant drip facilitating partial immersion-cooling of electronic components |
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