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JPS6437041A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6437041A
JPS6437041A JP19283687A JP19283687A JPS6437041A JP S6437041 A JPS6437041 A JP S6437041A JP 19283687 A JP19283687 A JP 19283687A JP 19283687 A JP19283687 A JP 19283687A JP S6437041 A JPS6437041 A JP S6437041A
Authority
JP
Japan
Prior art keywords
worker
knob
package
removal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19283687A
Other languages
Japanese (ja)
Inventor
Akihiro Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19283687A priority Critical patent/JPS6437041A/en
Publication of JPS6437041A publication Critical patent/JPS6437041A/en
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Abstract

PURPOSE:To allow insertion and removal by a worker to be accomplished with facility and to prevent a circuit from static breakdown attributable to static electricity coming from the worker by a method wherein a knob is provided to protrude from the package surface. CONSTITUTION:A knob 12 with a T-shaped cross section is provided on the surface of a package 11 and the knob 12 is held for the insertion or removal of the package 11. Contact with a lead 13 may be prevented when the worker holds the knob 12 because it is remote from the lead 13. This facilitates the insertion into a substrate and insertion into or removal from a socket of the package 11 by a worker. In this method, the lead 13 is kept from human contact, which protects a circuit from breakdown attributable to static electricity that may otherwise be supplied from the worker.
JP19283687A 1987-07-31 1987-07-31 Semiconductor device Pending JPS6437041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19283687A JPS6437041A (en) 1987-07-31 1987-07-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19283687A JPS6437041A (en) 1987-07-31 1987-07-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6437041A true JPS6437041A (en) 1989-02-07

Family

ID=16297788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19283687A Pending JPS6437041A (en) 1987-07-31 1987-07-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6437041A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670429A (en) * 1993-06-30 1997-09-23 Rohm Co. Ltd. Process of conveying an encapsulated electronic component by engaging an integral resin projection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670429A (en) * 1993-06-30 1997-09-23 Rohm Co. Ltd. Process of conveying an encapsulated electronic component by engaging an integral resin projection
US5739054A (en) * 1993-06-30 1998-04-14 Rohm Co., Ltd. Process for forming an encapsulated electronic component having an integral resin projection
US5760481A (en) * 1993-06-30 1998-06-02 Rohm Co., Ltd. Encapsulated electronic component containing a holding member

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