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JPS6436056A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6436056A
JPS6436056A JP19046387A JP19046387A JPS6436056A JP S6436056 A JPS6436056 A JP S6436056A JP 19046387 A JP19046387 A JP 19046387A JP 19046387 A JP19046387 A JP 19046387A JP S6436056 A JPS6436056 A JP S6436056A
Authority
JP
Japan
Prior art keywords
package
elastic material
semiconductor device
island
cracking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19046387A
Other languages
Japanese (ja)
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP19046387A priority Critical patent/JPS6436056A/en
Publication of JPS6436056A publication Critical patent/JPS6436056A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To absorb stress pressured by water or the like to prevent a package from cracking, by forming a permanent elastic material of foamed silicon or polyimide resin on an rear of an island on which a semiconductor element is stuck. CONSTITUTION:A permanent elastic material 7 of foamed silicon or polyimide resin is formed on a rear of an island 1 of a semiconductor device. This elastic material 7 functions to hold elasticity permanently and to absorb a pressure of a steam gas which is expanded inside a package by heated/pressured steam of water or the like. Hence the package is prevented from cracking.
JP19046387A 1987-07-31 1987-07-31 Semiconductor device Pending JPS6436056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19046387A JPS6436056A (en) 1987-07-31 1987-07-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19046387A JPS6436056A (en) 1987-07-31 1987-07-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6436056A true JPS6436056A (en) 1989-02-07

Family

ID=16258535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19046387A Pending JPS6436056A (en) 1987-07-31 1987-07-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6436056A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182630A (en) * 1991-02-13 1993-01-26 Sharp Kabushiki Kaisha Semiconductor device having a particular shaped die pad and coated lower surface
EP0504634A3 (en) * 1991-03-08 1994-06-01 Japan Gore Tex Inc Resin-sealed semiconductor device containing porous fluorocarbon resin
JP2008007944A (en) * 2006-06-27 2008-01-17 Yamato Protec Co Pollution liquid spray device, and liquid ejection nozzle for pollution liquid spray device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182630A (en) * 1991-02-13 1993-01-26 Sharp Kabushiki Kaisha Semiconductor device having a particular shaped die pad and coated lower surface
EP0504634A3 (en) * 1991-03-08 1994-06-01 Japan Gore Tex Inc Resin-sealed semiconductor device containing porous fluorocarbon resin
US5446315A (en) * 1991-03-08 1995-08-29 Japan Gore-Tex, Inc. Resin-sealed semiconductor device containing porous fluorocarbon resin
JP2008007944A (en) * 2006-06-27 2008-01-17 Yamato Protec Co Pollution liquid spray device, and liquid ejection nozzle for pollution liquid spray device

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