JPS6436036A - Detection of defective mounting of chip component - Google Patents
Detection of defective mounting of chip componentInfo
- Publication number
- JPS6436036A JPS6436036A JP62190112A JP19011287A JPS6436036A JP S6436036 A JPS6436036 A JP S6436036A JP 62190112 A JP62190112 A JP 62190112A JP 19011287 A JP19011287 A JP 19011287A JP S6436036 A JPS6436036 A JP S6436036A
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- adhesive
- substrate
- defective mounting
- darkroom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002950 deficient Effects 0.000 title abstract 4
- 238000001514 detection method Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 6
- 230000001070 adhesive effect Effects 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 238000006073 displacement reaction Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To easily and surely detect defective mounting of a chip component such as omission, displacement, detachment or the like by a method wherein an adhesive mixed with a fluorescent agant is coated on a part to mount the chip component and the existence of fluorescence is observed in a darkroom. CONSTITUTION:A recessed part 5 to house a substrate 1 is made on an upper face of a darkroom 4. An adhesive 2 is coated on a part to mount a chip component 3 on the substrate 1. The chip component 3 is pressed onto the part to mount the component and coated with the adhesive 2. The substrate 1 where the chip component 3 is mounted is housed in the recessed part 5 of the darkroom 4 and is observed visually from an upper part of the recessed part 5. During this process, if the chip component 3 is mounted on the prescribed part, the chip component 3 covers the adhesive 2 and the fluorescence of the adhesive 2 is shut off and cannot be confirmed visually; it is detected that no defective mounting exists. To the contrary, if the chip component 3 is detached as indicated by B, the adhesive 2 is exposed on the surface of the substrate 1, its fluorescence can be confirmed visually, and the defective mounting can be detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62190112A JPS6436036A (en) | 1987-07-31 | 1987-07-31 | Detection of defective mounting of chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62190112A JPS6436036A (en) | 1987-07-31 | 1987-07-31 | Detection of defective mounting of chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436036A true JPS6436036A (en) | 1989-02-07 |
Family
ID=16252578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62190112A Pending JPS6436036A (en) | 1987-07-31 | 1987-07-31 | Detection of defective mounting of chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436036A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6914267B2 (en) | 1999-06-23 | 2005-07-05 | Citizen Electronics Co. Ltd. | Light emitting diode |
-
1987
- 1987-07-31 JP JP62190112A patent/JPS6436036A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6914267B2 (en) | 1999-06-23 | 2005-07-05 | Citizen Electronics Co. Ltd. | Light emitting diode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0261642A3 (en) | Method for detecting a component of a biological system and detection device and a kit therefor | |
| DE68929069D1 (en) | Process for the thermal structuring of semiconductor substrates | |
| EP0236738A3 (en) | Input method for reference printed circuit board assembly data to an image processing printed circuit board assembly automatic inspection apparatus | |
| TW335503B (en) | Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method | |
| ES1030898U (en) | Reading devices for teststrips | |
| EP0741303A3 (en) | Apparatus for detecting defects of wires in a wiring board | |
| ES8107310A1 (en) | Chromogenic compounds and their use as enzymatic substrates. | |
| CA1031676A (en) | Method and reagent for the enzyme kinetic determination of the concentration of a substrate | |
| FR2411490A1 (en) | ELECTRICAL DEVICE CHEMOSENSITIVE STRUCTURE AND ITS MANUFACTURING PROCESS | |
| JPS561897A (en) | Powdery substrate composition | |
| AU8225582A (en) | Prepared nutrient substrate carrier for the qualitative and quantitative determination of microorganisms | |
| AU2345201A (en) | Semiconductor component, electronic component, sensor system and method for producing a semiconductor component | |
| JPS6436036A (en) | Detection of defective mounting of chip component | |
| EP0283613A3 (en) | Dry test strip suitable for oxygen demanding detection system | |
| ATE52636T1 (en) | PROCESSES FOR FABRICATION OF INTEGRATED CIRCUITS INCLUDING GETTER SITE DETECTION STEPS. | |
| MY129942A (en) | Method and apparatus for connecting a semiconductor chip to a carrier. | |
| WO2000023182A3 (en) | Method of bonding bio-molecules to a test site | |
| AU8181882A (en) | Irradiated immunological carrier and preparation | |
| ZA865767B (en) | Homogeneous process for the detection and/or determination by luminescence of an analyte in a medium in which it may be present | |
| EP0242029A3 (en) | Method and articles employing ion exchange material | |
| KR960008895B1 (en) | Manufacturing method of substrate for descrete device and the apparatus and the substrate | |
| DE3786323D1 (en) | DEVICE AND METHOD FOR REGULATING THE STRUCTURE OF OPTICAL SUBSTRATES. | |
| DE3786362D1 (en) | SUBSTRATES COATED WITH SOLVED METAL PARTICLE UNITS. | |
| JPS6418471A (en) | Method for detecting predetermined point in drawn wire | |
| JPS6473203A (en) | Inspection of surface foreign matter |