JPS6431466A - Forming method for silicon thin film for thin film transistor - Google Patents
Forming method for silicon thin film for thin film transistorInfo
- Publication number
- JPS6431466A JPS6431466A JP62187345A JP18734587A JPS6431466A JP S6431466 A JPS6431466 A JP S6431466A JP 62187345 A JP62187345 A JP 62187345A JP 18734587 A JP18734587 A JP 18734587A JP S6431466 A JPS6431466 A JP S6431466A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- silicon
- silicon thin
- target
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To obtain a silicon thin film transistor having a high carrier mobility and capable of controlling a threshold voltage to a low value by discharging in inert gas added with hydrogen gas of specific molar % to generate ions, colliding them to the surface of a target to deposit discharged silicon atoms on a substrate, and annealing it for a specific length of time. CONSTITUTION:One or more of inert gases, such as helium, neon, argon, xenon, krypton and the like are mixed, and 1-50mol% of hydrogen gas is further mixed as sputtering gas. When a negative DC voltage or high frequency voltage is applied to an electrode 22, a glow discharge is generated to generate ions from the inert atmospheric gas to collide with the surface of a target 23 made of silicon. As a result, the silicon atoms are expelled out from the target 23 to form a silicon thin film on an insulating substrate 26. Then, the silicon thin film is annealed for a short time, such as 10 sec or less of heating time by a light radiating method of a laser to form a polycrystalline state.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187345A JPS6431466A (en) | 1987-07-27 | 1987-07-27 | Forming method for silicon thin film for thin film transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187345A JPS6431466A (en) | 1987-07-27 | 1987-07-27 | Forming method for silicon thin film for thin film transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6431466A true JPS6431466A (en) | 1989-02-01 |
Family
ID=16204373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62187345A Pending JPS6431466A (en) | 1987-07-27 | 1987-07-27 | Forming method for silicon thin film for thin film transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431466A (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04133313A (en) * | 1990-09-25 | 1992-05-07 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor |
JPH04151820A (en) * | 1990-10-15 | 1992-05-25 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
JPH04151819A (en) * | 1990-10-15 | 1992-05-25 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor |
JPH04152640A (en) * | 1990-10-17 | 1992-05-26 | Semiconductor Energy Lab Co Ltd | Manufacture of insulated-gate type semiconductor device |
JPH04221816A (en) * | 1990-12-21 | 1992-08-12 | Semiconductor Energy Lab Co Ltd | Method for forming semiconductor film |
JPH04225219A (en) * | 1990-12-26 | 1992-08-14 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor film |
EP0485233A3 (en) * | 1990-11-09 | 1994-09-21 | Semiconductor Energy Lab | A method of manufacturing insulated-gate field effect transistors |
JP2002217124A (en) * | 2001-01-15 | 2002-08-02 | Toshiba Corp | Laser annealing apparatus and its method |
US6448577B1 (en) | 1990-10-15 | 2002-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with grain boundaries |
US6486495B2 (en) | 1990-07-24 | 2002-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
US6693301B2 (en) | 1991-10-16 | 2004-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving and manufacturing the same |
US6713783B1 (en) | 1991-03-15 | 2004-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Compensating electro-optical device including thin film transistors |
US6979840B1 (en) | 1991-09-25 | 2005-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having anodized metal film between the gate wiring and drain wiring |
US7071910B1 (en) | 1991-10-16 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Electrooptical device and method of driving and manufacturing the same |
US7116302B2 (en) | 1991-10-16 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Process of operating active matrix display device having thin film transistors |
US7126161B2 (en) | 1998-10-13 | 2006-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having El layer and sealing material |
-
1987
- 1987-07-27 JP JP62187345A patent/JPS6431466A/en active Pending
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7026200B2 (en) | 1990-07-24 | 2006-04-11 | Semiconductor Energy Laboratory Co. Ltd. | Method for manufacturing a semiconductor device |
US6486495B2 (en) | 1990-07-24 | 2002-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
US6261877B1 (en) | 1990-09-11 | 2001-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing gate insulated field effect transistors |
JPH04133313A (en) * | 1990-09-25 | 1992-05-07 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor |
US6448577B1 (en) | 1990-10-15 | 2002-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with grain boundaries |
JPH04151820A (en) * | 1990-10-15 | 1992-05-25 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
JPH04151819A (en) * | 1990-10-15 | 1992-05-25 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor |
JPH04152640A (en) * | 1990-10-17 | 1992-05-26 | Semiconductor Energy Lab Co Ltd | Manufacture of insulated-gate type semiconductor device |
EP0481777B1 (en) * | 1990-10-17 | 2006-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing gate insulated field effect transistors |
EP0485233A3 (en) * | 1990-11-09 | 1994-09-21 | Semiconductor Energy Lab | A method of manufacturing insulated-gate field effect transistors |
US7507615B2 (en) | 1990-11-09 | 2009-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing gate insulated field effect transistors |
US6177302B1 (en) | 1990-11-09 | 2001-01-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a thin film transistor using multiple sputtering chambers |
US6566175B2 (en) | 1990-11-09 | 2003-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing gate insulated field effect transistors |
JPH04221816A (en) * | 1990-12-21 | 1992-08-12 | Semiconductor Energy Lab Co Ltd | Method for forming semiconductor film |
JPH04225219A (en) * | 1990-12-26 | 1992-08-14 | Semiconductor Energy Lab Co Ltd | Manufacture of semiconductor film |
US6713783B1 (en) | 1991-03-15 | 2004-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Compensating electro-optical device including thin film transistors |
US6979840B1 (en) | 1991-09-25 | 2005-12-27 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having anodized metal film between the gate wiring and drain wiring |
US7642584B2 (en) | 1991-09-25 | 2010-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
US6759680B1 (en) | 1991-10-16 | 2004-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device having thin film transistors |
US6693301B2 (en) | 1991-10-16 | 2004-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving and manufacturing the same |
US7071910B1 (en) | 1991-10-16 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Electrooptical device and method of driving and manufacturing the same |
US7116302B2 (en) | 1991-10-16 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Process of operating active matrix display device having thin film transistors |
US7126161B2 (en) | 1998-10-13 | 2006-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having El layer and sealing material |
US7449725B2 (en) | 1998-10-13 | 2008-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix EL device with sealing structure housing the device |
US8148743B2 (en) | 1998-10-13 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including semiconductor circuit made from semiconductor element and manufacturing method thereof |
US8421114B2 (en) | 1998-10-13 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix electroluminescent device within resin sealed housing |
US8969906B2 (en) | 1998-10-13 | 2015-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix electroluminescent device within resin sealed housing |
JP2002217124A (en) * | 2001-01-15 | 2002-08-02 | Toshiba Corp | Laser annealing apparatus and its method |
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