[go: up one dir, main page]

JPS6430722A - Injection molding device of multilayer printed circuit board - Google Patents

Injection molding device of multilayer printed circuit board

Info

Publication number
JPS6430722A
JPS6430722A JP18598287A JP18598287A JPS6430722A JP S6430722 A JPS6430722 A JP S6430722A JP 18598287 A JP18598287 A JP 18598287A JP 18598287 A JP18598287 A JP 18598287A JP S6430722 A JPS6430722 A JP S6430722A
Authority
JP
Japan
Prior art keywords
layer
board
cavity
molding block
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18598287A
Other languages
Japanese (ja)
Other versions
JPH0479808B2 (en
Inventor
Masakata Kaji
Hironori Koyama
Kazumitsu Omori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP18598287A priority Critical patent/JPS6430722A/en
Publication of JPS6430722A publication Critical patent/JPS6430722A/en
Publication of JPH0479808B2 publication Critical patent/JPH0479808B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1635—Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To make it possible to obtain a multilayer printed circuit board with a single equipment by one molding cycle by a method wherein a cavity to determined the shape of the board is formed on one of molds so as to successively shift a bottom molding block in response to the thicknesses of respective layers of the board, and a device, which distributes circuit films to every layer of the board, is provided on the other mold. CONSTITUTION:On a movable mold 20, a cavity C, which is the shape of the first layer of a board, is formed by a frame molding block 23 and a bottom molding block 25. On the other fixed mold 60, the circuit pattern 15 of the first layer is arranged together with a circuit film 70 by means of a circuit film feeding device 75. Molten resin constituting the board is injected through a runner nozzle 67 in the cavity C in order to form the circuit pattern 15 of the first layer simultaneously and integrally with the molding of the board layer 11 of the first layer. After that, the board layer 11 and a runner are separated from each other by opening the molds. Further, a cavity C2 of the second layer is formed by retreating the bottom molding block 25 by the thickness of a second layer board by means of a bottom molding block shifting mechanism 30. On the other fixed mold 60, the circuit pattern 16 of the second layer is distributed together with the circuit film 70.
JP18598287A 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board Granted JPS6430722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18598287A JPS6430722A (en) 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18598287A JPS6430722A (en) 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board

Publications (2)

Publication Number Publication Date
JPS6430722A true JPS6430722A (en) 1989-02-01
JPH0479808B2 JPH0479808B2 (en) 1992-12-17

Family

ID=16180288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18598287A Granted JPS6430722A (en) 1987-07-25 1987-07-25 Injection molding device of multilayer printed circuit board

Country Status (1)

Country Link
JP (1) JPS6430722A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425294A2 (en) * 1989-10-26 1991-05-02 Polyplastics Co. Ltd. Two-color molded article for use in circuit formation
FR2900861A1 (en) * 2006-02-20 2007-11-16 Yoshida Industry Co METHOD FOR MANUFACTURING A RESIN MOLDED PRODUCT USING A MOBILE MOLD AND A FIXED MOLD
CN109526146A (en) * 2017-09-19 2019-03-26 丰田自动车株式会社 The manufacturing method and its manufacturing device of wiring plate
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7475530B2 (en) 2007-03-02 2009-01-13 Textron Inc. Articulating swing-out arm

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425294A2 (en) * 1989-10-26 1991-05-02 Polyplastics Co. Ltd. Two-color molded article for use in circuit formation
FR2900861A1 (en) * 2006-02-20 2007-11-16 Yoshida Industry Co METHOD FOR MANUFACTURING A RESIN MOLDED PRODUCT USING A MOBILE MOLD AND A FIXED MOLD
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
CN109526146A (en) * 2017-09-19 2019-03-26 丰田自动车株式会社 The manufacturing method and its manufacturing device of wiring plate
CN109526146B (en) * 2017-09-19 2021-11-02 丰田自动车株式会社 Manufacturing method of wiring board and manufacturing apparatus thereof

Also Published As

Publication number Publication date
JPH0479808B2 (en) 1992-12-17

Similar Documents

Publication Publication Date Title
US3363039A (en) Injection molding processes for thermoplastic materials
US3807920A (en) Multicolor injection molding machine
CA2241509A1 (en) Injection mold for over-molding articles and an injection molding machine and method therefore
JPS57212039A (en) Injection molding method for thermoplastic plastic
ES2032962T3 (en) A METHOD OF INJECTION MOLDING AND MOLDED ITEMS PRODUCED THROUGH THE SAME.
DE69412654D1 (en) Mold for injection molding of thermoplastic
US5045268A (en) Cross-lamination injection molding
JPS57128520A (en) Production of multilayered parison
DE3878672D1 (en) METHOD FOR COATING NON-STRIPED FILMS BY INJECTION MOLDING THERMOPLASTIC PLASTICS FOR PRODUCING COMPOSED PARTS.
JPS6430722A (en) Injection molding device of multilayer printed circuit board
CA2061403A1 (en) Process for producing multilayer molded article
JPS57150551A (en) Unevenly decorated patterned container and its manufacture
US4239724A (en) Method for making valued plastic articles such as game tiles
US4073854A (en) Method of multi-material injection moulding
JPS6220008B2 (en)
JPH0699458A (en) Method for manufacturing double-sided transfer injection molded product, molding die, and injection molded product
JPS56151542A (en) Manufacture of in-mold decorated form
JPS6458519A (en) Mold apparatus for injection molding
MY137851A (en) A method of forming a switch pattern on a switch substrate
JPH01170088A (en) Manufacture of molded circuit substrate
JPH04125117A (en) Printed circuit board and its injection molding device
JPH0435915B2 (en)
JPS642050B2 (en)
JPS6327222A (en) Manufacture of foil decorating resin molded product
JPH05169488A (en) Manufacturing method of lamp lens for vehicle