JPS6429885U - - Google Patents
Info
- Publication number
- JPS6429885U JPS6429885U JP12318087U JP12318087U JPS6429885U JP S6429885 U JPS6429885 U JP S6429885U JP 12318087 U JP12318087 U JP 12318087U JP 12318087 U JP12318087 U JP 12318087U JP S6429885 U JPS6429885 U JP S6429885U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive pattern
- wire bonding
- pattern type
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Description
第１図は、この考案の一実施例を示す回路基板
の一部切欠断面図、第２図ａ，ｂは、従来の回路
基板の構成図、第３図は、上記回路基板を用いて
製作した電子機器の構成図である。
２０……回路基板、２１……半導体チツプ、２
１ａ……電極金属、２２，２３……回路基板上の
部分、２４……ボンデイングパツド、２５……金
属細線。
Figure 1 is a partially cutaway sectional view of a circuit board showing an embodiment of this invention, Figures 2a and b are configuration diagrams of a conventional circuit board, and Figure 3 is a fabrication using the above circuit board. FIG. 20... Circuit board, 21... Semiconductor chip, 2
1a...electrode metal, 22, 23...portion on the circuit board, 24...bonding pad, 25...metal thin wire.
Claims (1)
板上に面搭載型電子部品を配置するのみで所定の
電子回路が構成される導体パターン型電子回路基
板において、半導体チツプ表面の電極金属と、前
記回路基板の表面の一部とをワイヤボンデイング
により接続するために、当該回路基板のワイヤボ
ンデイング箇所にボンデイングパツドを備えたこ
とを特徴とする導体パターン型回路基板。 In a conductive pattern type electronic circuit board in which a predetermined electronic circuit is constructed by simply arranging surface-mounted electronic components on a circuit board formed in a conductive pattern shape in advance, the electrode metal on the surface of the semiconductor chip and the circuit board are 1. A conductor pattern type circuit board, characterized in that a bonding pad is provided at a wire bonding location of the circuit board in order to connect a part of the surface of the circuit board by wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123180U JPH0513011Y2 (en) | 1987-08-13 | 1987-08-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123180U JPH0513011Y2 (en) | 1987-08-13 | 1987-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6429885U true JPS6429885U (en) | 1989-02-22 |
| JPH0513011Y2 JPH0513011Y2 (en) | 1993-04-06 |
Family
ID=31371794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987123180U Expired - Lifetime JPH0513011Y2 (en) | 1987-08-13 | 1987-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513011Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963U (en) * | 1979-08-15 | 1981-03-23 | ||
| JPS58118739U (en) * | 1982-02-05 | 1983-08-13 | 富士電機株式会社 | bonding block |
| JPS58151039A (en) * | 1982-03-04 | 1983-09-08 | Denki Kagaku Kogyo Kk | Hybrid integrated circuit substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963B2 (en) * | 1975-02-21 | 1981-07-11 |
-
1987
- 1987-08-13 JP JP1987123180U patent/JPH0513011Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963U (en) * | 1979-08-15 | 1981-03-23 | ||
| JPS58118739U (en) * | 1982-02-05 | 1983-08-13 | 富士電機株式会社 | bonding block |
| JPS58151039A (en) * | 1982-03-04 | 1983-09-08 | Denki Kagaku Kogyo Kk | Hybrid integrated circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513011Y2 (en) | 1993-04-06 |