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JPS6425521A - Vapor phase epitaxy method for compound semiconductor - Google Patents

Vapor phase epitaxy method for compound semiconductor

Info

Publication number
JPS6425521A
JPS6425521A JP18254387A JP18254387A JPS6425521A JP S6425521 A JPS6425521 A JP S6425521A JP 18254387 A JP18254387 A JP 18254387A JP 18254387 A JP18254387 A JP 18254387A JP S6425521 A JPS6425521 A JP S6425521A
Authority
JP
Japan
Prior art keywords
group
gas
semiconductor substrate
organic compound
carbon susceptor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18254387A
Other languages
Japanese (ja)
Inventor
Toshiharu Kawabata
Nagataka Ishiguro
Susumu Furuike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18254387A priority Critical patent/JPS6425521A/en
Publication of JPS6425521A publication Critical patent/JPS6425521A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to form an excellent epitaxial layer, by completely separating raw materials of organic compound gas of a group II element, hydrogenated gas or organic compound gas of a group VI element or organic compound gas of a group III element, and hydrogenated gas or organic compound gas of a group V element until reaching a semiconductor substrate, and alternately supplying the material on the semiconductor substrate. CONSTITUTION:In a quartz reacting tube 1, a region from an upper flange 6 to a carbon susceptor 2 is divided into two parts with a quartz partitioning plate 17. In one part, DMZ, which is a raw material of a group II element, and carrier gas H2 are introduced. In the other part, H2Se, which is a raw material of a group VI element, and carrier gas H2 are introduced. A supporting table 8 is rotated. A semiconductor substrate 3, which is located at a deviated position from the center, is alternately exposed to the raw material gases in the two parts. The carbon susceptor 2 is heated at high frequency with a high frequency induction coil 9. Thus, the semiconductor substrate 3 is heated to a growing temperature. The DMZ and H2Se are thermally decomposed in a vapor phase by the thermal radiation from the carbon susceptor. The elements are adsorbed at every one atom layer. An Zn atom layer and an Se atom layer are alternately grown for every rotation of the carbon susceptor 2.
JP18254387A 1987-07-22 1987-07-22 Vapor phase epitaxy method for compound semiconductor Pending JPS6425521A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18254387A JPS6425521A (en) 1987-07-22 1987-07-22 Vapor phase epitaxy method for compound semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18254387A JPS6425521A (en) 1987-07-22 1987-07-22 Vapor phase epitaxy method for compound semiconductor

Publications (1)

Publication Number Publication Date
JPS6425521A true JPS6425521A (en) 1989-01-27

Family

ID=16120127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18254387A Pending JPS6425521A (en) 1987-07-22 1987-07-22 Vapor phase epitaxy method for compound semiconductor

Country Status (1)

Country Link
JP (1) JPS6425521A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008020024A (en) * 2006-07-14 2008-01-31 Piolax Inc Two piece clip

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226811A (en) * 1985-07-26 1987-02-04 Fujitsu Ltd Semiconductor manufacturing equipment
JPS6284513A (en) * 1985-10-08 1987-04-18 Mitsubishi Electric Corp Preparing apparatus for epitaxial crystal
JPS62247520A (en) * 1986-04-18 1987-10-28 Fujitsu Ltd Gas phase treatment equipment
JPS6374994A (en) * 1986-09-19 1988-04-05 Hitachi Ltd Production of thin film of semiconductor
JPS63226917A (en) * 1987-03-17 1988-09-21 Fujitsu Ltd Semiconductor vapor phase processing equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226811A (en) * 1985-07-26 1987-02-04 Fujitsu Ltd Semiconductor manufacturing equipment
JPS6284513A (en) * 1985-10-08 1987-04-18 Mitsubishi Electric Corp Preparing apparatus for epitaxial crystal
JPS62247520A (en) * 1986-04-18 1987-10-28 Fujitsu Ltd Gas phase treatment equipment
JPS6374994A (en) * 1986-09-19 1988-04-05 Hitachi Ltd Production of thin film of semiconductor
JPS63226917A (en) * 1987-03-17 1988-09-21 Fujitsu Ltd Semiconductor vapor phase processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008020024A (en) * 2006-07-14 2008-01-31 Piolax Inc Two piece clip

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