JPS6425444A - Manufacture of semiconductor device and semiconductor device - Google Patents
Manufacture of semiconductor device and semiconductor deviceInfo
- Publication number
- JPS6425444A JPS6425444A JP18155087A JP18155087A JPS6425444A JP S6425444 A JPS6425444 A JP S6425444A JP 18155087 A JP18155087 A JP 18155087A JP 18155087 A JP18155087 A JP 18155087A JP S6425444 A JPS6425444 A JP S6425444A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- semiconductor device
- sealing material
- face electrode
- extension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To improve operability in the electric connection of a capacitor by utilizing the hanging of a sealing material. CONSTITUTION:A chip capacitor 11 is set to the corner of a package 1. Thus, the lower face electrode of the capacitor 11 is electrically connected to a 'T'-shaped inner lead 3. Then, a grounding pad 6G is bonded to the upper face electrode of the capacitor 11, and a sealing material 10 is placed on a sealing face 12. An extension 10a is so formed at the material 10 as to coincide with the clamping position of the capacitor 11. Thereafter, a cap 9 is paced, and heated. The material 10 melted from the extension 10a is hung to become a lip piece 13 to be electrically connected to the upper face electrode of the capacitor 11. Then, it is grounded through a pad 6G. Since the sealing material is used as a circuit, the electric connection of the capacitor can be facilitated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18155087A JPS6425444A (en) | 1987-07-21 | 1987-07-21 | Manufacture of semiconductor device and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18155087A JPS6425444A (en) | 1987-07-21 | 1987-07-21 | Manufacture of semiconductor device and semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6425444A true JPS6425444A (en) | 1989-01-27 |
Family
ID=16102746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18155087A Pending JPS6425444A (en) | 1987-07-21 | 1987-07-21 | Manufacture of semiconductor device and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2374079A (en) * | 1999-12-24 | 2002-10-09 | Mitsubishi Pencil Co | Ink for ball-point pen and ball-point pen |
-
1987
- 1987-07-21 JP JP18155087A patent/JPS6425444A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2374079A (en) * | 1999-12-24 | 2002-10-09 | Mitsubishi Pencil Co | Ink for ball-point pen and ball-point pen |
| GB2374079B (en) * | 1999-12-24 | 2004-03-31 | Mitsubishi Pencil Co | Ink for ball-point pen and ball-point pen |
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