JPS6420730U - - Google Patents
Info
- Publication number
- JPS6420730U JPS6420730U JP11600687U JP11600687U JPS6420730U JP S6420730 U JPS6420730 U JP S6420730U JP 11600687 U JP11600687 U JP 11600687U JP 11600687 U JP11600687 U JP 11600687U JP S6420730 U JPS6420730 U JP S6420730U
- Authority
- JP
- Japan
- Prior art keywords
- bolt
- molds
- platen
- sealing device
- resin sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例による半導体装置
の樹脂封止装置を示す正面図、第２図はこの考案
の他の実施例を示す部分断面図、第３図はその要
部拡大断面図、第４図はその平面図、第５図は従
来の半導体装置の樹脂封止装置を示す正面図であ
る。
図中、１は上プラテン、２は下プラテン、４は
上型、６は下型、９は押圧ロツド、１０はボルト
、３０はスプリングである。尚、図中、同一符号
は同一、又は相当部分を示す。
Fig. 1 is a front view showing a resin sealing device for a semiconductor device according to one embodiment of this invention, Fig. 2 is a partial sectional view showing another embodiment of this invention, and Fig. 3 is an enlarged sectional view of the main part thereof. , FIG. 4 is a plan view thereof, and FIG. 5 is a front view showing a conventional resin sealing device for a semiconductor device. In the figure, 1 is an upper platen, 2 is a lower platen, 4 is an upper mold, 6 is a lower mold, 9 is a pressing rod, 10 is a bolt, and 30 is a spring. In the drawings, the same reference numerals indicate the same or equivalent parts.
Claims (1)
型と、これら上金型と下金型を平行に型締めする
上プラテン及び下プラテンと、上記上プラテン又
は上記下プラテンに部分的に取付けられ、一方の
上記金型を部分的に他方の上記金型に向つて加圧
する加圧手段とを備えた樹脂封止装置。 (2) 加圧手段は、ボルトと、このボルトと上記
一方の金型間に配置され、上記ボルトで加圧され
るロツドで構成されていることを特徴とする実用
新案登録請求の範囲第１項記載の樹脂封止装置。 (3) 加圧手段は、ボルトと、このボルトと上記
一方の金型間に配置され、上記ボルトで加圧され
る弾性体で構成されていることを特徴とする実用
新案登録請求の範囲第１項記載の樹脂封止装置。[Scope of claim for utility model registration] (1) An upper mold and a lower mold for resin-sealing a semiconductor device, an upper platen and a lower platen for clamping the upper mold and the lower mold in parallel, and the above-mentioned upper mold. A resin sealing device comprising a pressurizing means that is partially attached to a platen or the lower platen and partially pressurizes one of the molds toward the other of the molds. (2) Claim 1 of the utility model registration characterized in that the pressurizing means is composed of a bolt and a rod placed between the bolt and one of the molds and pressurized by the bolt. The resin sealing device described in Section 2. (3) The pressing means is comprised of a bolt and an elastic body placed between the bolt and one of the molds and pressurized by the bolt. The resin sealing device according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11600687U JPS6420730U (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11600687U JPS6420730U (en) | 1987-07-28 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420730U true JPS6420730U (en) | 1989-02-01 |
Family
ID=31358170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11600687U Pending JPS6420730U (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420730U (en) |
-
1987
- 1987-07-28 JP JP11600687U patent/JPS6420730U/ja active Pending