JPS6420216A - Photocurable resin composition - Google Patents
Photocurable resin compositionInfo
- Publication number
- JPS6420216A JPS6420216A JP17632487A JP17632487A JPS6420216A JP S6420216 A JPS6420216 A JP S6420216A JP 17632487 A JP17632487 A JP 17632487A JP 17632487 A JP17632487 A JP 17632487A JP S6420216 A JPS6420216 A JP S6420216A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- epoxy resin
- photopolymerization initiator
- component
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 4
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000003999 initiator Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 abstract 1
- FAIHWYDOMLEEQJ-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenylethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.OCCOCC(O)C1=CC=CC=C1 FAIHWYDOMLEEQJ-UHFFFAOYSA-N 0.000 abstract 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 230000001351 cycling effect Effects 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
PURPOSE:To obtain the title low-modulus composition excellent in adhesion to metals, ceramics,etc. and heat cycling resistance, by mixing a photocurable rubber-modified epoxy resin with a specified reactive compound and a photopolymerization initiator. CONSTITUTION:100pts.wt. telechelic photocurable rubber-modified epoxy resin (A) having an MW of 100-500, modified with a carboxylic acid-terminated rubber and having photo/radical-polymerizable functional groups on molecular ends, is mixed with 20-230pts.wt. reactive compound (A) other than component A, comprising a compound (a) having at least one dicyclopentenyl group and/or isobornyl group (e.g., dicyclopentenyl acrylate) and, optionally, at most 3pts.wt., per pt.wt. component (a), other reactive compounds (b) (e.g., phenyl diethylene glycol methacrylate) and 0.05-15pts.wt. photopolymerization initiator (C) (e.g., hydroxyisobutyrophenone) which can form radicals by irradiation with light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17632487A JPS6420216A (en) | 1987-07-15 | 1987-07-15 | Photocurable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17632487A JPS6420216A (en) | 1987-07-15 | 1987-07-15 | Photocurable resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420216A true JPS6420216A (en) | 1989-01-24 |
Family
ID=16011594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17632487A Pending JPS6420216A (en) | 1987-07-15 | 1987-07-15 | Photocurable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420216A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02298507A (en) * | 1989-05-15 | 1990-12-10 | Nippon Kayaku Co Ltd | Resin composition |
| JPH09236809A (en) * | 1995-12-27 | 1997-09-09 | Mitsui Toatsu Chem Inc | Liquid crystal sealing resin composition |
| WO1999058606A1 (en) * | 1998-05-13 | 1999-11-18 | Universite De Liege | Method for reinforcing thermosetting resins with isobornyl acrylate or methacrylate polymers |
| US6048587A (en) * | 1998-10-01 | 2000-04-11 | Ricon Resins, Inc. | Water-dispersible, radiation and thermally-curable polymeric compositions |
| JP2007268663A (en) * | 2006-03-31 | 2007-10-18 | Nachi Fujikoshi Corp | Synchro sleeve inner diameter broaching tool |
| JP2018178040A (en) * | 2017-04-20 | 2018-11-15 | アイカ工業株式会社 | Photocurable resin composition |
| CN111072871A (en) * | 2019-12-24 | 2020-04-28 | 无锡市腰果新材料有限公司 | High-temperature-resistant SLA (SLA-like three-dimensional) 3D printing photocuring material and preparation method thereof |
| WO2024075480A1 (en) * | 2022-10-04 | 2024-04-11 | 三菱瓦斯化学株式会社 | Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container |
-
1987
- 1987-07-15 JP JP17632487A patent/JPS6420216A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02298507A (en) * | 1989-05-15 | 1990-12-10 | Nippon Kayaku Co Ltd | Resin composition |
| JPH09236809A (en) * | 1995-12-27 | 1997-09-09 | Mitsui Toatsu Chem Inc | Liquid crystal sealing resin composition |
| WO1999058606A1 (en) * | 1998-05-13 | 1999-11-18 | Universite De Liege | Method for reinforcing thermosetting resins with isobornyl acrylate or methacrylate polymers |
| US6048587A (en) * | 1998-10-01 | 2000-04-11 | Ricon Resins, Inc. | Water-dispersible, radiation and thermally-curable polymeric compositions |
| JP2007268663A (en) * | 2006-03-31 | 2007-10-18 | Nachi Fujikoshi Corp | Synchro sleeve inner diameter broaching tool |
| JP2018178040A (en) * | 2017-04-20 | 2018-11-15 | アイカ工業株式会社 | Photocurable resin composition |
| CN111072871A (en) * | 2019-12-24 | 2020-04-28 | 无锡市腰果新材料有限公司 | High-temperature-resistant SLA (SLA-like three-dimensional) 3D printing photocuring material and preparation method thereof |
| WO2024075480A1 (en) * | 2022-10-04 | 2024-04-11 | 三菱瓦斯化学株式会社 | Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container |
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