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JPS6414942A - Resin sealed semiconductor integrated circuit device - Google Patents

Resin sealed semiconductor integrated circuit device

Info

Publication number
JPS6414942A
JPS6414942A JP62171591A JP17159187A JPS6414942A JP S6414942 A JPS6414942 A JP S6414942A JP 62171591 A JP62171591 A JP 62171591A JP 17159187 A JP17159187 A JP 17159187A JP S6414942 A JPS6414942 A JP S6414942A
Authority
JP
Japan
Prior art keywords
leads
heat
chip
heat transfer
transfer body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62171591A
Other languages
Japanese (ja)
Inventor
Isamu Yamamoto
Yuji Sawamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62171591A priority Critical patent/JPS6414942A/en
Publication of JPS6414942A publication Critical patent/JPS6414942A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the heat radiating characteristic from an IC chip, by providing a heat transfer body comprising a material, whose heat conductivity is higher than that of a molding resin material between a supporting plate, on which a chip is mounted, and leads. CONSTITUTION:Leads 3 are taken out of a package main body 5 formed by resin packaging. A heat transfer body 10 comprising a material, whose heat conductivity is higher than that of a molding resin, is provided between the leads 3 and a supporting plate (die pad or heat sink) 2 on the side of an IC chip 1. As the heat transfer body 10, a material, which supports the lower part of the supporting body 2 and has a plate shape, is used. The outer edge of the body 10 is connected to said leads 3. Since the heat transfer body 10 comprising the high heat conductivity material is provided, the heat, which is yielded in the resin sealed IC chip 1, is transferred to the leads 3 from the supporting plate 2 adequately and positively.
JP62171591A 1987-07-08 1987-07-08 Resin sealed semiconductor integrated circuit device Pending JPS6414942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62171591A JPS6414942A (en) 1987-07-08 1987-07-08 Resin sealed semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62171591A JPS6414942A (en) 1987-07-08 1987-07-08 Resin sealed semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6414942A true JPS6414942A (en) 1989-01-19

Family

ID=15925998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62171591A Pending JPS6414942A (en) 1987-07-08 1987-07-08 Resin sealed semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6414942A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992004730A1 (en) * 1990-09-10 1992-03-19 Fujitsu Limited Semiconductor device and its manufacturing process
US5428246A (en) * 1990-07-09 1995-06-27 Lsi Logic Products Gmbh Highly integrated electronic component with heat-conductive plate
US5753977A (en) * 1996-03-22 1998-05-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and lead frame therefor
US5797474A (en) * 1995-06-30 1998-08-25 Aisin Seiki Kabushiki Kaisha Clutch disc
KR100253260B1 (en) * 1997-04-24 2000-04-15 곽철우 Heat dissipating plate for use in semiconductor package and semiconductor package process using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5428246A (en) * 1990-07-09 1995-06-27 Lsi Logic Products Gmbh Highly integrated electronic component with heat-conductive plate
WO1992004730A1 (en) * 1990-09-10 1992-03-19 Fujitsu Limited Semiconductor device and its manufacturing process
US5440170A (en) * 1990-09-10 1995-08-08 Fujitsu Limited Semiconductor device having a die pad with rounded edges and its manufacturing method
US5797474A (en) * 1995-06-30 1998-08-25 Aisin Seiki Kabushiki Kaisha Clutch disc
US5753977A (en) * 1996-03-22 1998-05-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and lead frame therefor
KR100253260B1 (en) * 1997-04-24 2000-04-15 곽철우 Heat dissipating plate for use in semiconductor package and semiconductor package process using the same

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