JPS6412379U - - Google Patents
Info
- Publication number
- JPS6412379U JPS6412379U JP10732287U JP10732287U JPS6412379U JP S6412379 U JPS6412379 U JP S6412379U JP 10732287 U JP10732287 U JP 10732287U JP 10732287 U JP10732287 U JP 10732287U JP S6412379 U JPS6412379 U JP S6412379U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- laminate
- notches
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
Landscapes
- Coils Of Transformers For General Uses (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図Ａ及びＢはそれぞれ本考案の実施例を示
す一部上面図及び正面図、第２図Ａ及びＢはそれ
ぞれ第１図の実施例で用いる第１及び第２のプリ
ント配線板の基板を示す平面図、第３図は第１図
の実施例において基板を積層した状態を示す上面
図、第４図は基板の積層の仕方の変形例を示す上
面図、第５図は基板に樹脂を含浸させる方法を説
明する断面図、第６図は本考案の多層プリント配
線板を応用してトランスを構成した例を示す分解
斜視図、第７図は第６図のトランスにおける各プ
リント配線板のプリント配線パターンとプリント
配線板相互間を接続するピンとの関係を示す分解
斜視図、第８図Ａ及びＢは従来例を示す一部上面
図及び正面図である。
１０Ａ，１０Ａ１〜１０Ａ４……第１のプリン
ト配線板、１０Ｂ，１０Ｂ１〜１０Ｂ４……第２
のプリント配線板、１１……積層体、１２Ａ，１
２Ｂ……絶縁基板、１３Ａ，１３Ｂ……切欠部、
１５……樹脂充填用凹部、１６，１６Ａ，１６Ａ
′，１６Ｂ…ピン、１７……絶縁樹脂。
FIGS. 1A and B are partial top and front views showing an embodiment of the present invention, respectively, and FIGS. 2A and B are substrates of first and second printed wiring boards used in the embodiment of FIG. 1, respectively. 3 is a top view showing a state in which the substrates are stacked in the embodiment shown in FIG. 1, FIG. 4 is a top view showing a modified example of how the substrates are stacked, and FIG. FIG. 6 is an exploded perspective view showing an example of a transformer constructed by applying the multilayer printed wiring board of the present invention, and FIG. 7 shows each printed wiring board in the transformer of FIG. 6. FIGS. 8A and 8B are an exploded perspective view showing the relationship between the printed wiring pattern and the pins connecting the printed wiring boards, and FIGS. 8A and 8B are a partial top view and front view of a conventional example. 10A, 10A 1 to 10A 4 ... first printed wiring board, 10B, 10B 1 to 10B 4 ... second
printed wiring board, 11... laminate, 12A, 1
2B...Insulating substrate, 13A, 13B...Notch,
15...resin filling recess, 16, 16A, 16A
', 16B...Pin, 17...Insulating resin.
Claims (1)
にプリント配線を形成して該プリント配線の接続
端子部を所定の切欠部に臨ませてなるプリント配
線板を複数枚積層して積層体を構成し、前記積層
体を構成するプリント配線板の相応する切欠部内
に導電性のピンを嵌合させて、該ピンを前記プリ
ント配線の所定の接続端子部に電気的に接続する
ことにより前記複数のプリント配線板間を接続し
てなる多層プリント配線板において、 前記積層体は、積層端面に樹脂充填用凹部が形
成されるようにプリント配線板の端部の位置を相
対的にずらせて積層したものからなり、 前記積層体の樹脂充填用凹部内に樹脂が充填さ
れて前記積層体が一体化されていることを特徴と
する多層プリント配線板。 (2) 前記複数のプリント配線板は交互に位置を
ずらして積層されていて、隣り合うプリント配線
板相互間にそれぞれ樹脂充填用凹部が形成されて
いる実用新案登録請求の範囲第１項に記載の多層
プリント配線板。 (3) 隣合うプリント配線板の切欠部は前記積層
体の異なる端部側に配置され、 前記積層体の同じ端部側に配置された各切欠部
は相応する他の切欠部と積層方向に整合するよう
に設けられ、 互いに整合する切欠部内にそれぞれ前記ピンが
嵌合されていることを特徴とする実用新案登録請
求の範囲第１項または第２項に記載の多層プリン
ト配線板。 (4) 各プリント配線板に設けられたプリント配
線が所定のターン数のコイルを構成している実用
新案登録請求の範囲第１項ないし第３項のいずれ
か１つに記載の多層プリント配線板。 (5) 前記複数のプリント配線板はトランスの１
次コイルを構成するプリント配線を有する１次コ
イル形成用プリント配線板と、トランスの２次コ
イルを構成するプリント配線を有する２次コイル
形成用プリント配線板とからなり、 前記１次コイル形成用プリント配線板と２次コ
イル形成用プリント配線板とが交互に積層されて
いることを特徴とする実用新案登録請求の範囲第
３項に記載の多層プリント配線板。 (6) 前記積層体を構成する複数のプリント配線
板はそれぞれの両面にプリント配線を有し、該複
数のプリント配線板が絶縁シートを介して積層さ
れている実用新案登録請求の範囲第１項ないし第
５項のいずれか１つに記載の多層プリント配線板
。[Claims for Utility Model Registration] (1) A printed wiring board in which printed wiring is formed on an insulating substrate having a predetermined number of notches at the end, and the connecting terminals of the printed wiring are exposed to the predetermined notches. A plurality of sheets are laminated to form a laminate, a conductive pin is fitted into a corresponding notch of a printed wiring board constituting the laminate, and the pin is connected to a predetermined connection terminal portion of the printed wiring. In a multilayer printed wiring board in which the plurality of printed wiring boards are connected by electrical connection, the laminate is formed at an end of the printed wiring board such that a resin filling recess is formed on the end face of the laminate. What is claimed is: 1. A multilayer printed wiring board, characterized in that the multilayer printed wiring board is made up of laminated layers with relative positions shifted, and the laminated body is integrated by filling a resin filling recess of the laminated body with resin. (2) The utility model registration according to claim 1, wherein the plurality of printed wiring boards are stacked with alternate positions shifted, and resin filling recesses are formed between adjacent printed wiring boards, respectively. multilayer printed wiring board. (3) The notches of adjacent printed wiring boards are arranged on different end sides of the laminate, and each notch arranged on the same end side of the laminate is in contact with other corresponding notches in the stacking direction. The multilayer printed wiring board according to claim 1 or 2, wherein the pins are fitted into notches that are aligned with each other and are aligned with each other. (4) The multilayer printed wiring board according to any one of claims 1 to 3 of the utility model registration claims, wherein the printed wiring provided on each printed wiring board constitutes a coil with a predetermined number of turns. . (5) The plurality of printed wiring boards are one of the transformers.
It consists of a printed wiring board for forming a primary coil having printed wiring constituting a secondary coil, and a printed wiring board for forming a secondary coil having printed wiring constituting a secondary coil of a transformer, The multilayer printed wiring board according to claim 3, wherein the wiring board and the printed wiring board for forming a secondary coil are alternately laminated. (6) A plurality of printed wiring boards constituting the laminate each have printed wiring on both sides, and the plurality of printed wiring boards are laminated with an insulating sheet interposed therebetween.Claim 1 of the Utility Model Registration Claim The multilayer printed wiring board according to any one of items 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10732287U JPH047581Y2 (en) | 1987-07-13 | 1987-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10732287U JPH047581Y2 (en) | 1987-07-13 | 1987-07-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6412379U true JPS6412379U (en) | 1989-01-23 |
| JPH047581Y2 JPH047581Y2 (en) | 1992-02-27 |
Family
ID=31341631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10732287U Expired JPH047581Y2 (en) | 1987-07-13 | 1987-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH047581Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03283505A (en) * | 1990-03-30 | 1991-12-13 | Multisource Technol Corp | Transformer assembly and transformer bobbin assembly |
| JP2012243426A (en) * | 2011-05-16 | 2012-12-10 | Tyco Electronics Japan Kk | Circuit board and electrical connector |
| JP2014045130A (en) * | 2012-08-28 | 2014-03-13 | Kyocer Slc Technologies Corp | Wiring board and probe card using the same |
-
1987
- 1987-07-13 JP JP10732287U patent/JPH047581Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03283505A (en) * | 1990-03-30 | 1991-12-13 | Multisource Technol Corp | Transformer assembly and transformer bobbin assembly |
| JP2012243426A (en) * | 2011-05-16 | 2012-12-10 | Tyco Electronics Japan Kk | Circuit board and electrical connector |
| JP2014045130A (en) * | 2012-08-28 | 2014-03-13 | Kyocer Slc Technologies Corp | Wiring board and probe card using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH047581Y2 (en) | 1992-02-27 |
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