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JPS6412119B2 - - Google Patents

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Publication number
JPS6412119B2
JPS6412119B2 JP56030747A JP3074781A JPS6412119B2 JP S6412119 B2 JPS6412119 B2 JP S6412119B2 JP 56030747 A JP56030747 A JP 56030747A JP 3074781 A JP3074781 A JP 3074781A JP S6412119 B2 JPS6412119 B2 JP S6412119B2
Authority
JP
Japan
Prior art keywords
chip
chip component
intermediate station
board
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56030747A
Other languages
Japanese (ja)
Other versions
JPS57145394A (en
Inventor
Kazuhiro Mori
Eiji Ichitenmanya
Kurahei Tanaka
Akira Kabeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56030747A priority Critical patent/JPS57145394A/en
Publication of JPS57145394A publication Critical patent/JPS57145394A/en
Publication of JPS6412119B2 publication Critical patent/JPS6412119B2/ja
Granted legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 本発明は、微小電子部品等の電子回路基板等へ
の装着装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for mounting microelectronic components onto electronic circuit boards and the like.

従来、チツプ型抵抗・チツプ型積層コンデンサ
ーに代表される微小電子部品(以下、チツプ部品
と呼ぶ)を、電子回路を構成する基板上に装着す
る装置としては第1図に示すようなものがあつ
た。101はチツプ部品であり、102は振動に
よりバラ状のチツプ部品101を整列供給する振
動式フイーダーである。103はチツプ部品10
1を吸着するノズルであり、104は前記ノズル
103の中心にチツプ部品101を位置規正する
位置規正爪である。
Conventionally, there has been a device shown in Figure 1 for mounting microelectronic components (hereinafter referred to as chip components), such as chip-type resistors and chip-type multilayer capacitors, onto a substrate that constitutes an electronic circuit. Ta. 101 is a chip component, and 102 is a vibrating feeder that aligns and supplies the chip components 101 in the form of individual chips by vibration. 103 is chip part 10
1, and 104 is a position adjustment claw that adjusts the position of the chip component 101 at the center of the nozzle 103.

105は、上記ノズル103を有し、上下動お
よび前後動可能に支持された移載部である。
Reference numeral 105 denotes a transfer section that includes the nozzle 103 and is supported so as to be movable up and down and back and forth.

106は、チツプ部品101を装着する基板で
あり、107は前記基板106を支持する支持台
である。
106 is a board on which the chip component 101 is mounted, and 107 is a support stand that supports the board 106.

上記構成において、振動式フイーダー102に
より、整列供給されたチツプ部品101はノズル
103の吸着動作により、ノズル103の先端吸
着面に吸着され、移載部105が基板106の装
着位置まで移動する間に位置規正爪104で位置
規正される。
In the above configuration, the chip parts 101 that are aligned and fed by the vibrating feeder 102 are attracted to the tip suction surface of the nozzle 103 by the suction operation of the nozzle 103, and while the transfer section 105 moves to the mounting position of the substrate 106, The position is regulated by a position regulating claw 104.

しかし、上記従来例では、チツプ部品101の
移載動作中に、位置規正が可能であるが、位置規
正が正しくなされているかどうかの確認やチツプ
部品101が所定形状を有しているかの確認、お
よびチツプ部品101が固有の電気特性を有して
いるかの検出が同時にできないという欠点を有
し、又中間に検査用のステーシヨンを設けること
も考えられるが、種々の形状の電子部品に適用で
きない問題を有していた。
However, in the conventional example described above, it is possible to adjust the position during the transfer operation of the chip component 101, but it is necessary to check whether the position adjustment is performed correctly or to check whether the chip component 101 has a predetermined shape. It also has the disadvantage that it is not possible to simultaneously detect whether the chip component 101 has unique electrical characteristics.Also, it is conceivable to provide an inspection station in the middle, but there is a problem that it cannot be applied to electronic components of various shapes. It had

本発明は、上記従来の欠点を解消するもので、
以下にその実施例を第2図〜第3図にもとづいて
説明する。
The present invention solves the above-mentioned conventional drawbacks,
The embodiment will be described below based on FIGS. 2 and 3.

1はチツプ部品であり、2は前記チツプ部品1
を整列供給する振動式フイーダーである。3は前
記複数の振動式フイーダー2を支持し、ネジ棒4
を介して、駆動モータ5により第3図矢印E方向
に水平移動可能なテーブルで振動式フイーダー2
とともに部品供給部を形成している。
1 is a chip part; 2 is the chip part 1;
It is a vibratory feeder that aligns and feeds. 3 supports the plurality of vibrating feeders 2, and a threaded rod 4
Vibrating feeder 2 is a table that can be moved horizontally in the direction of arrow E in FIG. 3 by a drive motor 5.
Together, they form a parts supply section.

7aはチツプ部品供給位置A―Aからチツプ部
品1を吸着取り出し、チツプ部品規正位置B―B
まで移載するためのノズルであり、7bはチツプ
部品1をチツプ部品規正位置B―Bより装置位置
C―Cまで移載するためのノズルである。チツプ
部品供給位置A―Aとチツプ部品規正位置B―B
間の距離と、チツプ部品規正位置B―Bと、チツ
プ部品装置位置C―C間の距離とは等しく配置さ
れている。
7a, the chip component 1 is suctioned and taken out from the chip component supply position A-A, and the chip component 1 is taken out from the chip component regulation position B-B.
7b is a nozzle for transferring the chip component 1 from the chip component regulation position BB to the device position CC. Chip parts supply position A-A and chip parts regulation position B-B
The distance between the chip component regulation position BB and the chip component device position CC are equal.

8は前記ノズル7a,7bをチツプ部品供給位
置A―Aと、チツプ部品規正位置B―B間の距離
に等しいピツチで支持し、移載中心D―D上でK
→J→K→L→M→L→Kの順序で前後動および
上下動する移載部である。ここでKは初期位置、
Jは供給位置、Mは装着位置である。
8 supports the nozzles 7a and 7b at a pitch equal to the distance between the chip component supply position A-A and the chip component regulation position B-B, and
This is a transfer unit that moves back and forth and up and down in the order of →J→K→L→M→L→K. Here K is the initial position,
J is the supply position and M is the mounting position.

9は振動フイーダー2からノズル7により吸着
移載されたチツプ部品1を装着方向に位置決め
し、また、リードを有するミニモールド型トラン
ジスタチツプ部品等のリード成形をした上、さら
に、チツプ部品1の固有の電気特性チエツクを同
時に行なう中間ステーシヨンである。
Reference numeral 9 positions the chip component 1 that has been suctioned and transferred from the vibration feeder 2 by the nozzle 7 in the mounting direction, molds the lead into a mini-mold type transistor chip component, etc., and further molds the chip component 1's unique characteristics. This is an intermediate station that simultaneously checks the electrical characteristics of both.

10は、チツプ部品1の位置規正、成形および
電気特性チエツクを行なう規正ブロツクである。
11は規正されたチツプ部品1を装着方向に回転
させるための回転板であり、前記回転板11はベ
ルト12を介してサーボモータ13により、所定
角度回転する。
Reference numeral 10 denotes a regulating block for positioning, molding, and checking electrical characteristics of the chip component 1.
Reference numeral 11 denotes a rotary plate for rotating the regulated chip component 1 in the mounting direction, and the rotary plate 11 is rotated by a predetermined angle by a servo motor 13 via a belt 12.

第3図に示すごとく、規正ブロツク10を備え
た回転板は、本発明における電子部品の位置規正
手段を構成するものである。
As shown in FIG. 3, a rotary plate equipped with a regulating block 10 constitutes a means for regulating the position of electronic components in the present invention.

14はテルビカメラであり、これによりチツプ
部品1の位置決め状況をモニターテレビ15に映
像させるとともに、パターン認識により、位置決
め精度を再確認および修正する。
Reference numeral 14 denotes a TV camera, which displays the positioning status of the chip component 1 on a monitor television 15, and uses pattern recognition to reconfirm and correct the positioning accuracy.

16は開閉自在の穴であり、パターン認識によ
り再度位置規正ズレや特性不良の不良品が見い出
された場合は、その不良のチツプ部品1を穴16
から下へ落とす。
Reference numeral 16 is a hole that can be opened and closed, and if a defective product with misalignment or poor characteristics is found again through pattern recognition, the defective chip part 1 is inserted into the hole 16.
drop it down.

17は、移動テーブルであり、チツプ部品1の
形状に合わせて位置規正手段である複数の回転板
11a,11bを選択可能にするため第3図矢印
F方向に移動可能になつている。
Reference numeral 17 denotes a movable table, which is movable in the direction of arrow F in FIG. 3 to enable selection of a plurality of rotary plates 11a, 11b, which are position regulating means, according to the shape of the chip component 1.

18は前記移動テーブル17を矢印Fの方向に
水平移動させるためのネジ棒であり、19は前記
ネジ棒18と連結している駆動モータである。
18 is a threaded rod for horizontally moving the moving table 17 in the direction of arrow F, and 19 is a drive motor connected to the threaded rod 18.

20は基板6を支持し、前記ノズル7bとの装
着位置関係を相対的に変化させるテーブルであ
り、第3図の矢印G方向および矢印H方向に同時
に水平移動が可能であり基板支持部を構成してい
る。
Reference numeral 20 denotes a table that supports the substrate 6 and relatively changes the mounting positional relationship with the nozzle 7b, and is capable of horizontal movement simultaneously in the direction of arrow G and the direction of arrow H in FIG. 3, and constitutes a substrate support section. are doing.

次に動作説明を行なう。 Next, the operation will be explained.

振動式フイーダー2により整列供給されたチツ
プ部品1は、前記振動式フイーダー2のチツプ部
品供給位置A―Aで、ノズル7aにより吸着さ
れ、移動部8の上下動および前後動動作により、
中間ステーシヨン9に設けられた回転板11aの
中心に載置される。この動作を同期して、すでに
中間ステーシヨン9で位置決め並びに特性チエツ
ク等がなされたチツプ部品1は、ノズル7bによ
り吸着され、基板6の所定の装着位置へ装着され
る。中間ステーシヨン9には複数形状のチツプ部
品1の位置決めおよび特性チエツク等が可能なよ
うに、複数の回転板11a,11bが設けられて
おり、前記回転板11a,11bの選択は移載部
8の移載動作中に行なわれる。
The chip parts 1 that are aligned and fed by the vibrating feeder 2 are sucked by the nozzle 7a at the chip part supply position A-A of the vibrating feeder 2, and are sucked by the nozzle 7a by the vertical movement and back-and-forth movement of the moving part 8.
It is placed at the center of a rotary plate 11a provided on the intermediate station 9. In synchronization with this operation, the chip component 1, which has already been positioned and checked for characteristics at the intermediate station 9, is sucked by the nozzle 7b and mounted to a predetermined mounting position on the board 6. The intermediate station 9 is provided with a plurality of rotary plates 11a and 11b so as to enable positioning and characteristic checking of chip parts 1 of a plurality of shapes. This is done during the transfer operation.

以上の基中動作を連続して行なうことにより、
チツプ部品1の位置決めや成形および特性チエツ
クが装着動作の時間内で行なうことが可能とな
る。
By performing the above basic movements continuously,
Positioning, molding, and characteristic checking of the chip part 1 can be performed within the time of the mounting operation.

以上、本発明によれば、チツプ部品供給部と装
着基板との間に中間ステーシヨンを設け、この前
後2者間において、2つのノズルを移動させるこ
とにより、中間ステーシヨンでのチツプ部品の位
置規正がロス時間なく行なえる。
As described above, according to the present invention, an intermediate station is provided between the chip component supply unit and the mounting board, and by moving two nozzles between the front and back, the position of the chip component can be adjusted at the intermediate station. It can be done without wasting time.

また、中間ステーシヨンでは、異なる形状を有
するチツプ部品の位置規正も同時に可能なよう
に、規正部が複数設けられており、ここでは、位
置規正のみならず、チツプ部品のリードの成形、
固有の電気特性のチエツク、装着角度の設定を同
時に行なうことができる。
In addition, the intermediate station is provided with a plurality of regulating parts so that the positions of chip parts having different shapes can be simultaneously adjusted.
You can check the unique electrical characteristics and set the mounting angle at the same time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の電子部品装着装置の概略図、
第2図は本発明の一実施例における電子部品装着
装置の側面図、第3図は同平面図である。 1…テツプ部品、2…振動式フイーダ、3…テ
ーブル、6…基板、7a,7b…ノズル、8…移
載部、9…中間ステーシヨン、20…基板支持
部。
FIG. 1 is a schematic diagram of a conventional electronic component mounting device.
FIG. 2 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a plan view thereof. DESCRIPTION OF SYMBOLS 1...Tip part, 2...Vibrating feeder, 3...Table, 6...Substrate, 7a, 7b...Nozzle, 8...Transfer part, 9...Intermediate station, 20...Substrate support part.

Claims (1)

【特許請求の範囲】[Claims] 1 電子部品を一列に順次供給する部品供給装置
を複数列有する電子部品供給部と、前記電子部品
の位置決めをする位置規正手段及び検査手段から
なる中間ステーシヨンと、基板を支持し、かつ、
基板の相対位置を変化させる基板支持部と、前記
電子部品供給部、中間ステーシヨン、基板支持部
の相対距離と等しいピツチでおかれ、電子部品の
移載および装置をなす2つのノズルを有し、一平
面上に前後動および上下動する移載部とを有し、
前記中間ステーシヨンは移動テーブルに複数の位
置規正手段を設け、前記ノズルの下降位置に前記
位置規正手段を選択的に位置させるため前記移動
テーブルを移動する駆動モータを備えた電子部品
装着装置。
1. An electronic component supply section having a plurality of rows of component supply devices that sequentially supply electronic components in one row, an intermediate station comprising positioning means and inspection means for positioning the electronic components, and supporting a board, and
A board support part that changes the relative position of the board, and two nozzles arranged at a pitch equal to the relative distance between the electronic component supply part, the intermediate station, and the board support part, and which serve as a device for transferring and loading electronic components; It has a transfer part that moves back and forth and up and down on one plane,
The intermediate station includes a plurality of position regulating means on a movable table, and a drive motor for moving the movable table to selectively position the position regulating means at the lowered position of the nozzle.
JP56030747A 1981-03-03 1981-03-03 Device for mounting electronic part Granted JPS57145394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56030747A JPS57145394A (en) 1981-03-03 1981-03-03 Device for mounting electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56030747A JPS57145394A (en) 1981-03-03 1981-03-03 Device for mounting electronic part

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63220953A Division JPH01138800A (en) 1988-09-02 1988-09-02 Device for installing electronic component

Publications (2)

Publication Number Publication Date
JPS57145394A JPS57145394A (en) 1982-09-08
JPS6412119B2 true JPS6412119B2 (en) 1989-02-28

Family

ID=12312266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56030747A Granted JPS57145394A (en) 1981-03-03 1981-03-03 Device for mounting electronic part

Country Status (1)

Country Link
JP (1) JPS57145394A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313021U (en) * 1989-06-23 1991-02-08
JPH03129820U (en) * 1990-04-10 1991-12-26

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57148393A (en) * 1981-03-10 1982-09-13 Ckd Corp Device for disposing chip type circuit element
JPS59132700U (en) * 1983-02-25 1984-09-05 シ−ケ−デイ株式会社 Chip parts feeding device
JPS61264788A (en) * 1985-05-20 1986-11-22 ティーディーケイ株式会社 Chip part mounting machine
JPS6171693A (en) * 1984-09-17 1986-04-12 ティーディーケイ株式会社 Method of mounting chip part
JPH07105623B2 (en) * 1985-05-20 1995-11-13 松下電器産業株式会社 Parts mounting device
JPS62114289A (en) * 1985-11-14 1987-05-26 松下電器産業株式会社 Mounting of electronic parts and apparatus for the same
JPS62214692A (en) * 1986-03-15 1987-09-21 ティーディーケイ株式会社 Electronic parts mounting apparatus
JPS63174395A (en) * 1987-01-14 1988-07-18 三洋電機株式会社 Automatic mounter
US5023544A (en) * 1987-04-03 1991-06-11 Universal Instruments Corporation Extended input and testing of electrical components for onsertion machines
JPH07105624B2 (en) * 1987-10-30 1995-11-13 松下電器産業株式会社 Electronic component mounting machine
JPH0639515Y2 (en) * 1988-06-17 1994-10-12 富士通テン株式会社 Circuit component mounting device
JPH0815238B2 (en) * 1991-05-22 1996-02-14 松下電器産業株式会社 Electronic component automatic mounting device
JPH0815237B2 (en) * 1991-05-22 1996-02-14 松下電器産業株式会社 Electronic component automatic mounting device
JP4983580B2 (en) * 2007-12-03 2012-07-25 パナソニック株式会社 Component mounting equipment
JP4853467B2 (en) * 2007-12-03 2012-01-11 パナソニック株式会社 Component mounting equipment
CN101884089B (en) 2007-12-03 2012-02-08 松下电器产业株式会社 chip mounting system
JP5240908B2 (en) * 2008-06-30 2013-07-17 京セラクリスタルデバイス株式会社 Piezoelectric vibration element mounting device
JP6797596B2 (en) * 2016-08-10 2020-12-09 株式会社Fuji Parts feeder and manufacturing work machine
JP7304536B2 (en) * 2019-02-27 2023-07-07 パナソニックIpマネジメント株式会社 Component mounting device and method
JP7078698B2 (en) * 2020-12-02 2022-05-31 株式会社Fuji Electrical characteristic measurement method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314411Y2 (en) * 1974-10-19 1978-04-17
JPS51145859A (en) * 1975-06-10 1976-12-15 Matsushita Electric Ind Co Ltd Automatic assembling machine for smalllsized parts
JPS5565441A (en) * 1978-11-09 1980-05-16 Toshiba Corp Direct mounting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313021U (en) * 1989-06-23 1991-02-08
JPH03129820U (en) * 1990-04-10 1991-12-26

Also Published As

Publication number Publication date
JPS57145394A (en) 1982-09-08

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