JPS6390870A - Metallic base circuit board - Google Patents
Metallic base circuit boardInfo
- Publication number
- JPS6390870A JPS6390870A JP61236585A JP23658586A JPS6390870A JP S6390870 A JPS6390870 A JP S6390870A JP 61236585 A JP61236585 A JP 61236585A JP 23658586 A JP23658586 A JP 23658586A JP S6390870 A JPS6390870 A JP S6390870A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- light
- circuit board
- emitting element
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H10W72/884—
-
- H10W72/931—
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は′１気機器、゛部子機器、計鼻礪器、通信機器
等に用いられる金に４ベース配線板に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a four-base metal wiring board used in 1-metal equipment, component equipment, gauge nosepieces, communication equipment, and the like.
従来の表示用配線板は平面状配線板の上く形成した回路
パターンに発光素子を実装して論るため、発光素子の光
が配線板面に対し垂直方向に集光されず１８０度方向に
散乱するので見掛上の輝度が向上しなり欠点があった。In conventional display wiring boards, light-emitting elements are mounted on a circuit pattern formed on a flat wiring board, so the light from the light-emitting elements is not focused perpendicularly to the wiring board surface, but is focused at 180 degrees. Since the light is scattered, the apparent brightness is improved, which is a drawback.
本発明の目的とするところは集光効果の高論金寓ベース
配線板を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a high-performance metal base wiring board with a light-concentrating effect.
本発明は金属板の上面及び又は下面に樹脂層を介して、
回路パターンを有する金属ベース配線基板の樹脂層所要
位置に、凹所を形成し該凹部表面に金１層を形成後、発
光素子を実装したことを特徴とする金属ベース配線板の
ため、発光素子の光が配線板面に対し垂直方向に集光さ
れるため集光効果を着るしく向とせしめることができた
もので、以下本発明の詳細な説明する。The present invention includes a resin layer on the upper and/or lower surface of the metal plate,
A metal-based wiring board is characterized in that a recess is formed at a desired position in a resin layer of a metal-based wiring board having a circuit pattern, and a light-emitting element is mounted after forming a layer of gold on the surface of the recess. Since the light is focused in a direction perpendicular to the wiring board surface, the light focusing effect can be improved.The present invention will be described in detail below.
本発明にｍ−る金＠板としてはアルミニウム、鉤、鉄、
ニッケル、亜鉛等のボ独、合金等からなる金属板全般を
用いることができる。樹脂、１としてはフェノール樹脂
、クレゾール樹脂、エポキシ樹ｊ旧、不飽和ポリエステ
ル樹脂、メラミン樹脂、ポリイミド、ポリブタジェン、
ポリアミド、ポリアミドイミド、ポリスルフォン、ポリ
ブチレンテレフタレート、ポリエーテルエーテルケトン
、弗化樹脂等の単独、変性物、混合物等を塗布した樹脂
層や樹脂シート、樹脂フィルム或はこれらの樹脂フェス
をガラス、アスベスト等の無機繊維やポリエステル、ポ
リアミド、ポリビニルアルコール、アクリル等の［８合
成繊維や木綿等の天然繊維からなる織布、不織布、マッ
ト或は紙又はこれらの組合せ基材等に含浸、乾燥させた
樹脂含浸基材を用層ることができるが、好ましくは樹脂
含浸基材を用いることが樹脂層の厚み精度を向上させる
こと力Ｓできるので望まし論ことである。回路パターン
トシては鉤、アルミニウム、鉄、ニッケル、亜鉛等の単
独、合金等からなる金属箔や更に必要に応じて接着剤層
を設けた金Ｆ４Ｔｉから工、−，チング等で形成された
ものである。かくして得られた金属ベース配線基板の樹
脂層所要位置に凹部を形成するが凹部形状は三日月状等
の半円形凹部であることがより集光効果が大きく望まし
いことである。Examples of the gold plate used in the present invention include aluminum, hook, iron,
Any metal plate made of metals, alloys, etc. of nickel, zinc, etc. can be used. Resin 1 includes phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene,
Glass, asbestos, resin layer, resin sheet, resin film, or resin face coated with polyamide, polyamideimide, polysulfone, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, or mixtures. Resin impregnated and dried into woven fabrics, non-woven fabrics, mats, paper, or combinations of these, made of inorganic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, etc., synthetic fibers, natural fibers such as cotton, etc. Although an impregnated base material can be used, it is preferable to use a resin-impregnated base material since this improves the thickness accuracy of the resin layer. The circuit pattern is made of metal foil made of aluminum, iron, nickel, zinc, etc. alone or an alloy, or gold F4Ti with an adhesive layer if necessary. It is. Recesses are formed at desired positions in the resin layer of the thus obtained metal base wiring board, and it is preferable that the recesses have a semicircular recess shape, such as a crescent shape, for a greater light-condensing effect.
又、凹部表面には金、二りケル、銀、クロム、銅等の金
属層を形成するが好ましくは金、クロム、＠、二噌ケル
等の光反射効率のよ−金属層を鍍金等で形成することが
より集光効果が大となり望ましｂことである０発光素子
の実装はワイヤポンディング、ダイボンドペースト等圧
よる常法で行なうことができる。In addition, a metal layer of gold, silver, silver, copper, etc. is formed on the surface of the recess, but it is preferable to use a metal layer such as gold, chromium, silver, copper, etc., which has a high light reflection efficiency, by plating or the like. Mounting of the zero light emitting element, which is desirable since forming the light emitting element will increase the light condensing effect, can be carried out by a conventional method such as wire bonding or die bonding paste using equal pressure.
以下本発明を実施例にもとづｂで説明する。The present invention will be explained below based on Examples.
実施例
第１図は本発明の一実施例を示す闇路断面図である。第
１図に示すように厚さ１１ｒ１１の珪素鋼板１の下面に
厚さ０．１ ｆｌのエポキシ樹脂含浸ガラス布３枚２を
介して厚さ０．０３５ｇｍの銅箔を載置した積層体を成
形圧力４ｏＫｖｃ１１．１６５℃で６０分間積層成形し
て金属ベース配線基板を偽、該基板にニーＩチング等を
施して回路パターン３を作成した。次に回路パターンの
な一樹脂１に深さ０．２１の半円形凹部４をドリルで設
けた後、半円形凹部表面に金波金５を形成してから発光
素子６をダイボンドペースト７、ワイヤボンデング８で
実装して金属ベース配線板を得た。Embodiment FIG. 1 is a cross-sectional view of a dark road showing an embodiment of the present invention. As shown in Fig. 1, a laminate in which copper foil with a thickness of 0.035 gm was placed on the lower surface of a silicon steel plate 1 with a thickness of 11r11 through three pieces of epoxy resin-impregnated glass cloth 2 with a thickness of 0.1 fl was placed. Lamination molding was performed at a molding pressure of 40Kvc and 11.165°C for 60 minutes to form a metal base wiring board, and the board was subjected to knee I-etching and the like to create a circuit pattern 3. Next, a semicircular recess 4 with a depth of 0.21 is provided in the resin 1 of the circuit pattern using a drill, a gold wave metal 5 is formed on the surface of the semicircular recess, and a light emitting element 6 is attached using die bond paste 7 and wire bonding. A metal base wiring board was obtained by mounting with Dengue 8.
比較例
実施例と同じ回路パターンを有する金属ベース配線基板
表面に発光素子をそのままダイボンドペースト、ワイヤ
ポンディングで実装して金、％ ベース配緑板を得た。Comparative Example A light-emitting element was directly mounted on the surface of a metal-based wiring board having the same circuit pattern as in Example using die bond paste and wire bonding to obtain a gold-based green panel.
実施例の金属ベース配線板の発光素子の光は従来例のも
のより５０％集光効果がよく、本発明の金属ベース配線
板の優れて偽ることを確認した。The light condensing effect of the light emitting elements of the metal base wiring board of the example was 50% better than that of the conventional example, confirming the superiority of the metal base wiring board of the present invention.
第１図は本発明の一実施例を示す簡略断面図である。
１は金ＭＭ、２は起Ｈ旨層、３は回路パターン、４は凹
部、５は凹部の金４１−１６は発光素子、７はダイボン
ドペースト、８はワイヤポンディングである。
第１図FIG. 1 is a simplified sectional view showing one embodiment of the present invention. 1 is gold MM, 2 is a H-effect layer, 3 is a circuit pattern, 4 is a recess, 5 is gold 41-16 in the recess is a light emitting element, 7 is a die bonding paste, and 8 is wire bonding. Figure 1
Claims (3)
路パターンを有する金属ベース配線基板の樹脂層所要位
置に、凹部を形成し該凹部表面に金属層を形成後、発光
素子を実装したことを特徴とする金属ベース配線板。(1) A recess is formed on the upper and/or lower surface of the metal plate at the required position of the resin layer of a metal base wiring board having a circuit pattern through a resin layer, and after forming a metal layer on the surface of the recess, a light emitting element is mounted. A metal-based wiring board characterized by:
許請求の範囲第１項記載の金属ベース配線板。(2) The metal base wiring board according to claim 1, wherein the resin layer is a resin-impregnated base material.
求の範囲第１項、第２項記載の金属ベース配線板。(3) The metal base wiring board according to claims 1 and 2, wherein the recess is a semicircular recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61236585A JPS6390870A (en) | 1986-10-03 | 1986-10-03 | Metallic base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61236585A JPS6390870A (en) | 1986-10-03 | 1986-10-03 | Metallic base circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6390870A true JPS6390870A (en) | 1988-04-21 |
| JPH0428152B2 JPH0428152B2 (en) | 1992-05-13 |
Family
ID=17002812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61236585A Granted JPS6390870A (en) | 1986-10-03 | 1986-10-03 | Metallic base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005029594A1 (en) * | 2003-09-22 | 2005-03-31 | Fujian Joinluck Electronic Enterprise Co., Ltd. | A structure of light emitting diode |
| JP2006237156A (en) * | 2005-02-23 | 2006-09-07 | Lg Electronics Inc | Light source device and manufacturing method thereof |
-
1986
- 1986-10-03 JP JP61236585A patent/JPS6390870A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005029594A1 (en) * | 2003-09-22 | 2005-03-31 | Fujian Joinluck Electronic Enterprise Co., Ltd. | A structure of light emitting diode |
| JP2006237156A (en) * | 2005-02-23 | 2006-09-07 | Lg Electronics Inc | Light source device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0428152B2 (en) | 1992-05-13 |
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