JPS6387785A - Printed board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board, and more particularly, to a printed circuit board on which electrical components such as semiconductor devices, resistors, and capacitors are mounted.

[Conventional technology]

FIG. 3 is a sectional view showing a situation in which a semiconductor device is mounted on an example of a conventional printed circuit board.

Conventionally, this type of printed circuit board has a cylindrical hole 12 into which a lead 21 is inserted in order to mount a semiconductor device 20 on a circuit board body 11, and a conductive printed pattern 13 is formed on the inner wall of this hole 12. , this print pattern 1
3 and the lead 21 of the component coming out of the cylindrical hole 12 are soldered with solder 14 to mount the component.

[Problem that the invention seeks to solve]

In the conventional printed circuit board mentioned above, the hole into which the component lead is inserted and the printed pattern on the inner wall of the hole are cylindrical, so there is a possibility that the component lead inserted into the hole may not come into contact with the printed pattern. Another drawback is that if left as is, the leads will move inside the hole, so the leads must be fixed with solder.

[Means for solving problems]

The printed circuit board of the present invention has a large diameter on the side facing the electrical component into which the leads of an electrical component such as a semiconductor device are inserted, and a small diameter on the opposite side to the surface, which is slightly thinner than the thickness of the lead, and has an inner wall. It has a conical hole with a conductive pattern on it.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1 and 2 are cross-sectional views showing the state in which electrical components are mounted in the first and second embodiments of the present invention, respectively.

The first embodiment is a board main body 1. It has a hole 2 and a printed pattern 3. A hole 2 for mounting a semiconductor device 20 on the substrate body 1 and inserting its leads 21 is provided. The hole 2 has a conical shape with a large diameter on the surface facing the semiconductor device 20 and a small diameter on the opposite surface.
A conductive printed pattern 3 is applied to its entire inner wall.

At this time, the diameter of the small diameter part of the conical hole 2 is
With the printed pattern 3 attached, the cross-sectional area of the lead 21 is made slightly smaller than that of the lead 21.

In this embodiment with such a configuration, if the semiconductor device 20 is mounted on the substrate body 1 and the leads 21 are pushed into the conical hole 2 with force, the conductive printed pattern 3 will fit into the hole 2. In order to tighten the lead 21 at the small diameter part of the
Since the leads 21 are fixed in contact with the printed pattern 3, there is no need for soldering, and the soldering process can be omitted.

The second embodiment comprises a substrate body 4, a hole 5 and a printed pattern 6. The shape of the hole provided in the substrate body 4 is conical as in the first embodiment, but compared to the first embodiment, the length of the small diameter portion is made longer to make it cylindrical. be. With the conductive printed pattern 6 attached, the size of the diameter of the small diameter cylindrical part of the hole 5 is determined by the resistor 3 to be mounted.
The cross-sectional area of the lead 31 is made slightly thinner than that of the lead 31 of No. 0.

According to the second embodiment having such a configuration, the lead 31 is tightened at the small diameter cylindrical portion of the hole 5, the resistor 30 is fixed without soldering, and the lead 31 and the printed pattern 6 are fixed. Since the contact portion is long, the conductivity and fixing properties are further improved compared to the first embodiment.

In addition, in the first and second embodiments described above, the semiconductor device 20 and the resistor 30 are illustrated as the components to be mounted, but the present invention is not limited to these, and the same applies to any other electrical component with leads. Mounting can be fixed.

〔Effect of the invention〕

As explained above, the present invention provides a conical hole in the board body, a conductive pattern on the inner wall, and a small diameter portion that is slightly smaller than the cross-sectional area of the lead of the mounted component. Since the conductive pattern tightens the lead, the lead comes into contact with the pattern and is fixed without soldering, which has the effect of allowing components to be easily mounted and fixed on the board body.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views showing the state in which electrical components are mounted on the first and second embodiments of the present invention, respectively, and FIG. 3 shows the state in which a semiconductor device is mounted on an example of a conventional printed circuit board. FIG. 1.4.11... Board body, 2.5.12... Hole,
3.6.13... Print pattern, 14... Solder, 20... Semiconductor device, 21.3'l... Lead,
30・・Resistance. Agent: Patent Attorney Susumu Uchihara

Claims (1)

[Claims] A cone into which electrical component leads such as semiconductor devices are inserted, the surface facing the electrical component has a large diameter, the opposite surface has a small diameter slightly thinner than the thickness of the lead, and a conductive pattern is provided on the inner wall. A printed circuit board characterized by having a shaped hole.